CENELEC
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
CLC/SR 47F |
Micro-electromechanical systems |
CLC/SR 47F Working Documents
The Working documents of the technical bodies (with the exception of the voting results) are available on the Collaboration Tool.
Click here to access the Collaboration tool.
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Reference,Title
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Downloads
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Circulation date
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Closing date
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Voting / Comments
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IEC parallel vote
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FprEN 62047-5:2010 (pr=22629) Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches |
 EN |
Procedure Result | Yes | ||
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FprEN 62047-5:2011 (pr=22629) Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches |
EN |
Procedure Result | Yes | ||
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prEN 62047-6:2007 (pr=21554) Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials |
EN |
2008-04-07 | Procedure Result | Yes | |
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FprEN 62047-6:2009 (pr=21554) Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials |
EN |
2009-03-24 | Procedure Result | Yes | |
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FprEN 62047-7:2010 (pr=22658) Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection |
EN |
Procedure Result | Yes | ||
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FprEN 62047-7:2011 (pr=22658) Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection |
EN |
Procedure Result | Yes | ||
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FprEN 62047-8:2009 (pr=22628) Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films |
EN |
Procedure Result | Yes | ||
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FprEN 62047-8:2010 (pr=22628) Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films |
EN |
Procedure Result | Yes | ||
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FprEN 62047-9:2009 (pr=22644) Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS |
EN |
Procedure Result | Yes | ||
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FprEN 62047-9:2011 (pr=22644) Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS |
EN |
Procedure Result | Yes | ||
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FprEN 62047-10:2011 (pr=23075) Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials |
EN |
Procedure Result | Yes | ||
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FprEN 62047-10:2010 (pr=23075) Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials |
EN |
Procedure Result | Yes | ||
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FprEN 62047-11:2011 (pr=23953) Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems |
EN |
Procedure Result | Yes | ||
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FprEN 62047-12:2010 (pr=23076) Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures |
EN |
Procedure Result | Yes | ||
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FprEN 62047-12:2011 (pr=23076) Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures |
EN |
Procedure Result | Yes | ||
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FprEN 62047-13:2011 (pr=23280) Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures |
EN |
Procedure Result | Yes | ||
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FprEN 62047-13:2010 (pr=23280) Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures |
EN |
Procedure Result | Yes | ||
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FprEN 62047-14:2010 (pr=23220) Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials |
EN |
Procedure Result | Yes | ||
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FprEN 62047-14:2011 (pr=23220) Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials |
EN |
Procedure Result | Yes | ||
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FprEN 62047-18:2012 (pr=24073) Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials |
EN |
Procedure Result | Yes | ||
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FprEN 62047-19:2012 (pr=24006) Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses |
EN |
Procedure Result | Yes |
CLC/SR 47F Documents open for vote
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Reference,Title
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Downloads
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Circulation date
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Closing date
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Type
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IEC parallel vote
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|---|---|---|---|---|---|
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FprEN 62047-18:2013 (pr=24073) Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials |
2012-03-02 | 2013-06-28 | Draft for 2 nd // FV on FDIS | Yes |
Other Documents accessible to CLC/SR 47F
Reference,Title | Downloads |
|---|---|
Definitive Text - EN 62047-6:2010 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials | |
Definitive Text - EN 62047-12:2011 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures | |
Definitive Text - EN 62047-6:2010 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials | |
Definitive Text - EN 62047-7:2011 Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection | |
Definitive Text - EN 62047-7:2011 Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection | |
Definitive Text - EN 62047-7:2011 Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection | |
Definitive Text - EN 62047-5:2011 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches | |
Definitive Text - EN 62047-5:2011 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches | |
Definitive Text - EN 62047-5:2011 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches | |
Definitive Text - EN 62047-13:2012 Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures | |
Definitive Text - EN 62047-14:2012 Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials | |
Definitive Text - EN 62047-14:2012 Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials | |
Definitive Text - EN 62047-14:2012 Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials | |
Definitive Text - EN 62047-13:2012 Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures | |
Definitive Text - EN 62047-13:2012 Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures | |
Definitive Text - EN 62047-8:2011 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films | |
Definitive Text - EN 62047-8:2011 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films | |
Definitive Text - EN 62047-8:2011 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films | |
Definitive Text - EN 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS | |
Definitive Text - EN 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS | |
Definitive Text - EN 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS | |
Definitive Text - EN 62047-10:2011 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials | |
Definitive Text - EN 62047-10:2011 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials | |
Definitive Text - EN 62047-10:2011 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials | |
Definitive Text - EN 62047-12:2011 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures | |
Definitive Text - EN 62047-12:2011 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures | |
Definitive Text - EN 62047-6:2010 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials | |
