International Standards and Conformity Assessment for all electrical, electronic and related technologies

CLC/SR 91

Electronics assembly technology

 
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CLC/SR 91 Working Documents

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prEN 60068-2-20:2006 (pr=20975)
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
export to doc file  EN 2007-04-02   Procedure Result Yes
FprEN 60068-2-20:2008 (pr=20975)
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
export to doc file  EN 2008-07-02   Procedure Result Yes
prEN 60068-2-21:2006 (pr=16619)
Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
export to doc file  EN 2006-05-23   Procedure Result Yes
prEN 60068-2-54:2006 (pr=16241)
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
export to doc file  EN 2006-03-20   Procedure Result Yes
FprEN 60068-2-58:2013 (pr=25040)
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
export to doc file  EN   Procedure Result Yes
prEN 60068-2-69:2007 (pr=17045)
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
export to doc file  EN 2007-04-10   Procedure Result Yes
prEN 60068-2-82:2007 (pr=17145)
Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components
export to doc file  EN 2007-05-07   Procedure Result Yes
prEN 60068-2-82:2005 (pr=17145)
Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components
export to doc file  EN 2006-05-12   Procedure Result Yes
FprEN 60068-2-83:2011 (pr=22730)
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
export to doc file  EN   Procedure Result Yes
FprEN 60068-2-83:2009 (pr=22730)
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
export to doc file  EN   Procedure Result Yes
prEN 60194:2005 (pr=17109)
Printed board design, manufacture and assembly - Terms and definitions
export to doc file  EN 2006-03-28   Procedure Result No
FprEN 61182-2-2:2009 (pr=22770)
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
export to doc file  EN   Procedure Result Yes
FprEN 61182-2-2:2012 (pr=22770)
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
export to doc file  EN   Procedure Result Yes
prEN 61188-5-3:2007 (pr=16405)
Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
export to doc file  EN 2007-10-01   Procedure Result Yes
prEN 61188-5-4:2007 (pr=16406)
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
export to doc file  EN 2007-10-01   Procedure Result Yes
prEN 61188-5-5:2007 (pr=16407)
Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
export to doc file  EN 2007-10-01   Procedure Result Yes
prEN 61188-5-8:2007 (pr=16408)
Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
export to doc file  EN 2007-10-01   Procedure Result Yes
prEN 61188-7:2007 (pr=21379)
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
export to doc file  EN 2007-12-18   Procedure Result Yes
FprEN 61188-7:2009 (pr=21379)
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
export to doc file  EN 2009-05-06   Procedure Result Yes
prEN 61189-3:2007 (pr=17167)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
export to doc file  EN 2007-09-17   Procedure Result Yes
EN 61189-3:1997/prA2:2005 (pr=17167)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
export to doc file  EN 2006-05-23   Procedure Result Yes
prEN 61189-5:2006 (pr=16070)
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
export to doc file  EN 2006-08-14   Procedure Result Yes
FprEN 61189-5-2:2013 (pr=24976)
Test methods for electrical materials, interconnection structures and assemblies - Part 5-2: Test methods for printed board assemblies: Soldering flux
export to doc file  EN   Procedure Result Yes
FprEN 61189-5-3:2013 (pr=24977)
Test methods for electrical materials, interconnection structures and assemblies - Part 5-3: Test methods for printed board assemblies: Soldering paste
export to doc file  EN   Procedure Result Yes
FprEN 61189-5-4:2013 (pr=24978)
Test methods for electrical materials, interconnection structures and assemblies - Part 5-4: Test methods for printed board assemblies: Solder alloys and fluxed and non-fluxed solid wire
export to doc file  EN   Procedure Result Yes
prEN 61189-6:2006 (pr=16071)
Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
export to doc file  EN 2006-07-03   Procedure Result Yes
FprEN 61189-11:2013 (pr=23740)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
export to doc file  EN   Procedure Result Yes
FprEN 61189-11:2011 (pr=23740)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
export to doc file  EN   Procedure Result Yes
prEN 61190-1-2:2005 (pr=17131)
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
export to doc file  EN 2006-05-12   Procedure Result Yes
prEN 61190-1-2:2007 (pr=17131)
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
export to doc file  EN 2007-04-10   Procedure Result Yes
FprEN 61190-1-2:2013 (pr=24251)
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
export to doc file  EN   Procedure Result Yes
EN 61190-1-2:2007/FprA1:2012 (pr=24251)
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
export to doc file  EN   Procedure Result Yes
prEN 61190-1-3:2007 (pr=17133)
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
export to doc file  EN 2007-04-10   Procedure Result Yes
prEN 61190-1-3:2005 (pr=17133)
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
export to doc file  EN 2006-05-12   Procedure Result Yes
EN 61190-1-3:2007/FprA1:2010 (pr=22237)
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
export to doc file  EN   Procedure Result Yes
EN 61190-1-3:2007/FprA1:2009 (pr=22237)
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
export to doc file  EN 2009-07-13   Procedure Result Yes
FprEN 61191-1:2011 (pr=23840)
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
export to doc file  EN   Procedure Result Yes
FprEN 61191-1:2013 (pr=23840)
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
export to doc file  EN   Procedure Result Yes
FprEN 61191-2:2011 (pr=23841)
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
export to doc file  EN   Procedure Result Yes
FprEN 61191-2:2013 (pr=23841)
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
export to doc file  EN   Procedure Result Yes
FprEN 61191-6:2008 (pr=21860)
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
export to doc file  EN 2008-10-06   Procedure Result Yes
FprEN 61191-6:2009 (pr=21860)
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
export to doc file  EN 2009-12-22   Procedure Result Yes
prEN 61192-5:2007 (pr=16805)
Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
export to doc file  EN 2007-05-07   Procedure Result Yes
prEN 61193-2:2007 (pr=20503)
Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
export to doc file  EN 2007-08-20   Procedure Result Yes
prEN 61193-2:2006 (pr=20503)
Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
export to doc file  EN 2006-06-27   Procedure Result Yes
FprEN 61193-3:2009 (pr=22318)
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
export to doc file  EN   Procedure Result Yes
FprEN 61193-3:2012 (pr=22318)
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
export to doc file  EN   Procedure Result Yes
FprEN 61249-2-27:2010 (pr=23132)
Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
export to doc file  EN   Procedure Result Yes
FprEN 61249-2-27:2012 (pr=23132)
Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
export to doc file  EN   Procedure Result Yes
FprEN 61249-2-30:2010 (pr=23133)
Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
export to doc file  EN   Procedure Result Yes
FprEN 61249-2-30:2012 (pr=23133)
Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
export to doc file  EN   Procedure Result Yes
FprEN 61249-2-31:2008 (pr=21206)
Materials for printed boards and other interconnecting structures - Part 2-31: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad
export to doc file  EN 2009-01-19   Procedure Result Yes
prEN 61249-2-31:2007 (pr=21206)
Materials for printed boards and other interconnecting structures - Part 2-31: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad
export to doc file  EN 2007-09-17   Procedure Result Yes
FprEN 61249-2-32:2008 (pr=21208)
Materials for printed boards and other interconnecting structures - Part 2-32: Reinforced base materials clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad
export to doc file  EN 2009-01-19   Procedure Result Yes
prEN 61249-2-32:2007 (pr=21208)
Materials for printed boards and other interconnecting structures - Part 2-32: Reinforced base materials clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad
export to doc file  EN 2007-09-17   Procedure Result Yes
prEN 61249-2-33:2007 (pr=21209)
Materials for printed boards and other interconnecting structures - Part 2-33: Reinforced base materials clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad
export to doc file  EN 2007-09-17   Procedure Result Yes
FprEN 61249-2-33:2008 (pr=21209)
Materials for printed boards and other interconnecting structures - Part 2-33: Reinforced base materials clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad
export to doc file  EN 2009-01-19   Procedure Result Yes
FprEN 61249-2-34:2008 (pr=21211)
Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad
export to doc file  EN 2009-01-19   Procedure Result Yes
prEN 61249-2-34:2007 (pr=21211)
Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad
export to doc file  EN 2007-09-17   Procedure Result Yes
prEN 61249-2-35:2007 (pr=21188)
Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
export to doc file  EN 2007-09-10   Procedure Result Yes
FprEN 61249-2-35:2008 (pr=21188)
Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
export to doc file  EN 2008-11-12   Procedure Result Yes
prEN 61249-2-36:2007 (pr=21189)
Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
export to doc file  EN 2007-09-10   Procedure Result Yes
FprEN 61249-2-36:2008 (pr=21189)
Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
export to doc file  EN 2008-11-04   Procedure Result Yes
FprEN 61249-2-37:2008 (pr=21190)
Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
export to doc file  EN 2008-11-12   Procedure Result Yes
prEN 61249-2-37:2007 (pr=21190)
Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
export to doc file  EN 2007-09-17   Procedure Result Yes
prEN 61249-2-38:2007 (pr=21191)
Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
export to doc file  EN 2007-09-10   Procedure Result Yes
FprEN 61249-2-38:2008 (pr=21191)
Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
export to doc file  EN 2008-11-12   Procedure Result Yes
FprEN 61249-2-39:2012 (pr=23134)
Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
export to doc file  EN   Procedure Result Yes
FprEN 61249-2-39:2010 (pr=23134)
Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
export to doc file  EN   Procedure Result Yes
FprEN 61249-2-40:2012 (pr=23135)
Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
export to doc file  EN   Procedure Result Yes
FprEN 61249-2-40:2010 (pr=23135)
Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
export to doc file  EN   Procedure Result Yes
FprEN 61249-2-41:2010 (pr=22316)
Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
export to doc file  EN 2010-03-30   Procedure Result Yes
FprEN 61249-2-41:2009 (pr=22316)
Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
export to doc file  EN 2009-08-10   Procedure Result Yes
FprEN 61249-2-42:2010 (pr=22317)
Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
export to doc file  EN 2010-03-30   Procedure Result Yes
FprEN 61249-2-42:2009 (pr=22317)
Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
export to doc file  EN 2009-08-10   Procedure Result Yes
prEN 61249-4-1:2007 (pr=17165)
Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
export to doc file  EN 2008-01-14   Procedure Result Yes
prEN 61249-4-1:2005 (pr=17165)
Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
export to doc file  EN 2006-05-23   Procedure Result Yes
prEN 61249-4-14:2007 (pr=21192)
Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
export to doc file  EN 2007-09-10   Procedure Result Yes
FprEN 61249-4-14:2009 (pr=21192)
Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
export to doc file  EN 2009-05-06   Procedure Result Yes
prEN 61249-4-15:2007 (pr=21193)
Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
export to doc file  EN 2007-09-10   Procedure Result Yes
FprEN 61249-4-15:2009 (pr=21193)
Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
export to doc file  EN 2009-05-06   Procedure Result Yes
FprEN 61249-4-16:2009 (pr=21194)
Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
export to doc file  EN 2009-05-06   Procedure Result Yes
prEN 61249-4-16:2007 (pr=21194)
Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
export to doc file  EN 2007-09-10   Procedure Result Yes
prEN 61249-4-17:2007 (pr=21195)
Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
export to doc file  EN 2007-09-10   Procedure Result Yes
FprEN 61249-4-17:2009 (pr=21195)
Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
export to doc file  EN 2009-05-06   Procedure Result Yes
FprEN 61249-4-18:2013 (pr=23465)
Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
export to doc file  EN   Procedure Result Yes
FprEN 61249-4-18:2011 (pr=23465)
Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
export to doc file  EN   Procedure Result Yes
FprEN 61249-4-19:2011 (pr=23466)
Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
export to doc file  EN   Procedure Result Yes
FprEN 61249-4-19:2013 (pr=23466)
Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
export to doc file  EN   Procedure Result Yes
prEN 61760-1:2006 (pr=16365)
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
export to doc file  EN 2006-03-20   Procedure Result Yes
prEN 61760-2:2005 (pr=17134)
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
export to doc file  EN 2006-09-29   Procedure Result Yes
FprEN 61760-3:2009 (pr=22315)
Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
export to doc file  EN 2009-10-23   Procedure Result Yes
FprEN 61760-4:2013 (pr=24637)
Surface mounting technology - Part 4: Standard method for classification, packaging, labelling and handling of moisture sensitive devices
export to doc file  EN   Procedure Result Yes
prEN 62137-1-1:2007 (pr=20501)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
export to doc file  EN 2007-06-25   Procedure Result Yes
prEN 62137-1-1:2006 (pr=20501)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
export to doc file  EN 2006-06-27   Procedure Result Yes
prEN 62137-1-2:2006 (pr=20502)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
export to doc file  EN 2006-06-27   Procedure Result Yes
prEN 62137-1-2:2007 (pr=20502)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
export to doc file  EN 2007-07-03   Procedure Result Yes
FprEN 62137-1-3:2008 (pr=21446)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
export to doc file  EN 2008-11-04   Procedure Result Yes
prEN 62137-1-3:2007 (pr=21446)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
export to doc file  EN 2008-01-15   Procedure Result Yes
FprEN 62137-1-4:2008 (pr=21587)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
export to doc file  EN 2008-11-26   Procedure Result Yes
prEN 62137-1-4:2007 (pr=21587)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
export to doc file  EN 2008-04-28   Procedure Result Yes
FprEN 62137-1-5:2008 (pr=21581)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
export to doc file  EN 2009-01-19   Procedure Result Yes
prEN 62137-1-5:2007 (pr=21581)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
export to doc file  EN 2008-04-28   Procedure Result Yes
FprEN 62137-3:2011 (pr=22949)
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
export to doc file  EN   Procedure Result Yes
FprEN 62137-3:2010 (pr=22949)
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
export to doc file  EN   Procedure Result Yes
FprEN 62137-4:2013 (pr=24795)
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
export to doc file  EN   Procedure Result Yes
prEN 62421:2006 (pr=20623)
Electronics assembly technology - Electronic modules
export to doc file  EN 2006-09-05   Procedure Result Yes
prEN 62421:2007 (pr=20623)
Electronics assembly technology - Electronic modules
export to doc file  EN 2007-08-20   Procedure Result Yes
prEN 62468:2007 (pr=21106)
The marking for the presence and absence of the specified chemical substances in materials, components and mounted boards used in electrical and electronic equipment
export to doc file  EN   Procedure Result No
FprEN 62588:2013 (pr=24571)
Marking and labeling of components, PCBs and PCBAs to identify lead (Pb), lead-free (Pb-free) and other attributes
export to doc file  EN   Procedure Result Yes
FprEN 62739-1:2012 (pr=24102)
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
export to doc file  EN   Procedure Result Yes
FprEN 62739-1:2013 (pr=24102)
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
export to doc file  EN   Procedure Result Yes
FprEN 62878-1-1:2013 (pr=24979)
Device embedded substrate - Generic specification - Test method
export to doc file  EN   Procedure Result Yes

