Reference Date Title Language EN 60749-13:2002 2002-08-16 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere     EN 60749-14:2003 2003-10-17 Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)     EN 60749-33:2004 2004-04-16 Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave     EN 60749-15:2003 2003-04-17 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices     EN 60749-3:2002 2002-08-13 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination     EN 60749-11:2002 2002-08-16 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method     CECC 265 001:1998 1998-09-03 Technology Approval Schedule: Film and hybrid integrated circuits     EN 60749-23:2004 2004-04-16 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life     EN 60749-24:2004 2004-04-16 Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST     EN 60749-34:2004 2004-04-16 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling     EN 60749-30:2005 2005-03-01 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing     EN 62047-3:2006 2006-09-20 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing     EN 60749-39:2006 2006-08-25 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components     EN 60749-35:2006 2006-09-20 Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components     EN 62373:2006 2006-08-10 Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET)     EN 62374:2007 2007-10-19 Semiconductor devices - Time Dependent Dielectric Breakdown (TDDB) test for gate dielectric films     EN 60749-37:2008 2008-04-11 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer     EN 62047-1:2006 2006-06-16 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions     EN 60749-27:2006 2006-08-25 Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)     EN 60749-26:2006 2006-08-25 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)     EN 60749-6:2002 2002-08-13 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature     EN 60749-2:2002 2002-08-13 Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure     EN 60749-7:2002 2002-08-14 Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases     EN 60749-4:2002 2002-08-13 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)     EN 60749-1:2003 2003-06-20 Semiconductor devices - Mechanical and climatic test methods - Part 1: General     EN 60749-9:2002 2002-08-14 Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking     EN 60749-10:2002 2002-08-14 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock     EN 60749-12:2002 2002-08-16 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency     EN 60749-5:2003 2003-03-13 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test     EN 60749-21:2005 2005-02-15 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability     EN 60749-29:2003 2003-12-15 Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test     EN 60749-25:2003 2003-09-18 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling     EN 60749-8:2003 2003-06-20 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing     EN 60749-22:2003 2003-06-20 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength     EN 60749-31:2003 2003-06-20 Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)     EN 60749-32:2003 2003-06-20 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)     EN 60749-36:2003 2003-04-17 Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state     EN 60749-18:2003 2003-02-07 Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)     EN 60749-19:2003 2003-04-17 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength     EN 60749-17:2003 2003-04-17 Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation     EN 165000-5:1997 1997-12-15 Film and hybrid integrated circuits - Part 5: Procedure for qualification approval     CLC/TR 62258-4:2007 2007-10-05 Semiconductor die products - Part 4: Questionnaire for die users and suppliers     EN 62047-4:2010 2010-10-15 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS     EN 62047-2:2006 2006-09-20 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials     EN 60749-38:2008 2008-05-15 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory     CLC/TR 62258-7:2007 2007-10-05 Semiconductor die products - Part 7: XML schema for data exchange     EN 62415:2010 2010-06-04 Semiconductor devices - Constant current electromigration test     EN 62416:2010 2010-06-04 Semiconductor devices - Hot carrier test on MOS transistors     EN 62417:2010 2010-05-07 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)     EN 62258-1:2010 2010-10-15 Semiconductor die products - Part 1: Procurement and use     EN 62374-1:2010 2010-11-19 Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers     EN 60749-20:2009 2009-11-26 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat     EN 60749-20-1:2009 2009-06-05 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat     CLC/TR 62258-8:2008 2008-08-22 Semiconductor die products - Part 8: EXPRESS model schema for data exchange     EN 60749-15:2010 2010-12-10 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices     EN 62418:2010 2010-07-09 Semiconductor devices - Metallization stress void test     CLC/TR 62258-4:2013 2013-01-11 Semiconductor die products - Part 4: Questionnaire for die users and suppliers     EN 60749-40:2011 2011-09-02 Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge     EN 62258-2:2011 2011-07-08 Semiconductor die products - Part 2: Exchange data formats     EN 60749-21:2011 2011-08-19 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability     EN 60749-29:2011 2011-08-19 Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test     EN 60749-34:2010 2010-12-10 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling     EN 60749-19:2003/A1:2010 2010-09-03 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength     EN 60749-23:2004/A1:2011 2011-03-04 Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life     EN 60749-32:2003/A1:2010 2010-09-03 Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)     EN 60749-30:2005/A1:2011 2011-07-08 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing     EN 60749-7:2011 2011-09-09 Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases     EN 60749-27:2006/A1:2012 2012-11-09 Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)     EN 62374-1:2010/AC:2011 2011-04-01 Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers     EN 60749-15:2010/AC:2011 2011-02-04 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices     EN 60749-16:2003 2003-04-03 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)