Reference Date Title Language EN 61188-5-6:2003 2003-04-04 Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides     EN 61249-5-4:1996 1996-08-09 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks     EN 61192-1:2003 2003-03-25 Workmanship requirements for soldered electronic assemblies - Part 1: General     EN 61760-2:2007 2007-06-28 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide     EN 61188-5-8:2008 2008-03-21 Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)     EN 123600:1996 1996-12-18 Sectional Specification: Flex-rigid multilayer printed boards with through connections     EN 62090:2003 2003-02-18 Product package labels for electronic components using bar code and two- dimensional symbologies     EN 60068-2-58:2004 2004-10-01 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)     EN 61188-5-5:2007 2007-11-23 Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides     EN 61191-1:1998 1998-10-28 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies     EN 61249-2-13:1999 1999-04-14 Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper clad     EN 62326-1:2002 2002-06-12 Printed boards - Part 1: Generic specification     EN 61192-2:2003 2003-04-11 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies     EN 123400:1992 1992-05-01 Sectional Specification: Flexible printed boards without through connections     EN 61189-5:2006 2006-09-29 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies     EN 60068-2-54:2006 2006-08-07 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method     EN 61188-5-3:2007 2007-11-23 Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides     EN 61249-2-22:2005 2005-03-09 Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad     EN 61249-4-2:2005 2005-10-27 Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability     EN 61249-4-5:2005 2005-10-27 Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability     EN 61760-1:2006 2006-07-14 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)     EN 61249-2-23:2005 2005-03-09 Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad     EN 61249-4-11:2005 2005-10-27 Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability     EN 61249-4-12:2005 2005-10-27 Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability     EN 61249-2-26:2005 2005-03-09 Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials, clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad     EN 60068-2-21:2006 2006-07-20 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices     EN 61192-5:2007 2007-06-27 Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies     EN 60068-2-69:2007 2007-06-22 Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method     EN 61192-4:2003 2003-03-25 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies     EN 61189-3:2008 2008-01-08 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)     EN 61249-4-1:2008 2008-05-23 Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability     EN 60068-2-82:2007 2007-06-22 Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components     EN 61190-1-3:2007 2007-06-28 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications     EN 61190-1-2:2007 2007-06-28 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly     EN 60194:2006 2006-07-14 Printed board design, manufacture and assembly - Terms and definitions     EN 61190-1-1:2002 2002-06-14 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly     EN 61188-5-2:2003 2003-09-23 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components     EN 61192-3:2003 2003-02-20 Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies     EN 61249-2-9:2003 2003-05-09 Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine, modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad     EN 61249-2-10:2003 2003-05-09 Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials, clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad     EN 61249-2-11:2003 2003-12-23 Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad     EN 61249-2-21:2003 2003-12-23 Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad     EN 61249-2-6:2003 2003-12-23 Materials for printed boards and other interconnecting structures - Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad     EN 61249-2-7:2002 2002-06-12 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad     EN 61249-2-1:2005 2005-03-09 Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad     EN 61249-2-2:2005 2005-03-09 Materials for printed boards and other interconnecting structures - Part 2-2: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad     EN 62137:2004 2004-08-05 Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN     EN 61191-3:1998 1998-10-28 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies     EN 61188-1-2:1998 1998-08-10 Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance     CECC 200 025:1998 1998-05-04 Process Assessment Schedule: Printed board assembly facilities     EN 61249-3-4:1999 1999-04-15 Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film     EN 61249-2-19:2002 2002-02-20 Materials for printed boards and other interconnecting structures - Part 2-19: Reinforced base materials, clad and unclad - Epoxide cross-plied linear fibreglass-reinforced laminated sheets of defined flammability (vertical burning test) copper clad     EN 61249-3-3:1999 1999-04-15 Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film     EN 61249-2-12:1999 1999-04-14 Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad     EN 61249-3-5:1999 1999-04-15 Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films     EN 60068-2-77:1999 1999-04-01 Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock     EN 61191-2:1998 1998-10-28 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies     EN 61189-1:1997/A1:2001 2001-10-30 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: General test methods and methodology     EN 61249-2-4:2002 2002-03-15 Materials for printed boards and other interconnecting structures - Part 2-4: Reinforced base materials, clad and unclad - Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad     EN 61249-2-18:2002 2002-03-14 Materials for printed boards and other interconnecting structures - Part 2-18: Reinforced base materials, clad and unclad - Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper-clad     EN 61188-5-1:2002 2002-10-22 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements     EN 61249-5-1:1996 1996-01-11 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)     EN 61249-8-7:1996 1996-08-09 Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks     EN 62326-4-1:1997 1997-01-15 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability Detail Specification - Performance levels A, B and C     CECC 23 200-801:1998 1998-02-27 Capability Detail Specification: Single and double-sided printed boards with plated-through holes     CECC 23 300-801:1998 1998-02-27 Capability Detail Specification: Multi-layer printed boards     CECC 23 600-801:1998 1998-02-27 Capability Detail Specification: Flex-rigid multilayer printed boards with through connections     CECC 23 700-801:1998 1998-02-27 Capability Detail Specification: Flex-rigid double-sided printed boards with through connections     CECC 23 800-801:1998 1998-02-27 Capability Detail Specification: Flexible multilayer printed boards with through connections     CECC 23 100-801:1998 1998-02-27 Capability Detail Specification: Single and double-sided printed boards with plain holes     EN 61249-8-8:1997 1997-08-08 Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings     EN 61189-1:1997 1997-04-25 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: General test methods and methodology     EN 61188-1-1:1997 1997-10-17 Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies     EN 62326-4:1997 1997-01-15 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification     EN 60068-2-44:1995 1995-03-17 Environmental testing - Part 2: Tests - Guidance on Test T: Soldering     EN 123200:1992 1992-05-01 Sectional Specification: Single and double sided printed boards with plated-through holes     EN 123200:1992/A1:1995 1995-08-09 Sectional Specification: Single and double sided printed boards with plated-through holes     EN 123300:1992/A1:1995 1995-08-09 Sectional Specification: Multilayer printed boards     EN 123400:1992/A2:1995 1995-08-09 Sectional Specification: Flexible printed boards without through connections     EN 123500:1992 1992-05-01 Sectional Specification: Flexible printed boards with through connections     EN 123500:1992/A2:1995 1995-08-09 Sectional Specification: Flexible printed boards with through connections     EN 123100:1992 1992-05-01 Sectional Specification: Single and double-sided printed boards with plain holes     EN 123100:1992/A1:1995 1995-08-09 Sectional Specification: Single and double-sided printed boards with plain holes     EN 61249-7-1:1995 1995-07-18 Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/Invar/copper     EN 123400-800:1992 1992-05-15 Capability Detail Specification: Flexible printed boards without through connections     EN 123500-800:1992 1992-05-15 Capability Detail Specification: Flexible printed boards with through connections     EN 61249-2-8:2003 2003-05-09 Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials, clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad     EN 62137-1-1:2007 2007-08-31 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test     EN 62137-1-2:2007 2007-08-31 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test     EN 61193-2:2007 2007-11-22 Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages     EN 123800:1996 1996-12-18 Sectional Specification: Flexible multilayer printed boards with through connections     EN 60097:1993 1993-01-12 Grid systems for printed circuits     EN 61191-4:1998 1998-10-28 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies     CECC 210 003:1996 1996-10-15 Technology Approval Schedule: Printed boards     EN 123300:1992 1992-05-01 Sectional Specification: Multilayer printed boards     EN 123700:1996 1996-12-18 Sectional Specification: Flex-rigid double sided printed board with through connections     EN 61249-2-35:2009 2009-03-11 Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly     EN 61249-2-36:2009 2009-03-11 Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly     EN 61249-2-37:2009 2009-03-11 Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly     EN 61249-2-38:2009 2009-03-11 Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly     EN 61249-4-14:2009 2009-06-30 Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly     EN 61249-4-15:2009 2009-06-30 Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly     EN 61249-4-16:2009 2009-06-30 Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly     EN 61249-4-17:2009 2009-06-30 Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly     EN 62421:2007 2007-10-31 Electronics assembly technology - Electronic modules     EN 60068-2-20:2008 2008-09-25 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads     EN 61189-6:2006 2006-08-18 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies     EN 61190-1-3:2007/A1:2010 2010-09-10 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications     EN 62137-1-4:2009 2009-02-20 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test     EN 61191-6:2010 2010-04-16 Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method     EN 62137-1-5:2009 2009-05-06 Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test     EN 61189-2:2006 2006-09-29 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures     EN 61249-2-5:2003 2003-12-23 Materials for printed boards and other interconnecting structures - Part 2-5: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core / woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad     EN 61188-5-4:2007 2007-11-23 Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides     EN 62137-1-3:2009 2009-02-20 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test     EN 62137-3:2012 2012-01-20 Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints     EN 61249-2-27:2013 2013-03-22 Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad     EN 61249-2-40:2013 2013-03-22 Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly     EN 60068-2-83:2011 2011-10-14 Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste     EN 61182-2-2:2012 2012-06-22 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description     EN 61760-3:2010 2010-04-23 Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering     EN 61249-2-41:2010 2010-05-07 Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly     EN 61249-2-42:2010 2010-05-07 Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly     EN 61193-3:2013 2013-04-26 Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing     EN 61188-7:2009 2009-07-09 Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction     EN 61193-1:2002 2002-02-15 Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies     EN 61249-2-30:2013 2013-03-22 Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad     EN 61249-2-39:2013 2013-03-22 Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly