CENELEC
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
CLC/SR 47D |
Mechanical standardization of semiconductor devices |
CLC/SR 47D Working Documents
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Reference,Title
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Downloads
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Circulation date
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Closing date
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Voting / Comments
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IEC parallel vote
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prEN 60191-1:2007 (pr=17088) Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices |
 EN |
2007-04-03 | Procedure Result | Yes | |
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FprEN 60191-4:2011 (pr=23598) Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages |
EN |
Procedure Result | Yes | ||
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FprEN 60191-6:2009 (pr=22234) Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
EN |
2009-08-21 | Procedure Result | Yes | |
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FprEN 60191-6-1:2011 (pr=23601) Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals |
EN |
Procedure Result | Yes | ||
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FprEN 60191-6-5:2010 (pr=23098) Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) |
EN |
Procedure Result | Yes | ||
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FprEN 60191-6-5:2012 (pr=23098) Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) |
EN |
Procedure Result | Yes | ||
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FprEN 60191-6-12:2010 (pr=23148) Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) |
EN |
Procedure Result | Yes | ||
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FprEN 60191-6-12:2010 (pr=23148) Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) |
EN |
Procedure Result | Yes | ||
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prEN 60191-6-13:2007 (pr=16802) Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) |
EN |
2007-06-18 | Procedure Result | Yes | |
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prEN 60191-6-16:2007 (pr=16803) Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA |
EN |
2007-04-10 | Procedure Result | Yes | |
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FprEN 60191-6-17:2010 (pr=22635) Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) |
EN |
Procedure Result | Yes | ||
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FprEN 60191-6-17:2009 (pr=22635) Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) |
EN |
2010-02-01 | Procedure Result | Yes | |
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FprEN 60191-6-18:2009 (pr=22026) Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) |
EN |
2009-12-07 | Procedure Result | Yes | |
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FprEN 60191-6-18:2008 (pr=22026) Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) |
EN |
2009-03-02 | Procedure Result | Yes | |
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FprEN 60191-6-19:2008 (pr=22027) Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage |
EN |
2009-03-02 | Procedure Result | Yes | |
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FprEN 60191-6-19:2009 (pr=22027) Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage |
EN |
2010-01-19 | Procedure Result | Yes | |
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FprEN 60191-6-20:2009 (pr=22430) Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) |
EN |
2009-10-19 | Procedure Result | Yes | |
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FprEN 60191-6-20:2010 (pr=22430) Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) |
EN |
Procedure Result | Yes | ||
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FprEN 60191-6-21:2009 (pr=22431) Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) |
EN |
2009-10-19 | Procedure Result | Yes | |
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FprEN 60191-6-21:2010 (pr=22431) Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) |
EN |
Procedure Result | Yes | ||
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FprEN 60191-6-22:2011 (pr=23888) Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) |
EN |
Procedure Result | Yes |
CLC/SR 47D Documents open for vote
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Reference,Title
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Downloads
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Circulation date
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Closing date
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Type
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IEC parallel vote
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Other Documents accessible to CLC/SR 47D
Reference,Title | Downloads |
|---|---|
Definitive Text - EN 60191-6-6:2001 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA) | |
Definitive Text - EN 60191-1:2007 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices | |
Definitive Text - EN 60191-6-16:2007 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA | |
Definitive Text - EN 60191-6-13:2007 Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) | |
Definitive Text - EN 60191-6-13:2007 Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) | |
Definitive Text - EN 60191-6-13:2007 Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) | |
Definitive Text - EN 60191-6-1:2001 Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals | |
Definitive Text - EN 60191-3:1999 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits |  |
Definitive Text - EN 60191-6:2004 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages | |
Definitive Text - EN 60191-4:1999/A2:2002 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages | |
Definitive Text - EN 60191-6-5:2001 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) | |
Definitive Text - EN 60191-6-3:2000 Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) | |
Definitive Text - EN 60191-4:1999 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages | |
Definitive Text - EN 60191-4:1999/A1:2002 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages | |
Definitive Text - EN 60191-6-18:2010 Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) | |
Definitive Text - EN 60191-6-18:2010 Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) | |
Definitive Text - EN 60191-6-18:2010 Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) | |
Definitive Text - EN 60191-6-4:2003 Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) | |
Definitive Text - EN 60191-6-10:2003 Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON | |
Definitive Text - EN 60191-6-10:2003 Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON | |
Definitive Text - EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages | |
Definitive Text - EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages | |
Definitive Text - EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages | |
Definitive Text - EN 60191-6-4:2003 Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) | |
Definitive Text - EN 60191-6-19:2010 Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage | |
Definitive Text - EN 60191-6-19:2010 Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage | |
Definitive Text - EN 60191-6-19:2010 Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage | |
Definitive Text - EN 60191-6-20:2010 Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) | |
Definitive Text - EN 60191-6-20:2010 Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) | |
Definitive Text - EN 60191-6-20:2010 Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) | |
Definitive Text - EN 60191-6-17:2011 Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) | |
Definitive Text - EN 60191-6-17:2011 Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) | |
Definitive Text - EN 60191-6-17:2011 Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) | |
Definitive Text - EN 60191-6-12:2002 Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type | |
Definitive Text - EN 60191-6-21:2010 Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) | |
Definitive Text - EN 60191-6-21:2010 Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) | |
Definitive Text - EN 60191-6-21:2010 Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) | |
Definitive Text - EN 60191-6-12:2011 Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) | |
Definitive Text - EN 60191-6-12:2011 Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) | |
Definitive Text - EN 60191-6-12:2011 Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) | |
Definitive Text - EN 60191-6-16:2007 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA | |
Definitive Text - EN 60191-6-2:2002 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages | |
Definitive Text - EN 60191-6-2:2002 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages | |
Definitive Text - EN 60191-6-8:2001 Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP) | |
Definitive Text - EN 60191-6-22:2013 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) | |
Definitive Text - EN 60191-6-22:2013 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) | |
Definitive Text - EN 60191-6-22:2013 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) | |
Definitive Text - EN 60191-6-8:2001 Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP) | |
Definitive Text - EN 60191-1:2007 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices | |
Definitive Text - EN 60191-1:2007 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices | |
Definitive Text - EN 60191-6-16:2007 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA | |
