International Standards and Conformity Assessment for all electrical, electronic and related technologies

CLC/SR 47F

Micro-electromechanical systems

 
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CLC/SR 47F Working Documents

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FprEN 62047-5:2010 (pr=22629)
Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
export to doc file  EN   Procedure Result Yes
FprEN 62047-5:2011 (pr=22629)
Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
export to doc file  EN   Procedure Result Yes
prEN 62047-6:2007 (pr=21554)
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
export to doc file  EN 2008-04-07   Procedure Result Yes
FprEN 62047-6:2009 (pr=21554)
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
export to doc file  EN 2009-03-24   Procedure Result Yes
FprEN 62047-7:2010 (pr=22658)
Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
export to doc file  EN   Procedure Result Yes
FprEN 62047-7:2011 (pr=22658)
Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
export to doc file  EN   Procedure Result Yes
FprEN 62047-8:2009 (pr=22628)
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
export to doc file  EN   Procedure Result Yes
FprEN 62047-8:2010 (pr=22628)
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
export to doc file  EN   Procedure Result Yes
FprEN 62047-9:2009 (pr=22644)
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
export to doc file  EN   Procedure Result Yes
FprEN 62047-9:2011 (pr=22644)
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
export to doc file  EN   Procedure Result Yes
FprEN 62047-10:2011 (pr=23075)
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
export to doc file  EN   Procedure Result Yes
FprEN 62047-10:2010 (pr=23075)
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
export to doc file  EN   Procedure Result Yes
FprEN 62047-11:2011 (pr=23953)
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
export to doc file  EN   Procedure Result Yes
FprEN 62047-11:2013 (pr=23953)
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
export to doc file  EN   Procedure Result Yes
FprEN 62047-12:2010 (pr=23076)
Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
export to doc file  EN   Procedure Result Yes
FprEN 62047-12:2011 (pr=23076)
Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
export to doc file  EN   Procedure Result Yes
FprEN 62047-13:2010 (pr=23280)
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures
export to doc file  EN   Procedure Result Yes
FprEN 62047-13:2011 (pr=23280)
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures
export to doc file  EN   Procedure Result Yes
FprEN 62047-14:2011 (pr=23220)
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
export to doc file  EN   Procedure Result Yes
FprEN 62047-14:2010 (pr=23220)
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
export to doc file  EN   Procedure Result Yes
FprEN 62047-17:2013 (pr=25011)
Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
export to doc file  EN   Procedure Result Yes
FprEN 62047-18:2012 (pr=24073)
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
export to doc file  EN   Procedure Result Yes
FprEN 62047-18:2013 (pr=24073)
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
export to doc file  EN   Procedure Result Yes
FprEN 62047-19:2012 (pr=24006)
Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
export to doc file  EN   Procedure Result Yes
FprEN 62047-19:2013 (pr=24006)
Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
export to doc file  EN   Procedure Result Yes
FprEN 62047-20:2013 (pr=24671)
Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
export to doc file  EN   Procedure Result Yes
FprEN 62047-21:2013 (pr=24672)
Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
export to doc file  EN   Procedure Result Yes
FprEN 62047-22:2013 (pr=24695)
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
export to doc file  EN   Procedure Result Yes

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CLC/SR 47F Documents open for vote

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Other Documents accessible to CLC/SR 47F

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Definitive Text - EN 62047-6:2010
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
Definitive Text - EN 62047-19:2013
Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
Definitive Text - EN 62047-6:2010
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
Definitive Text - EN 62047-7:2011
Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
Definitive Text - EN 62047-7:2011
Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
Definitive Text - EN 62047-7:2011
Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
Definitive Text - EN 62047-5:2011
Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
Definitive Text - EN 62047-5:2011
Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
Definitive Text - EN 62047-5:2011
Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
Definitive Text - EN 62047-13:2012
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures
Definitive Text - EN 62047-14:2012
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
Definitive Text - EN 62047-14:2012
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
Definitive Text - EN 62047-14:2012
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
Definitive Text - EN 62047-13:2012
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures
Definitive Text - EN 62047-13:2012
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures
Definitive Text - EN 62047-8:2011
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
Definitive Text - EN 62047-8:2011
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
Definitive Text - EN 62047-8:2011
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
Definitive Text - EN 62047-9:2011
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
Definitive Text - EN 62047-9:2011
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
Definitive Text - EN 62047-9:2011
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
Definitive Text - EN 62047-10:2011
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
Definitive Text - EN 62047-10:2011
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
Definitive Text - EN 62047-10:2011
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
Definitive Text - EN 62047-12:2011
Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
Definitive Text - EN 62047-12:2011
Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
Definitive Text - EN 62047-12:2011
Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
Definitive Text - EN 62047-18:2013
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
Definitive Text - EN 62047-18:2013
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
Definitive Text - EN 62047-11:2013
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
Definitive Text - EN 62047-11:2013
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
Definitive Text - EN 62047-11:2013
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
Definitive Text - EN 62047-18:2013
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
Definitive Text - EN 62047-19:2013
Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
Definitive Text - EN 62047-19:2013
Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
Definitive Text - EN 62047-6:2010
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials

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