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Definitive Text - EN 61188-5-6:2003
Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
Definitive Text - EN 60068-2-21:1999
Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
Definitive Text - EN 61193-1:2002
Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
Definitive Text - EN 60068-2-21:1997
Environmental testing - Part 2: Tests - Test U: Robustness of terminations and integral mounting devices
Definitive Text - EN 61249-5-4:1996
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks
Definitive Text - EN 61192-1:2003
Workmanship requirements for soldered electronic assemblies - Part 1: General
Definitive Text - EN 61760-2:2007
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
Definitive Text - EN 61760-2:2007
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
Definitive Text - EN 61760-2:2007
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
Definitive Text - EN 61249-4-16:2009
Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Definitive Text - EN 61249-4-16:2009
Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Definitive Text - EN 61249-4-16:2009
Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Definitive Text - HD 313.2.4 S2:1990
Base materials for printed circuits - Part 2: Specifications - Specification No. 4: Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade
 
Definitive Text - EN 123300:1992/A1:1995
Sectional Specification: Multilayer printed boards
Definitive Text - EN 61760-1:2006
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
Definitive Text - EN 61760-1:2006
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
Definitive Text - EN 61191-1:2013
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Definitive Text - EN 61191-1:2013
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Definitive Text - EN 61191-1:2013
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Definitive Text - EN 61191-1:1998
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Definitive Text - EN 61189-5:2006
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
Definitive Text - EN 61189-5:2006
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
 
Definitive Text - EN 61189-5:2006
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
Definitive Text - EN 61249-4-2:2005
Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability
Definitive Text - EN 60194:2006
Printed board design, manufacture and assembly - Terms and definitions
Definitive Text - EN 61249-2-23:2005
Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
Definitive Text - EN 61249-2-23:2005
Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
Definitive Text - EN 61249-2-23:2005
Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
Definitive Text - EN 61249-4-11:2005
Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability
Definitive Text - EN 61249-4-11:2005
Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability
Definitive Text - EN 61249-4-11:2005
Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability
Definitive Text - EN 61249-4-12:2005
Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability
Definitive Text - EN 61249-4-12:2005
Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability
Definitive Text - EN 61249-4-12:2005
Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability
Definitive Text - EN 60068-2-54:2006
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
Definitive Text - EN 60068-2-54:2006
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
Definitive Text - EN 61249-2-22:2005
Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 61249-2-22:2005
Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 61192-5:2007
Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
Definitive Text - EN 61249-4-2:2005
Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability
Definitive Text - EN 61249-4-5:2005
Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability
Definitive Text - EN 61249-4-5:2005
Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability
Definitive Text - EN 61188-5-3:2007
Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
Definitive Text - EN 61188-5-3:2007
Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
Definitive Text - EN 61249-2-22:2005
Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 61192-5:2007
Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
Definitive Text - HD 323.2.20 S3:1988
Basic environmental testing procedures - Part 2: Tests - Test T: Soldering
 
Definitive Text - HD 323.2.58 S1:1991
Environmental testing - Part 2: Tests - Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of Surface Mounting Devices (SMD)
 
Definitive Text - EN 61190-1-3:2007
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
Definitive Text - EN 61190-1-3:2007
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
Definitive Text - EN 61249-2-26:2005
Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials, clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 61249-2-26:2005
Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials, clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 61249-2-26:2005
Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials, clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 61192-4:2003
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
Definitive Text - EN 61249-4-1:2008
Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
Definitive Text - EN 61249-4-1:2008
Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
Definitive Text - EN 61249-4-1:2008
Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
Definitive Text - EN 60068-2-58:2004
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Definitive Text - EN 61188-5-8:2008
Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
Definitive Text - EN 61188-5-8:2008
Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
Definitive Text - EN 61188-5-5:2007
Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
Definitive Text - EN 61188-5-5:2007
Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
Definitive Text - EN 62326-1:2002
Printed boards - Part 1: Generic specification
Definitive Text - EN 61249-2-13:1999
Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper clad
Definitive Text - EN 61249-2-13:1999
Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper clad
Definitive Text - EN 61249-2-13:1999
Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper clad
Definitive Text - EN 60249-2-12:1994/A4:2000
Base materials for printed circuits - Part 2-12: Specifications: thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards
Definitive Text - EN 61189-3:1997/A1:1999
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
Definitive Text - EN 123200-800:1992
Capability Detail Specification: Single and double sided printed boards with plated-through holes
 
Definitive Text - EN 62090:2003
Product package labels for electronic components using bar code and two- dimensional symbologies
Definitive Text - HD 313.2.3 S2:1990
Base materials for printed circuits - Part 2: Specifications - Specification No. 3: Epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)
 
Definitive Text - HD 313.2.9 S2:1990
Base materials for printed circuits - Part 2: Specifications - Specification No. 9: Epoxide cellulose paper core, epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test)
 
Definitive Text - HD 313.2.2 S1:1987
Base materials for printed circuits - Part 2: Specifications - Specification No. 2: Phenolic cellulose paper copper-clad laminated sheet, economic quality
 
Definitive Text - EN 123600:1996
Sectional Specification: Flex-rigid multilayer printed boards with through connections
Definitive Text - HD 203 S1:1977
Grid system for printed circuits
 
Definitive Text - EN 61192-2:2003
Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
Definitive Text - HD 313.2.10 S1:1989
Base materials for printed circuits - Part 2: Specifications - Specification No. 10: Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)
 
Definitive Text - HD 313.2.14 S1:1990
Base materials for printed circuits - Part 2: Specifications - Specification No. 14: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test), economic quality
 
Definitive Text - EN 60249-2-5:1994/A4:1995
Base materials for printed circuits - Part 2: Specifications - Specification No. 5: Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
Definitive Text - EN 123200:1992
Sectional Specification: Single and double sided printed boards with plated-through holes
Definitive Text - EN 123200:1992/A1:1995
Sectional Specification: Single and double sided printed boards with plated-through holes
Definitive Text - EN 60068-2-44:1995
Environmental testing - Part 2: Tests - Guidance on Test T: Soldering
Definitive Text - EN 60249-2-12:1994/A3:1995
Base materials for printed circuits - Part 2-12: Specifications: thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards
Definitive Text - EN 61191-3:1998
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Definitive Text - EN 61188-1-1:1997
Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies
Definitive Text - EN 61760-1:1998
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
Definitive Text - CECC 23 300-801:1998
Capability Detail Specification: Multi-layer printed boards
 
Definitive Text - CECC 23 600-801:1998
Capability Detail Specification: Flex-rigid multilayer printed boards with through connections
 
Definitive Text - CECC 23 700-801:1998
Capability Detail Specification: Flex-rigid double-sided printed boards with through connections
 
Definitive Text - CECC 23 800-801:1998
Capability Detail Specification: Flexible multilayer printed boards with through connections
 
Definitive Text - CECC 200 025:1998
Process Assessment Schedule: Printed board assembly facilities
 
Definitive Text - CECC 23 100-801:1998
Capability Detail Specification: Single and double-sided printed boards with plain holes
 
Definitive Text - CECC 23 200-801:1998
Capability Detail Specification: Single and double-sided printed boards with plated-through holes
 
Definitive Text - EN 61249-8-8:1997
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
Definitive Text - EN 61249-8-7:1996
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks
Definitive Text - EN 61188-1-2:1998
Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance
Definitive Text - EN 61249-2-19:2002
Materials for printed boards and other interconnecting structures - Part 2-19: Reinforced base materials, clad and unclad - Epoxide cross-plied linear fibreglass-reinforced laminated sheets of defined flammability (vertical burning test) copper clad
Definitive Text - EN 61760-2:1998
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
 
Definitive Text - EN 61189-3:1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
Definitive Text - EN 61189-1:1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: General test methods and methodology
Definitive Text - EN 61189-2:1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
Definitive Text - EN 62326-4:1997
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
Definitive Text - EN 60068-2-21:1997/A2:1997
Environmental testing - Part 2: Tests - Test U: Robustness of terminations and integral mounting devices
Definitive Text - EN 60068-2-21:1997/A3:1997
Environmental testing - Part 2: Tests - Test U: Robustness of terminations and integral mounting devices
Definitive Text - EN 62326-4-1:1997
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability Detail Specification - Performance levels A, B and C
Definitive Text - EN 60068-2-69:1996
Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method
Definitive Text - EN 61249-7-1:1995
Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/Invar/copper
Definitive Text - EN 123100-800:1992
Capability Detail Specification: Single and double sided printed boards with plain holes
 
Definitive Text - EN 123300-800:1992
Capability Detail Specification: Multilayer printed boards
 
Definitive Text - EN 123400-800:1992
Capability Detail Specification: Flexible printed boards without through connections
Definitive Text - EN 123500-800:1992
Capability Detail Specification: Flexible printed boards with through connections
Definitive Text - EN 61249-5-1:1996
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
Definitive Text - EN 61249-2-7:2002
Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 61189-1:1997/A1:2001
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: General test methods and methodology
Definitive Text - EN 60068-2-58:1999
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Definitive Text - EN 61249-3-4:1999
Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
 
Definitive Text - EN 61249-3-4:1999
Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
Definitive Text - EN 61249-3-4:1999
Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
 
Definitive Text - EN 61249-3-3:1999
Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film
 
Definitive Text - EN 61249-3-3:1999
Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film
Definitive Text - EN 61249-3-3:1999
Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film
 
Definitive Text - EN 61249-2-12:1999
Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad
Definitive Text - EN 61249-2-12:1999
Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad
Definitive Text - EN 61249-2-12:1999
Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad
Definitive Text - EN 61249-3-5:1999
Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
 
Definitive Text - EN 61249-3-5:1999
Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
Definitive Text - EN 61249-3-5:1999
Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
 
Definitive Text - EN 60249-2-5:1994/A5:2000
Base materials for printed circuits - Part 2: Specifications - Specification No. 5: Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
Definitive Text - EN 60068-2-77:1999
Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock
Definitive Text - EN 61192-3:2003
Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
Definitive Text - EN 61249-2-9:2003
Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine, modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 61249-2-10:2003
Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials, clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 61249-2-11:2003
Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 61249-2-21:2003
Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 61249-2-2:2005
Materials for printed boards and other interconnecting structures - Part 2-2: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad
Definitive Text - EN 61249-2-2:2005
Materials for printed boards and other interconnecting structures - Part 2-2: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad
Definitive Text - EN 61249-2-2:2005
Materials for printed boards and other interconnecting structures - Part 2-2: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad
Definitive Text - EN 62137:2004
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
Definitive Text - EN 62137:2004
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
Definitive Text - EN 62137:2004
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
Definitive Text - EN 61249-2-1:2005
Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
Definitive Text - EN 61249-2-1:2005
Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
Definitive Text - EN 61249-2-1:2005
Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
Definitive Text - EN 61249-2-6:2003
Materials for printed boards and other interconnecting structures - Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 61190-1-3:2002
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
Definitive Text - EN 61188-5-1:2002
Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
Definitive Text - EN 61190-1-1:2002
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
Definitive Text - EN 61249-2-4:2002
Materials for printed boards and other interconnecting structures - Part 2-4: Reinforced base materials, clad and unclad - Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 61188-5-2:2003
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
Definitive Text - EN 61249-2-18:2002
Materials for printed boards and other interconnecting structures - Part 2-18: Reinforced base materials, clad and unclad - Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper-clad
Definitive Text - CECC 210 003:1996
Technology Approval Schedule: Printed boards
 
Definitive Text - EN 61249-2-8:2003
Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials, clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Definitive Text - HD 313.2.9 S3:1991
Base materials for printed circuits - Part 2: Specifications - Specification No. 9: Epoxide cellulose paper core, epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test)
 
Definitive Text - HD 313.2.2 S2:1990
Base materials for printed circuits - Part 2: Specifications - Specification No. 2: Phenolic cellulose paper copper-clad laminated sheet, economic quality
 
Definitive Text - EN 123700:1996
Sectional Specification: Flex-rigid double sided printed board with through connections
Definitive Text - EN 61193-2:2007
Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
Definitive Text - EN 61193-2:2007
Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
Definitive Text - EN 61193-2:2007
Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
 
Definitive Text - EN 61189-6:2006
Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
Definitive Text - EN 61189-6:2006
Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
Definitive Text - EN 62421:2007
Electronics assembly technology - Electronic modules
Definitive Text - EN 62421:2007
Electronics assembly technology - Electronic modules
Definitive Text - HD 142 S2:1977
Terms and definitions for printed circuits
 
Definitive Text - EN 61189-2:1997/A1:2000
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
 
Definitive Text - EN 61191-4:1998
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
Definitive Text - HD 313.2.2 S3:1992
Base materials for printed circuits - Part 2: Specifications - Specification No. 2: Phenolic cellulose paper copper-clad laminated sheet, economic quality
 
Definitive Text - HD 313.1 S5:1991
Base materials for printed circuits - Part 1: Test methods
 
Definitive Text - HD 143.1 S1:1983
Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes
 
Definitive Text - HD 313.2.6 S1:1987
Base materials for printed circuits - Part 2: Specifications - Specification No. 6: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (horizontal burning test)
 
Definitive Text - HD 313.2.7 S1:1989
Base materials for printed circuits - Part 2: Specifications - Specification No. 7: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)
 
Definitive Text - EN 123500:1992/A2:1995
Sectional Specification: Flexible printed boards with through connections
Definitive Text - EN 123500:1992/A2:1995
Sectional Specification: Flexible printed boards with through connections
Definitive Text - HD 313.2.8 S1:1989
Base materials for printed circuits - Part 2: Specifications - Specification No. 8: Flexible copper-clad polyester (PETP) film
 
Definitive Text - HD 313.2.10 S3:1991
Base materials for printed circuits - Part 2: Specifications - Specification No. 10: Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)
 
Definitive Text - HD 313.2.14 S2:1992
Base materials for printed circuits - Part 2: Specifications - Specification No. 14: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test), economic quality
 
Definitive Text - CECC 23 400-800:1988
Flexible printed boards with through connections
 
Definitive Text - CECC 23 500-800:1988
Flexible printed boards with through connections
 
Definitive Text - HD 142 S3:1991
Terms and definitions for printed circuits
 
Definitive Text - EN 60097:1993
Grid systems for printed circuits
Definitive Text - HD 313.1 S4:1987
Base materials for printed circuits - Part 1: Test methods
 
Definitive Text - HD 313.2.1 S2:1990
Base materials for printed circuits - Part 2: Specifications - Specification No. 1: Phenolic cellulose paper copper-clad laminated sheet, high electrical quality
 
Definitive Text - HD 313.2.5 S2:1990
Base materials for printed circuits - Part 2: Specifications - Specification No. 5: Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
 
Definitive Text - HD 313.2.6 S2:1990
Base materials for printed circuits - Part 2: Specifications - Specification No. 6: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (horizontal burning test)
 
Definitive Text - HD 313.2.7 S2:1990
Base materials for printed circuits - Part 2: Specifications - Specification No. 7: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)
 
Definitive Text - HD 313.2.10 S2:1990
Base materials for printed circuits - Part 2: Specifications - Specifications No. 10: Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)
 
Definitive Text - HD 313.2.11 S2:1990
Base materials for printed circuits - Part 2: Specifications - Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards
 
Definitive Text - HD 313.2.12 S2:1990
Base materials for printed circuits - Part 2: Specifications - Specification No. 12: Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards
 
Definitive Text - HD 313.2.1 S1:1987
Base materials for printed circuits - Part 2: Specifications - Specification N1: Phenolic cellulose paper copper-clad laminated sheet, high electrical quality
 
Definitive Text - HD 313.2.3 S1:1989
Base materials for printed circuits - Part 2: Specifications - Specification No. 3: Epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)
 
Definitive Text - HD 313.2.4 S1:1989
Base materials for printed circuits - Part 2: Specifications - Specification No. 4: Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade
 
Definitive Text - HD 313.2.5 S1:1989
Base materials for printed circuits - Part 2: Specifications - Specification No. 5: Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
 
Definitive Text - HD 313.2.9 S1:1989
Base materials for printed circuits - Part 2: Specifications - Specification No. 9: Epoxide cellulose paper core, epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test)
 
Definitive Text - HD 313.2.11 S1:1989
Base materials for printed circuits - Part 2: Specifications - Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards
 
Definitive Text - HD 313.2.12 S1:1989
Base materials for printed circuits - Part 2: Specifications - Specification No. 12: Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards
 
Definitive Text - HD 313.2.15 S1:1991
Base materials for printed circuits - Part 2: Specifications - Specification No. 15: Flexible copper-clad polyimide film, of defined flammability
 
Definitive Text - HD 313.2.13 S1:1989
Base materials for printed circuits - Part 2: Specifications - Specification No. 13: Flexible copper-clad polyimide film, general purpose grade
 
Definitive Text - HD 323.2.21 S3:1988
Basic environmental testing procedures - Part 2: Tests - Test U: Robustness of terminations and integral mounting devices
 
Definitive Text - EN 123300:1992/A1:1995
Sectional Specification: Multilayer printed boards
Definitive Text - EN 123400:1992/A2:1995
Sectional Specification: Flexible printed boards without through connections
Definitive Text - EN 123500:1992
Sectional Specification: Flexible printed boards with through connections
Definitive Text - EN 123500:1992
Sectional Specification: Flexible printed boards with through connections
Definitive Text - EN 123100:1992/A1:1995
Sectional Specification: Single and double-sided printed boards with plain holes
Definitive Text - EN 123300:1992
Sectional Specification: Multilayer printed boards
Definitive Text - EN 123300:1992
Sectional Specification: Multilayer printed boards
Definitive Text - EN 123400:1992
Sectional Specification: Flexible printed boards without through connections
Definitive Text - EN 123400:1992
Sectional Specification: Flexible printed boards without through connections
Definitive Text - EN 123400:1992/A2:1995
Sectional Specification: Flexible printed boards without through connections
Definitive Text - EN 60249-2-5:1994
Base materials for printed circuits - Part 2: Specifications - Specification No. 5: Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
Definitive Text - EN 60249-2-5:1994/A3:1994
Base materials for printed circuits - Part 2: Specifications - Specification No. 5: Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
Definitive Text - EN 60249-2-12:1994/A2:1994
Base materials for printed circuits - Part 2-12: Specifications: thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards
Definitive Text - EN 60249-2-12:1994
Base materials for printed circuits - Part 2-12: Specifications: thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards
Definitive Text - EN 62137-1-4:2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
Definitive Text - EN 62137-1-4:2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
Definitive Text - EN 62137-1-4:2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
Definitive Text - EN 61191-6:2010
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
Definitive Text - EN 61191-6:2010
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
Definitive Text - EN 61191-6:2010
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
Definitive Text - EN 61249-2-41:2010
Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Definitive Text - EN 61249-2-42:2010
Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Definitive Text - EN 61249-2-42:2010
Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Definitive Text - EN 61249-2-42:2010
Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Definitive Text - EN 61760-3:2010
Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
Definitive Text - EN 61760-3:2010
Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
Definitive Text - EN 61760-3:2010
Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
Definitive Text - EN 61249-2-41:2010
Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Definitive Text - EN 61249-2-41:2010
Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Definitive Text - EN 61188-7:2009
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
Definitive Text - EN 61188-7:2009
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
Definitive Text - EN 62137-1-3:2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
Definitive Text - EN 62137-1-3:2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
Definitive Text - EN 62137-1-3:2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
Definitive Text - EN 62137-1-5:2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
Definitive Text - EN 62137-1-5:2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
Definitive Text - EN 62137-1-5:2009
Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
Definitive Text - EN 61190-1-2:2002
Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly
Definitive Text - EN 61249-2-5:2003
Materials for printed boards and other interconnecting structures - Part 2-5: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core / woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 61189-2:2006
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
Definitive Text - EN 61189-2:2006
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
Definitive Text - EN 61249-2-35:2009
Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Definitive Text - EN 61249-2-35:2009
Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Definitive Text - EN 61249-2-36:2009
Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Definitive Text - EN 61249-2-36:2009
Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Definitive Text - EN 61249-2-36:2009
Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Definitive Text - EN 61249-2-37:2009
Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Definitive Text - EN 61249-2-37:2009
Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Definitive Text - EN 61249-2-37:2009
Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Definitive Text - EN 61188-5-4:2007
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
Definitive Text - EN 61188-5-4:2007
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
Definitive Text - EN 61249-2-35:2009
Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Definitive Text - EN 61249-2-38:2009
Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Definitive Text - EN 61249-2-38:2009
Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Definitive Text - EN 61249-2-38:2009
Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Definitive Text - EN 60068-2-83:2011
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
Definitive Text - EN 60068-2-83:2011
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
Definitive Text - EN 60068-2-83:2011
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
Definitive Text - EN 61189-2:1997/corrigendum Aug. 1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
Definitive Text - EN 61189-2:1997/corrigendum Aug. 1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
Definitive Text - EN 61189-2:1997/corrigendum Aug. 1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
Definitive Text - EN 61249-2-5:2003/corrigendum Jul. 2005
Materials for printed boards and other interconnecting structures - Part 2-5: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core / woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 61249-2-5:2003/corrigendum Jul. 2005
Materials for printed boards and other interconnecting structures - Part 2-5: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core / woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 61249-2-5:2003/corrigendum Jul. 2005
Materials for printed boards and other interconnecting structures - Part 2-5: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core / woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 61249-2-11:2003/corrigendum Jul. 2005
Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 61249-2-11:2003/corrigendum Jul. 2005
Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 61249-2-11:2003/corrigendum Jul. 2005
Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 61249-2-7:2002/corrigendum Sep. 2005
Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 61249-2-7:2002/corrigendum Sep. 2005
Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 61249-2-7:2002/corrigendum Sep. 2005
Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 60068-2-58:2004/corrigendum Dec. 2004
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Definitive Text - EN 60068-2-58:2004/corrigendum Dec. 2004
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Definitive Text - EN 61249-2-6:2003/corrigendum Jul. 2005
Materials for printed boards and other interconnecting structures - Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 61249-2-6:2003/corrigendum Jul. 2005
Materials for printed boards and other interconnecting structures - Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 61249-2-6:2003/corrigendum Jul. 2005
Materials for printed boards and other interconnecting structures - Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 62137:2004/corrigendum Feb. 2005
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
Definitive Text - EN 62137:2004/corrigendum Feb. 2005
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
Definitive Text - EN 62137:2004/corrigendum Feb. 2005
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
Definitive Text - EN 61189-2:1997/corrigendum Apr. 1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
Definitive Text - EN 61189-2:1997/corrigendum Apr. 1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
Definitive Text - EN 61189-2:1997/corrigendum Apr. 1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
Definitive Text - EN 61249-2-10:2003/corrigendum Jul. 2005
Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials, clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 61249-2-10:2003/corrigendum Jul. 2005
Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials, clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 61249-2-10:2003/corrigendum Jul. 2005
Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials, clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 123100:1992
Sectional Specification: Single and double-sided printed boards with plain holes
Definitive Text - EN 123100:1992
Sectional Specification: Single and double-sided printed boards with plain holes
Definitive Text - EN 123100:1992/A1:1995
Sectional Specification: Single and double-sided printed boards with plain holes
Definitive Text - EN 61182-2-2:2012
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
Definitive Text - EN 61182-2-2:2012
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
Definitive Text - EN 61182-2-2:2012
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
Definitive Text - EN 61190-1-3:2007/A1:2010
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
Definitive Text - EN 61190-1-3:2007/A1:2010
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
Definitive Text - EN 61190-1-3:2007/A1:2010
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
Definitive Text - EN 61189-3:2008
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
Definitive Text - EN 61189-3:2008
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
Definitive Text - EN 123000:1991/A2:1996
Generic Specification: Printed boards
Definitive Text - EN 123000:1991/A1:1995
Generic Specification: Printed boards
Definitive Text - EN 123000:1991
Generic Specification: Printed boards
Definitive Text - EN 62326-1:1997
Printed boards - Part 1: Generic specification
 
Definitive Text - EN 60249-1:1993/A4:1994/corrigendum Mar. 1994
Base materials for printed circuits - Part 1: Test methods
Definitive Text - EN 62137-3:2012
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
Definitive Text - EN 62137-3:2012
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
Definitive Text - EN 61190-1-2:2007
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Definitive Text - EN 61190-1-2:2007
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Definitive Text - EN 62137-3:2012
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
Definitive Text - EN 60068-2-21:2006
Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
Definitive Text - EN 61193-3:2013
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
Definitive Text - EN 61193-3:2013
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
Definitive Text - EN 61189-3:2008
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
Definitive Text - EN 60068-2-21:2006
Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
Definitive Text - EN 60068-2-21:2006
Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
Definitive Text - EN 61249-2-27:2013
Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 61249-2-27:2013
Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 61249-2-27:2013
Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 61249-2-30:2013
Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 61249-2-30:2013
Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 61249-2-30:2013
Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
Definitive Text - EN 61249-2-39:2013
Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Definitive Text - EN 61249-2-39:2013
Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Definitive Text - EN 61249-2-39:2013
Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Definitive Text - EN 61249-2-40:2013
Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Definitive Text - EN 61249-2-40:2013
Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Definitive Text - EN 61249-2-40:2013
Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Definitive Text - EN 123800:1996
Sectional Specification: Flexible multilayer printed boards with through connections
Definitive Text - EN 123800:1996
Sectional Specification: Flexible multilayer printed boards with through connections
Definitive Text - EN 61193-3:2013
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
Definitive Text - EN 60068-2-82:2007
Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components
Definitive Text - EN 60068-2-82:2007
Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components
Definitive Text - EN 60068-2-82:2007
Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components
Definitive Text - EN 60068-2-20:2008
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
Definitive Text - EN 60068-2-20:2008
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
Definitive Text - EN 60068-2-20:2008
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
Definitive Text - EN 60068-2-69:2007
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
Definitive Text - EN 62739-1:2013
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
Definitive Text - EN 62739-1:2013
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
Definitive Text - EN 62739-1:2013
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
Definitive Text - EN 60068-2-69:2007
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
Definitive Text - EN 60068-2-69:2007
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
Definitive Text - EN 61249-4-18:2013
Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Definitive Text - EN 61249-4-18:2013
Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Definitive Text - EN 61249-4-18:2013
Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Definitive Text - EN 61249-4-19:2013
Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Definitive Text - EN 61249-4-19:2013
Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Definitive Text - EN 61249-4-17:2009
Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Definitive Text - EN 61249-4-17:2009
Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Definitive Text - EN 61249-4-14:2009
Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Definitive Text - EN 62137-1-1:2007
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
Definitive Text - EN 62137-1-1:2007
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
Definitive Text - EN 62137-1-1:2007
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
Definitive Text - EN 62137-1-2:2007
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
Definitive Text - EN 62137-1-2:2007
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
Definitive Text - EN 62137-1-2:2007
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
Definitive Text - EN 61249-4-17:2009
Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Definitive Text - EN 61249-4-14:2009
Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Definitive Text - EN 61249-4-14:2009
Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Definitive Text - EN 61249-4-15:2009
Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Definitive Text - EN 61249-4-15:2009
Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Definitive Text - EN 61249-4-15:2009
Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Definitive Text - EN 61191-2:2013
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
Definitive Text - EN 61191-2:2013
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
Definitive Text - EN 61191-2:2013
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
Definitive Text - EN 61191-2:1998
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
Definitive Text - EN 61189-11:2013
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
Definitive Text - EN 61189-11:2013
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
Definitive Text - EN 61189-11:2013
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
Definitive Text - EN 61249-4-19:2013
Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

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