Definitive Text - EN 61188-5-6:2003
Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides

Definitive Text - EN 60068-2-21:1999
Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

Definitive Text - EN 61193-1:2002
Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies

Definitive Text - EN 60068-2-21:1997
Environmental testing - Part 2: Tests - Test U: Robustness of terminations and integral mounting devices

Definitive Text - EN 61249-5-4:1996
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks

Definitive Text - EN 61192-1:2003
Workmanship requirements for soldered electronic assemblies - Part 1: General

Definitive Text - EN 61760-2:2007
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

Definitive Text - EN 61760-2:2007
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

Definitive Text - HD 313.2.4 S2:1990
Base materials for printed circuits - Part 2: Specifications - Specification No. 4: Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade

Definitive Text - EN 61760-1:2006
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

Definitive Text - EN 61760-1:2006
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

Definitive Text - EN 61189-5:2006
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

Definitive Text - EN 61189-5:2006
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

Definitive Text - EN 61189-5:2006
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

Definitive Text - EN 61249-4-2:2005
Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability

Definitive Text - EN 60194:2006
Printed board design, manufacture and assembly - Terms and definitions

Definitive Text - EN 61249-2-23:2005
Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad

Definitive Text - EN 61249-2-23:2005
Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad

Definitive Text - EN 61249-2-23:2005
Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad

Definitive Text - EN 61249-4-11:2005
Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability

Definitive Text - EN 61249-4-11:2005
Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability

Definitive Text - EN 61249-4-11:2005
Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability

Definitive Text - EN 61249-4-12:2005
Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability

Definitive Text - EN 61249-4-12:2005
Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability

Definitive Text - EN 61249-4-12:2005
Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability

Definitive Text - EN 60068-2-54:2006
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

Definitive Text - EN 60068-2-54:2006
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

Definitive Text - EN 61249-2-22:2005
Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61249-2-22:2005
Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61192-5:2007
Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies

Definitive Text - EN 61249-4-2:2005
Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability

Definitive Text - EN 61249-4-5:2005
Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability

Definitive Text - EN 61249-4-5:2005
Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability

Definitive Text - EN 61188-5-3:2007
Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides

Definitive Text - EN 61188-5-3:2007
Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides

Definitive Text - EN 61249-2-22:2005
Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61192-5:2007
Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies

Definitive Text - HD 323.2.20 S3:1988
Basic environmental testing procedures - Part 2: Tests - Test T: Soldering

Definitive Text - HD 323.2.58 S1:1991
Environmental testing - Part 2: Tests - Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of Surface Mounting Devices (SMD)

Definitive Text - EN 61190-1-3:2007
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Definitive Text - EN 61190-1-3:2007
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Definitive Text - EN 61249-2-26:2005
Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials, clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61249-2-26:2005
Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials, clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61249-2-26:2005
Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials, clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61192-4:2003
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies

Definitive Text - EN 61249-4-1:2008
Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability

Definitive Text - EN 61249-4-1:2008
Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability

Definitive Text - EN 60068-2-69:2007
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

Definitive Text - EN 60068-2-69:2007
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

Definitive Text - EN 60068-2-58:2004
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Definitive Text - EN 61188-5-8:2008
Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)

Definitive Text - EN 61188-5-8:2008
Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)

Definitive Text - EN 61191-1:1998
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

Definitive Text - EN 61188-5-5:2007
Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides

Definitive Text - EN 61188-5-5:2007
Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides

Definitive Text - EN 62326-1:2002
Printed boards - Part 1: Generic specification

Definitive Text - EN 61249-2-13:1999
Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper clad

Definitive Text - EN 61249-2-13:1999
Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper clad

Definitive Text - EN 61249-2-13:1999
Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper clad

Definitive Text - EN 60249-2-12:1994/A4:2000
Base materials for printed circuits - Part 2-12: Specifications: thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards

Definitive Text - EN 61189-3:1997/A1:1999
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Definitive Text - EN 123200-800:1992
Capability Detail Specification: Single and double sided printed boards with plated-through holes

Definitive Text - EN 123400:1992
Sectional Specification: Flexible printed boards without through connections

Definitive Text - EN 62090:2003
Product package labels for electronic components using bar code and two- dimensional symbologies

Definitive Text - HD 313.2.3 S2:1990
Base materials for printed circuits - Part 2: Specifications - Specification No. 3: Epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)

Definitive Text - HD 313.2.9 S2:1990
Base materials for printed circuits - Part 2: Specifications - Specification No. 9: Epoxide cellulose paper core, epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test)

Definitive Text - HD 313.2.2 S1:1987
Base materials for printed circuits - Part 2: Specifications - Specification No. 2: Phenolic cellulose paper copper-clad laminated sheet, economic quality

Definitive Text - EN 123600:1996
Sectional Specification: Flex-rigid multilayer printed boards with through connections

Definitive Text - HD 203 S1:1977
Grid system for printed circuits

Definitive Text - EN 61192-2:2003
Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies

Definitive Text - HD 313.2.10 S1:1989
Base materials for printed circuits - Part 2: Specifications - Specification No. 10: Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)

Definitive Text - HD 313.2.14 S1:1990
Base materials for printed circuits - Part 2: Specifications - Specification No. 14: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test), economic quality

Definitive Text - EN 60249-2-5:1994/A4:1995
Base materials for printed circuits - Part 2: Specifications - Specification No. 5: Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

Definitive Text - EN 123300:1992/A1:1995
Sectional Specification: Multilayer printed boards

Definitive Text - EN 123400:1992/A2:1995
Sectional Specification: Flexible printed boards without through connections

Definitive Text - EN 123500:1992
Sectional Specification: Flexible printed boards with through connections

Definitive Text - EN 123500:1992/A2:1995
Sectional Specification: Flexible printed boards with through connections

Definitive Text - EN 123200:1992
Sectional Specification: Single and double sided printed boards with plated-through holes

Definitive Text - EN 123100:1992
Sectional Specification: Single and double-sided printed boards with plain holes

Definitive Text - EN 123100:1992/A1:1995
Sectional Specification: Single and double-sided printed boards with plain holes

Definitive Text - EN 123200:1992/A1:1995
Sectional Specification: Single and double sided printed boards with plated-through holes

Definitive Text - EN 60068-2-44:1995
Environmental testing - Part 2: Tests - Guidance on Test T: Soldering

Definitive Text - EN 60249-2-12:1994/A3:1995
Base materials for printed circuits - Part 2-12: Specifications: thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards

Definitive Text - EN 61191-3:1998
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

Definitive Text - EN 61191-2:1998
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

Definitive Text - EN 61188-1-1:1997
Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies

Definitive Text - EN 61760-1:1998
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

Definitive Text - CECC 23 300-801:1998
Capability Detail Specification: Multi-layer printed boards

Definitive Text - CECC 23 600-801:1998
Capability Detail Specification: Flex-rigid multilayer printed boards with through connections

Definitive Text - CECC 23 700-801:1998
Capability Detail Specification: Flex-rigid double-sided printed boards with through connections

Definitive Text - CECC 23 800-801:1998
Capability Detail Specification: Flexible multilayer printed boards with through connections

Definitive Text - CECC 200 025:1998
Process Assessment Schedule: Printed board assembly facilities

Definitive Text - CECC 23 100-801:1998
Capability Detail Specification: Single and double-sided printed boards with plain holes

Definitive Text - CECC 23 200-801:1998
Capability Detail Specification: Single and double-sided printed boards with plated-through holes

Definitive Text - EN 61249-8-8:1997
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings

Definitive Text - EN 61249-8-7:1996
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks

Definitive Text - EN 61188-1-2:1998
Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance

Definitive Text - EN 61249-2-19:2002
Materials for printed boards and other interconnecting structures - Part 2-19: Reinforced base materials, clad and unclad - Epoxide cross-plied linear fibreglass-reinforced laminated sheets of defined flammability (vertical burning test) copper clad

Definitive Text - EN 61760-2:1998
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

Definitive Text - EN 61189-3:1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Definitive Text - EN 61189-1:1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: General test methods and methodology

Definitive Text - EN 61189-2:1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Definitive Text - EN 62326-4:1997
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification

Definitive Text - EN 60068-2-21:1997/A2:1997
Environmental testing - Part 2: Tests - Test U: Robustness of terminations and integral mounting devices

Definitive Text - EN 60068-2-21:1997/A3:1997
Environmental testing - Part 2: Tests - Test U: Robustness of terminations and integral mounting devices

Definitive Text - EN 62326-4-1:1997
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability Detail Specification - Performance levels A, B and C

Definitive Text - EN 60068-2-69:1996
Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method

Definitive Text - EN 61249-7-1:1995
Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/Invar/copper

Definitive Text - EN 123100-800:1992
Capability Detail Specification: Single and double sided printed boards with plain holes

Definitive Text - EN 123300-800:1992
Capability Detail Specification: Multilayer printed boards

Definitive Text - EN 123400-800:1992
Capability Detail Specification: Flexible printed boards without through connections

Definitive Text - EN 123500-800:1992
Capability Detail Specification: Flexible printed boards with through connections

Definitive Text - EN 61249-5-1:1996
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)

Definitive Text - EN 61249-2-7:2002
Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61189-1:1997/A1:2001
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: General test methods and methodology

Definitive Text - EN 60068-2-58:1999
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Definitive Text - EN 61249-3-4:1999
Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film

Definitive Text - EN 61249-3-4:1999
Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film

Definitive Text - EN 61249-3-4:1999
Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film

Definitive Text - EN 61249-3-3:1999
Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film

Definitive Text - EN 61249-3-3:1999
Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film

Definitive Text - EN 61249-3-3:1999
Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film

Definitive Text - EN 61249-2-12:1999
Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad

Definitive Text - EN 61249-2-12:1999
Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad

Definitive Text - EN 61249-2-12:1999
Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad

Definitive Text - EN 61249-3-5:1999
Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films

Definitive Text - EN 61249-3-5:1999
Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films

Definitive Text - EN 61249-3-5:1999
Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films

Definitive Text - EN 60249-2-5:1994/A5:2000
Base materials for printed circuits - Part 2: Specifications - Specification No. 5: Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

Definitive Text - EN 60068-2-77:1999
Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock

Definitive Text - EN 61192-3:2003
Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies

Definitive Text - EN 61249-2-9:2003
Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine, modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61249-2-10:2003
Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials, clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61249-2-11:2003
Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61249-2-21:2003
Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61249-2-2:2005
Materials for printed boards and other interconnecting structures - Part 2-2: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad

Definitive Text - EN 61249-2-2:2005
Materials for printed boards and other interconnecting structures - Part 2-2: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad

Definitive Text - EN 61249-2-2:2005
Materials for printed boards and other interconnecting structures - Part 2-2: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad

Definitive Text - EN 62137:2004
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

Definitive Text - EN 62137:2004
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

Definitive Text - EN 62137:2004
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

Definitive Text - EN 61249-2-1:2005
Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad

Definitive Text - EN 61249-2-1:2005
Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad

Definitive Text - EN 61249-2-1:2005
Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad

Definitive Text - EN 61249-2-6:2003
Materials for printed boards and other interconnecting structures - Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61190-1-3:2002
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Definitive Text - EN 61188-5-1:2002
Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

Definitive Text - EN 61190-1-1:2002
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

Definitive Text - EN 61249-2-4:2002
Materials for printed boards and other interconnecting structures - Part 2-4: Reinforced base materials, clad and unclad - Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61188-5-2:2003
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

Definitive Text - EN 61249-2-18:2002
Materials for printed boards and other interconnecting structures - Part 2-18: Reinforced base materials, clad and unclad - Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper-clad

Definitive Text - CECC 210 003:1996
Technology Approval Schedule: Printed boards

Definitive Text - EN 61249-2-8:2003
Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials, clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 123300:1992
Sectional Specification: Multilayer printed boards

Definitive Text - HD 313.2.9 S3:1991
Base materials for printed circuits - Part 2: Specifications - Specification No. 9: Epoxide cellulose paper core, epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test)

Definitive Text - HD 313.2.2 S2:1990
Base materials for printed circuits - Part 2: Specifications - Specification No. 2: Phenolic cellulose paper copper-clad laminated sheet, economic quality

Definitive Text - EN 123700:1996
Sectional Specification: Flex-rigid double sided printed board with through connections

Definitive Text - EN 61193-2:2007
Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages

Definitive Text - EN 62137-1-1:2007
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

Definitive Text - EN 62137-1-1:2007
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

Definitive Text - EN 62137-1-2:2007
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test

Definitive Text - EN 62137-1-2:2007
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test

Definitive Text - EN 61193-2:2007
Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages

Definitive Text - EN 61193-2:2007
Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages

Definitive Text - EN 61189-6:2006
Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies

Definitive Text - EN 61189-6:2006
Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies

Definitive Text - EN 60068-2-20:2008
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

Definitive Text - EN 60068-2-20:2008
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

Definitive Text - EN 62421:2007
Electronics assembly technology - Electronic modules

Definitive Text - EN 62421:2007
Electronics assembly technology - Electronic modules

Definitive Text - HD 142 S2:1977
Terms and definitions for printed circuits

Definitive Text - EN 61189-2:1997/A1:2000
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Definitive Text - EN 61191-4:1998
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

Definitive Text - HD 313.2.2 S3:1992
Base materials for printed circuits - Part 2: Specifications - Specification No. 2: Phenolic cellulose paper copper-clad laminated sheet, economic quality

Definitive Text - HD 313.1 S5:1991
Base materials for printed circuits - Part 1: Test methods

Definitive Text - HD 143.1 S1:1983
Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes

Definitive Text - HD 313.2.6 S1:1987
Base materials for printed circuits - Part 2: Specifications - Specification No. 6: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (horizontal burning test)

Definitive Text - HD 313.2.7 S1:1989
Base materials for printed circuits - Part 2: Specifications - Specification No. 7: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)

Definitive Text - HD 313.2.8 S1:1989
Base materials for printed circuits - Part 2: Specifications - Specification No. 8: Flexible copper-clad polyester (PETP) film

Definitive Text - HD 313.2.10 S3:1991
Base materials for printed circuits - Part 2: Specifications - Specification No. 10: Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)

Definitive Text - HD 313.2.14 S2:1992
Base materials for printed circuits - Part 2: Specifications - Specification No. 14: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test), economic quality

Definitive Text - CECC 23 400-800:1988
Flexible printed boards with through connections

Definitive Text - CECC 23 500-800:1988
Flexible printed boards with through connections

Definitive Text - EN 123800:1996
Sectional Specification: Flexible multilayer printed boards with through connections

Definitive Text - HD 142 S3:1991
Terms and definitions for printed circuits

Definitive Text - EN 60097:1993
Grid systems for printed circuits

Definitive Text - HD 313.1 S4:1987
Base materials for printed circuits - Part 1: Test methods

Definitive Text - HD 313.2.1 S2:1990
Base materials for printed circuits - Part 2: Specifications - Specification No. 1: Phenolic cellulose paper copper-clad laminated sheet, high electrical quality

Definitive Text - HD 313.2.5 S2:1990
Base materials for printed circuits - Part 2: Specifications - Specification No. 5: Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

Definitive Text - HD 313.2.6 S2:1990
Base materials for printed circuits - Part 2: Specifications - Specification No. 6: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (horizontal burning test)

Definitive Text - HD 313.2.7 S2:1990
Base materials for printed circuits - Part 2: Specifications - Specification No. 7: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)

Definitive Text - HD 313.2.10 S2:1990
Base materials for printed circuits - Part 2: Specifications - Specifications No. 10: Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)

Definitive Text - HD 313.2.11 S2:1990
Base materials for printed circuits - Part 2: Specifications - Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards

Definitive Text - HD 313.2.12 S2:1990
Base materials for printed circuits - Part 2: Specifications - Specification No. 12: Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards

Definitive Text - HD 313.2.1 S1:1987
Base materials for printed circuits - Part 2: Specifications - Specification N1: Phenolic cellulose paper copper-clad laminated sheet, high electrical quality

Definitive Text - HD 313.2.3 S1:1989
Base materials for printed circuits - Part 2: Specifications - Specification No. 3: Epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)

Definitive Text - HD 313.2.4 S1:1989
Base materials for printed circuits - Part 2: Specifications - Specification No. 4: Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade

Definitive Text - HD 313.2.5 S1:1989
Base materials for printed circuits - Part 2: Specifications - Specification No. 5: Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

Definitive Text - HD 313.2.9 S1:1989
Base materials for printed circuits - Part 2: Specifications - Specification No. 9: Epoxide cellulose paper core, epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test)

Definitive Text - HD 313.2.11 S1:1989
Base materials for printed circuits - Part 2: Specifications - Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards

Definitive Text - HD 313.2.12 S1:1989
Base materials for printed circuits - Part 2: Specifications - Specification No. 12: Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards

Definitive Text - HD 313.2.15 S1:1991
Base materials for printed circuits - Part 2: Specifications - Specification No. 15: Flexible copper-clad polyimide film, of defined flammability

Definitive Text - HD 313.2.13 S1:1989
Base materials for printed circuits - Part 2: Specifications - Specification No. 13: Flexible copper-clad polyimide film, general purpose grade

Definitive Text - HD 323.2.21 S3:1988
Basic environmental testing procedures - Part 2: Tests - Test U: Robustness of terminations and integral mounting devices

Definitive Text - EN 60249-2-5:1994
Base materials for printed circuits - Part 2: Specifications - Specification No. 5: Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

Definitive Text - EN 60249-2-5:1994/A3:1994
Base materials for printed circuits - Part 2: Specifications - Specification No. 5: Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)

Definitive Text - EN 60249-2-12:1994/A2:1994
Base materials for printed circuits - Part 2-12: Specifications: thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards

Definitive Text - EN 60249-2-12:1994
Base materials for printed circuits - Part 2-12: Specifications: thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards

Definitive Text - EN 62137-1-4:2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test

Definitive Text - EN 62137-1-4:2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test

Definitive Text - EN 62137-1-4:2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test

Definitive Text - EN 61191-6:2010
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method

Definitive Text - EN 61191-6:2010
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method

Definitive Text - EN 61191-6:2010
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method

Definitive Text - EN 61249-2-41:2010
Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Definitive Text - EN 61249-2-42:2010
Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Definitive Text - EN 61249-2-42:2010
Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Definitive Text - EN 61249-2-42:2010
Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Definitive Text - EN 61760-3:2010
Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering

Definitive Text - EN 61760-3:2010
Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering

Definitive Text - EN 61760-3:2010
Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering

Definitive Text - EN 61249-2-41:2010
Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Definitive Text - EN 61249-2-41:2010
Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Definitive Text - EN 61188-7:2009
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

Definitive Text - EN 61188-7:2009
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

Definitive Text - EN 62137-1-3:2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test

Definitive Text - EN 62137-1-3:2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test

Definitive Text - EN 62137-1-3:2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test

Definitive Text - EN 62137-1-5:2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test

Definitive Text - EN 62137-1-5:2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test

Definitive Text - EN 62137-1-5:2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test

Definitive Text - EN 61190-1-2:2002
Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly

Definitive Text - EN 61249-2-5:2003
Materials for printed boards and other interconnecting structures - Part 2-5: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core / woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61189-2:2006
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Definitive Text - EN 61189-2:2006
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Definitive Text - EN 61249-2-35:2009
Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Definitive Text - EN 61249-2-35:2009
Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Definitive Text - EN 61249-2-36:2009
Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Definitive Text - EN 61249-2-36:2009
Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Definitive Text - EN 61249-2-36:2009
Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Definitive Text - EN 61249-2-37:2009
Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Definitive Text - EN 61249-2-37:2009
Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Definitive Text - EN 61249-2-37:2009
Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Definitive Text - EN 61249-4-15:2009
Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Definitive Text - EN 61249-4-15:2009
Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Definitive Text - EN 61249-4-16:2009
Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Definitive Text - EN 61249-4-16:2009
Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Definitive Text - EN 61249-4-17:2009
Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Definitive Text - EN 61249-4-17:2009
Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Definitive Text - EN 61188-5-4:2007
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides

Definitive Text - EN 61188-5-4:2007
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides

Definitive Text - EN 61249-2-35:2009
Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Definitive Text - EN 61249-2-38:2009
Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Definitive Text - EN 61249-2-38:2009
Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Definitive Text - EN 61249-2-38:2009
Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Definitive Text - EN 61249-4-14:2009
Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Definitive Text - EN 61249-4-14:2009
Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Definitive Text - EN 60068-2-83:2011
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

Definitive Text - EN 60068-2-83:2011
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

Definitive Text - EN 60068-2-83:2011
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

Definitive Text - EN 61189-2:1997/corrigendum Aug. 1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Definitive Text - EN 61189-2:1997/corrigendum Aug. 1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Definitive Text - EN 61189-2:1997/corrigendum Aug. 1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Definitive Text - EN 61249-2-5:2003/corrigendum Jul. 2005
Materials for printed boards and other interconnecting structures - Part 2-5: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core / woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61249-2-5:2003/corrigendum Jul. 2005
Materials for printed boards and other interconnecting structures - Part 2-5: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core / woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61249-2-5:2003/corrigendum Jul. 2005
Materials for printed boards and other interconnecting structures - Part 2-5: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core / woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61249-2-11:2003/corrigendum Jul. 2005
Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61249-2-11:2003/corrigendum Jul. 2005
Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61249-2-11:2003/corrigendum Jul. 2005
Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61249-2-7:2002/corrigendum Sep. 2005
Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61249-2-7:2002/corrigendum Sep. 2005
Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61249-2-7:2002/corrigendum Sep. 2005
Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 60068-2-58:2004/corrigendum Dec. 2004
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Definitive Text - EN 60068-2-58:2004/corrigendum Dec. 2004
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Definitive Text - EN 61249-2-6:2003/corrigendum Jul. 2005
Materials for printed boards and other interconnecting structures - Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61249-2-6:2003/corrigendum Jul. 2005
Materials for printed boards and other interconnecting structures - Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61249-2-6:2003/corrigendum Jul. 2005
Materials for printed boards and other interconnecting structures - Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 62137:2004/corrigendum Feb. 2005
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

Definitive Text - EN 62137:2004/corrigendum Feb. 2005
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

Definitive Text - EN 62137:2004/corrigendum Feb. 2005
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

Definitive Text - EN 61189-2:1997/corrigendum Apr. 1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Definitive Text - EN 61189-2:1997/corrigendum Apr. 1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Definitive Text - EN 61189-2:1997/corrigendum Apr. 1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Definitive Text - EN 61249-2-10:2003/corrigendum Jul. 2005
Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials, clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61249-2-10:2003/corrigendum Jul. 2005
Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials, clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61249-2-10:2003/corrigendum Jul. 2005
Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials, clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61182-2-2:2012
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description

Definitive Text - EN 61182-2-2:2012
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description

Definitive Text - EN 61182-2-2:2012
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description

Definitive Text - EN 61190-1-3:2007/A1:2010
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Definitive Text - EN 61190-1-3:2007/A1:2010
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Definitive Text - EN 61190-1-3:2007/A1:2010
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Definitive Text - EN 61189-3:2008
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Definitive Text - EN 61189-3:2008
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Definitive Text - EN 123000:1991/A2:1996
Generic Specification: Printed boards

Definitive Text - EN 123000:1991/A1:1995
Generic Specification: Printed boards

Definitive Text - EN 123000:1991
Generic Specification: Printed boards

Definitive Text - EN 62326-1:1997
Printed boards - Part 1: Generic specification

Definitive Text - EN 60249-1:1993/A4:1994/corrigendum Mar. 1994
Base materials for printed circuits - Part 1: Test methods

Definitive Text - EN 62137-3:2012
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints

Definitive Text - EN 62137-3:2012
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints

Definitive Text - EN 61190-1-2:2007
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

Definitive Text - EN 61190-1-2:2007
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

Definitive Text - EN 62137-3:2012
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints

Definitive Text - EN 60068-2-21:2006
Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

Definitive Text - EN 61193-3:2013
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing

Definitive Text - EN 61193-3:2013
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing

Definitive Text - EN 60068-2-69:2007
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

Definitive Text - EN 61189-3:2008
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Definitive Text - EN 60068-2-21:2006
Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

Definitive Text - EN 60068-2-21:2006
Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

Definitive Text - EN 61249-2-27:2013
Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61249-2-27:2013
Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61249-2-27:2013
Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61249-2-30:2013
Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61249-2-30:2013
Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61249-2-30:2013
Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad

Definitive Text - EN 61249-2-39:2013
Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Definitive Text - EN 61249-2-39:2013
Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Definitive Text - EN 61249-2-39:2013
Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Definitive Text - EN 61249-2-40:2013
Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Definitive Text - EN 61249-2-40:2013
Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Definitive Text - EN 61249-2-40:2013
Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Definitive Text - EN 61193-3:2013
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing

Definitive Text - EN 60068-2-82:2007
Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components

Definitive Text - EN 60068-2-82:2007
Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components

Definitive Text - EN 60068-2-82:2007
Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components