International Standards and Conformity Assessment for all electrical, electronic and related technologies

CLC/BTTF 97-1

Known Good Die (Disbanded)

 
 
  •  

CLC/BTTF 97-1 Scope

CLC/BTTF 97-1

To prepare standards of data requirement for unpackaged and minimally packaged semiconductor die, with or without connection structures.

The requirements include those of general nature, vocabulary, mechanical material and connectivity.

Specific requirements include test, quality, handling, thermal and electrical simulation.

Further information

Secretariat
Switzerland

 Illustration: Tools

Tools (members only)

Collaboration Tool
pdf