Reference Title Downloads Closing date Circulation date Voting / Comments parallel vote Procedure Result - CLC/FprTR 62258-4:2010 Semiconductor die products - Part 4: Questionnaire for die users and suppliers http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:41743 2010-11-22 2010-11-08 Procedure Result No Procedure Result - CLC/FprTR 62258-4:2010 Semiconductor die products - Part 4: Questionnaire for die users and suppliers http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:54390 2011-10-14 2011-09-09 Procedure Result No Procedure Result - CLC/prTR 62258-4:2006 Semiconductor die products - Part 4: Questionnaire for die users and suppliers http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:18416 2007-05-07 2007-04-20 Procedure Result No Procedure Result - CLC/prTR 62258-7:2006 Semiconductor die products - Part 7: XML schema for data exchange http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:18425 2006-11-14 2006-10-31 Procedure Result No Procedure Result - CLC/prTR 62258-8:2007 Semiconductor die products - Part 8: EXPRESS model schema for data exchange http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:17140 2008-02-18 2008-01-25 Procedure Result No Procedure Result - EN 60749-19:2003/FprA1:2009 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:23760 2010-01-25 2010-01-11 Procedure Result No Procedure Result - EN 60749-19:2003/FprA1:2009 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:25691 2010-06-28 2010-06-11 Procedure Result No Procedure Result - EN 60749-23:2004/FprA1:2009 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:34646 2010-09-20 2010-09-03 Procedure Result No Procedure Result - EN 60749-23:2004/FprA1:2009 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:26601 2010-01-25 2010-01-11 Procedure Result No Procedure Result - EN 60749-27:2006/FprA1:2011 Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:48298 2012-02-21 2012-01-31 Procedure Result No Procedure Result - EN 60749-27:2006/FprA1:2012 Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:55354 2012-09-10 2012-08-20 Procedure Result No Procedure Result - EN 60749-30:2005/FprA1:2009 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:26602 2010-01-25 2010-01-11 Procedure Result No Procedure Result - EN 60749-30:2005/FprA1:2009 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:37979 2010-09-20 2010-09-03 Procedure Result No Procedure Result - EN 60749-32:2003/FprA1:2009 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:23761 2010-01-25 2010-01-11 Procedure Result No Procedure Result - EN 60749-32:2003/FprA1:2009 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:25692 2010-06-28 2010-06-11 Procedure Result No Procedure Result - FprEN 60749-15:2009 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:20718 2009-10-12 2009-09-28 Procedure Result No Procedure Result - FprEN 60749-15:2010 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:30767 2010-11-01 2010-10-18 Procedure Result No Procedure Result - FprEN 60749-20-1:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:15717 2009-04-07 2009-03-24 Procedure Result No Procedure Result - FprEN 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:15466 2008-12-02 2008-11-18 Procedure Result No Procedure Result - FprEN 60749-21:2009 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:26113 2010-02-22 2010-02-08 Procedure Result No Procedure Result - FprEN 60749-21:2011 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:37041 2011-04-11 2011-03-21 Procedure Result No Procedure Result - FprEN 60749-29:2009 Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:26374 2010-02-22 2010-02-08 Procedure Result No Procedure Result - FprEN 60749-29:2011 Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:37042 2011-04-11 2011-03-21 Procedure Result No Procedure Result - FprEN 60749-34:2009 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:21185 2010-03-01 2010-02-15 Procedure Result No Procedure Result - FprEN 60749-34:2010 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:30766 2010-11-01 2010-10-18 Procedure Result No Procedure Result - FprEN 60749-40:2010 Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:32914 2010-10-04 2010-09-20 Procedure Result No Procedure Result - FprEN 60749-40:2011 Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:39985 2011-07-18 2011-06-27 Procedure Result No Procedure Result - FprEN 60749-7:2009 Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:23762 2010-01-25 2010-01-11 Procedure Result No Procedure Result - FprEN 60749-7:2011 Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:39309 2011-06-06 2011-05-16 Procedure Result No Procedure Result - FprEN 62047-4:2008 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:26307 2008-08-25 2008-08-11 Procedure Result No Procedure Result - FprEN 62258-1:2008 Semiconductor die products - Part 1: Procurement and use http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:25361 2009-01-31 2008-11-28 Procedure Result No Procedure Result - FprEN 62258-2:2009 Semiconductor die products - Part 2: Exchange data formats http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:23137 2010-02-08 2010-01-25 Procedure Result No Procedure Result - FprEN 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:37980 2011-05-09 2011-04-18 Procedure Result No Procedure Result - FprEN 62374-1:2008 Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:20908 2009-04-03 2009-03-24 Procedure Result No Procedure Result - FprEN 62374-1:2010 Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:30335 2010-09-20 2010-09-07 Procedure Result No Procedure Result - FprEN 62415:2008 Semiconductor devices - Constant current electromigration test http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:14997 2009-03-16 2009-03-02 Procedure Result No Procedure Result - FprEN 62415:2010 Semiconductor devices - Constant current electromigration test http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:22650 2010-05-24 2010-05-10 Procedure Result No Procedure Result - FprEN 62416:2008 Semiconductor devices - Hot carrier test on MOS transistors http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:15033 2009-03-16 2009-03-02 Procedure Result No Procedure Result - FprEN 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:14148 2010-04-20 2010-04-06 Procedure Result No Procedure Result - FprEN 62417:2008 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs) http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:14998 2009-03-16 2009-03-02 Procedure Result No Procedure Result - FprEN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs) http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:21272 2010-04-20 2010-04-06 Procedure Result No Procedure Result - FprEN 62418:2009 Semiconductor devices - Metallization stress void test http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:15034 2009-08-03 2009-07-20 Procedure Result No Procedure Result - FprEN 62418:2010 Semiconductor devices - Metallization stress void test http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:13954 2010-04-20 2010-04-06 Procedure Result No Procedure Result - FprEN 62483:2012 Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:54814 2012-10-01 2012-09-10 Procedure Result No Procedure Result - prEN 60749-20-1:2007 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:16805 2007-12-17 2007-12-04 Procedure Result No Procedure Result - prEN 60749-20:2007 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:16958 2007-12-17 2007-12-04 Procedure Result No Procedure Result - prEN 60749-26:2006 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:20089 2006-06-20 2006-06-06 Procedure Result No Procedure Result - prEN 60749-27:2006 Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:20090 2006-06-20 2006-06-06 Procedure Result No Procedure Result - prEN 60749-35:2006 Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:19974 2006-07-17 2006-07-03 Procedure Result No Procedure Result - prEN 60749-37:2005 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:19857 2006-06-06 2006-05-23 Procedure Result No Procedure Result - prEN 60749-37:2007 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:17618 2008-01-07 2007-12-18 Procedure Result No Procedure Result - prEN 60749-38:2006 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:18408 2007-01-29 2007-01-15 Procedure Result No Procedure Result - prEN 60749-38:2007 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:17649 2008-01-28 2008-01-14 Procedure Result No Procedure Result - prEN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:20091 2006-06-20 2006-06-06 Procedure Result No Procedure Result - prEN 62047-1:2005 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:20313 2006-05-15 2006-05-03 Procedure Result No Procedure Result - prEN 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:19975 2006-08-07 2006-07-24 Procedure Result No Procedure Result - prEN 62047-3:2006 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:19976 2006-08-07 2006-07-24 Procedure Result No Procedure Result - prEN 62047-4:2007 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:18245 2007-10-22 2007-10-05 Procedure Result No Procedure Result - prEN 62373:2006 Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET) http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:20096 2006-06-26 2006-06-12 Procedure Result No Procedure Result - prEN 62374:2006 Semiconductor devices - Time Dependent Dielectric Breakdown (TDDB) test for gate dielectric films http://cmc09app.cenorm.be:8080/dyn/www/f?p=104:200:861498808285055::::P200_DOC_ID:18451 2007-02-01 2007-01-18 Procedure Result No