Reference Date Title Language EN 61967-4:2002/A1:2006 2006-02-28 Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions - 1 ohm/150 ohm direct coupling method     EN 61967-6:2002 2002-10-08 Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method     EN 165000-1:1996 1996-04-16 Film and hybrid integrated circuits - Part 1: Generic specification - Capability approval procedure     EN 165000-2:1996 1996-04-16 Film and hybrid integrated circuits - Part 2: Internal visual inspection and special tests     EN 190116:1993 1993-08-15 Family Specification: AC MOS Digital integrated circuits     EN 61964:1999 1999-05-31 Integrated circuits - Memory devices pin configurations     CECC 90 104:1990 1990-01-01 Family Specification: C. MOS digital integrated circuits - Series 4000 B and 4000 UB (with A1)     EN 190103:1994 1994-05-15 Family Specification: Digital integrated TTL low power Schottky circuits - Series 54LS, 64LS, 74LS, 84LS     EN 61967-2:2005 2005-10-25 Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method     EN 62132-1:2006 2006-02-10 Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 1: General conditions and definitions     EN 62132-4:2006 2006-05-19 Integrated circuits - Measurement of electromagnetic immunity 150 kHz to 1 GHz - Part 4: Direct RF power injection method     EN 62132-5:2006 2006-01-27 Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 5: Workbench Faraday cage method     EN 62132-3:2007 2007-10-10 Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 3: Bulk current injection (BCI) method     EN 61967-6:2002/A1:2008 2008-05-14 Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method     EN 61967-4:2002 2002-06-14 Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions - 1 ohm/150 ohm direct coupling method     EN 61967-5:2003 2003-04-23 Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 5: Measurement of conducted emissions - Workbench Faraday Cage method     EN 61943:1999 1999-08-09 Integrated circuits - Manufacturing line approval application guideline     EN 61967-1:2002 2002-06-05 Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 1: General conditions and definitions     EN 165000-3:1996 1996-04-17 Film and hybrid integrated circuits - Part 3: Self-audit checklist and report for film and hybrid integrated circuit manufacturers     EN 165000-4:1996 1996-04-17 Film and hybrid integrated circuits - Part 4: Customer information, product assessment level schedules and blank detail specification     CECC 290 001:1997 1997-02-04 Technology Approval Schedule: Manufacture of microelectronic integrated circuits and ASICs     EN 190101:1994 1994-05-15 Family Specification: Digital integrated TTL circuits - Series 54, 64, 74, 84     EN 190102:1994 1994-05-15 Family Specification: TTL-Schottky digital integrated circuits - Series 54S, 64S, 74S, 84S     EN 190106:1994 1994-05-15 Family Specification: TTL advanced low power Schottky digital integrated circuits - Series 54ALS, 74ALS     EN 190107:1994 1994-05-15 Family Specification: TTL FAST digital integrated circuits - Series 54F, 74F     EN 190108:1994 1994-05-15 Family Specification: TTL advanced Schottky digital integrated circuits - Series 54AS, 74AS     EN 190109:1994 1994-05-15 Family Specification: Digital integrated HC MOS circuits - Series HC/HCT/HCU     EN 190110:1994 1994-05-15 Blank Detail Specification: Digital microprocessor integrated circuits     CECC 90 302:1985 1985-12-15 Blank Detail Specification: Integrated voltage comparators (with A1)     EN 190100:1993 1993-04-15 Sectional Specification: Digital monolithic integrated circuits     EN 163100:1991 1991-12-15 Sectional Specification: Film and hybrid integrated circuits     EN 163101:1991 1991-12-15 Blank Detail Specification: Film and hybrid integrated circuits     CECC 90 115:1993 1993-12-15 Blank Detail Specification: Digital gate array integrated circuits     CECC 90 114:1994 1994-07-15 Blank Detail Specification: Programmable logic arrays (PLA) (with A1)     CECC 90 300:1994 1994-09-15 Sectional Specification: Interface monolithic integrated circuits (with A1)     CECC 90 202:1989 1989-01-01 Blank Detail Specification: Integrated operational amplifiers (with A1)     EN 190000:1995 1995-06-21 Generic Specification: Monolithic integrated circuits     CECC 90 105:1986 1986-01-01 Blank Detail Specification: Fusible link programmable bipolar read only memories, silicon monolithic integrated circuits (with A1 & A2)     CECC 90 200:1987 1987-01-01 Sectional Specification: Analogue monolithic integrated circuits (with A1)     CECC 90 201:1988 1988-01-01 Blank Detail Specification: Integrated voltage regulators (with A1)     CECC 90 203:1985 1985-12-15 Blank Detail Specification: Integrated analogue switching circuits     EN 62132-2:2011 2011-03-04 Integrated circuits - Measurement of electromagnetic immunity - Part 2: Measurement of radiated immunity - TEM cell and wideband TEM cell method     EN 62433-2:2010 2010-01-07 EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)     EN 61967-8:2011 2011-10-14 Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method     EN 62132-8:2012 2012-09-21 Integrated circuits - Measurement of electromagnetic immunity - Part 8: Measurement of radiated immunity - IC stripline method