CENELEC - Standards Development - List of Technical Bodies - CLC/SR 47
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CENELEC
International Standards and Conformity Assessment for all electrical, electronic and related technologies

CLC/SR 47

Semiconductor devices
 
 
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CLC/SR 47 Work programme

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FprEN 60749-28:2013 (pr=24646)
Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic Discharge (ESD) Sensitivity Testing Direct contact charged device model (DC-CDM)
5060  2013-01-042013-06-172013-07-08 
FprEN 60749-42:2013 (pr=24648)
Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature humidity storage
5020  2013-01-072013-03-152013-06-21 

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CLC/SR 47 Publications

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CECC 265 001:1998 (pr=8457)
Technology Approval Schedule: Film and hybrid integrated circuits		1998-09-03  
CLC/TR 62258-4:2007 (pr=20584)
Semiconductor die products - Part 4: Questionnaire for die users and suppliers		2007-10-05 export to doc file  EN  DE
CLC/TR 62258-4:2013 (pr=23112)
Semiconductor die products - Part 4: Questionnaire for die users and suppliers		2013-01-11 export to doc file  EN  FR  DE
CLC/TR 62258-7:2007 (pr=17149)
Semiconductor die products - Part 7: XML schema for data exchange		2007-10-05 export to doc file  EN  DE
CLC/TR 62258-8:2008 (pr=21490)
Semiconductor die products - Part 8: EXPRESS model schema for data exchange		2008-08-22 export to doc file  EN  DE
EN 165000-5:1997 (pr=8456)
Film and hybrid integrated circuits - Part 5: Procedure for qualification approval		1997-12-15 export to doc file  EN
EN 60749-10:2002 (pr=13952)
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock		2002-08-14 export to doc file  EN
EN 60749-11:2002 (pr=13954)
Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method		2002-08-16 export to doc file  EN
EN 60749-12:2002 (pr=13955)
Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency		2002-08-16 export to doc file  EN
EN 60749-13:2002 (pr=13956)
Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere		2002-08-16 export to doc file  EN
EN 60749-14:2003 (pr=15155)
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)		2003-10-17 export to doc file  EN
EN 60749-15:2003 (pr=14849)
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices		2003-04-17 export to doc file  EN
EN 60749-15:2010 (pr=22407)
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices		2010-12-10 export to doc file  EN  FR  DE
EN 60749-15:2010/AC:2011 (pr=23344)
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices		2011-02-04 export to doc file  EN  FR  DE
EN 60749-16:2003 (pr=14850)
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)		2003-04-03 export to doc file  EN
EN 60749-17:2003 (pr=14863)
Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation		2003-04-17 export to doc file  EN
EN 60749-18:2003 (pr=14857)
Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)		2003-02-07 export to doc file  EN
EN 60749-19:2003 (pr=14858)
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength		2003-04-17 export to doc file  EN
EN 60749-19:2003/A1:2010 (pr=22602)
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength		2010-09-03 export to doc file  EN  FR  DE
EN 60749-1:2003 (pr=14480)
Semiconductor devices - Mechanical and climatic test methods - Part 1: General		2003-06-20 export to doc file  EN
EN 60749-20-1:2009 (pr=21364)
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat		2009-06-05 export to doc file  EN  FR  DE
EN 60749-20:2009 (pr=21363)
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat		2009-11-26 export to doc file  EN  FR  DE
EN 60749-21:2005 (pr=15553)
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability		2005-02-15 export to doc file  EN  FR  DE
EN 60749-21:2011 (pr=22642)
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability		2011-08-19 export to doc file  EN  FR  DE
EN 60749-22:2003 (pr=15494)
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength		2003-06-20 export to doc file  EN
EN 60749-23:2004 (pr=15605)
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life		2004-04-16 export to doc file  EN
EN 60749-23:2004/A1:2011 (pr=22603)
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life		2011-03-04 export to doc file  EN  FR  DE
EN 60749-24:2004 (pr=15606)
Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST		2004-04-16 export to doc file  EN  FR  DE
EN 60749-25:2003 (pr=15156)
Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling		2003-09-18 export to doc file  EN
EN 60749-26:2006 (pr=16717)
Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)		2006-08-25 export to doc file  EN  FR  DE
EN 60749-27:2006 (pr=16710)
Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)		2006-08-25 export to doc file  EN  FR  DE
EN 60749-27:2006/A1:2012 (pr=23706)
Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)		2012-11-09 export to doc file  EN  FR  DE
EN 60749-29:2003 (pr=15175)
Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test		2003-12-15 export to doc file  EN
EN 60749-29:2011 (pr=22643)
Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test		2011-08-19 export to doc file  EN  FR  DE
EN 60749-2:2002 (pr=13960)
Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure		2002-08-13 export to doc file  EN
EN 60749-30:2005 (pr=16055)
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing		2005-03-01 export to doc file  EN  FR  DE
EN 60749-30:2005/A1:2011 (pr=22605)
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing		2011-07-08 export to doc file  EN  FR  DE
EN 60749-31:2003 (pr=15495)
Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)		2003-06-20 export to doc file  EN
EN 60749-32:2003 (pr=15496)
Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)		2003-06-20 export to doc file  EN
EN 60749-32:2003/A1:2010 (pr=22604)
Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)		2010-09-03 export to doc file  EN  FR  DE
EN 60749-33:2004 (pr=15607)
Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave		2004-04-16 export to doc file  EN  FR  DE
EN 60749-34:2004 (pr=15618)
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling		2004-04-16 export to doc file  EN  FR  DE
EN 60749-34:2010 (pr=22649)
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling		2010-12-10 export to doc file  EN  FR  DE
EN 60749-35:2006 (pr=16936)
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components		2006-09-20 export to doc file  EN  FR  DE
EN 60749-36:2003 (pr=14856)
Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state		2003-04-17 export to doc file  EN
EN 60749-37:2008 (pr=17164)
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer		2008-04-11 export to doc file  EN  FR  DE
EN 60749-38:2008 (pr=20852)
Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory		2008-05-15 export to doc file  EN  FR  DE
EN 60749-39:2006 (pr=17008)
Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components		2006-08-25 export to doc file  EN  FR  DE
EN 60749-3:2002 (pr=13962)
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination		2002-08-13 export to doc file  EN
EN 60749-40:2011 (pr=22946)
Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge		2011-09-02 export to doc file  EN  FR  DE
EN 60749-4:2002 (pr=13963)
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)		2002-08-13 export to doc file  EN
EN 60749-5:2003 (pr=15008)
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test		2003-03-13 export to doc file  EN
EN 60749-6:2002 (pr=14163)
Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature		2002-08-13 export to doc file  EN
EN 60749-7:2002 (pr=13961)
Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases		2002-08-14 export to doc file  EN
EN 60749-7:2011 (pr=22606)
Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases		2011-09-09 export to doc file  EN  FR  DE
EN 60749-8:2003 (pr=15492)
Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing		2003-06-20 export to doc file  EN
EN 60749-9:2002 (pr=13951)
Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking		2002-08-14 export to doc file  EN
EN 62047-1:2006 (pr=16905)
Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions		2006-06-16 export to doc file  EN  FR  DE
EN 62047-2:2006 (pr=16781)
Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials		2006-09-20 export to doc file  EN  FR  DE
EN 62047-3:2006 (pr=16782)
Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing		2006-09-20 export to doc file  EN  FR  DE
EN 62047-4:2010 (pr=21277)
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS		2010-10-15 export to doc file  EN  FR  DE
EN 62258-1:2010 (pr=21875)
Semiconductor die products - Part 1: Procurement and use		2010-10-15 export to doc file  EN  FR  DE
EN 62258-2:2011 (pr=22625)
Semiconductor die products - Part 2: Exchange data formats		2011-07-08 export to doc file  EN  FR  DE
EN 62373:2006 (pr=16785)
Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET)		2006-08-10 export to doc file  EN  FR  DE
EN 62374-1:2010 (pr=22076)
Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers		2010-11-19 export to doc file  EN  FR  DE
EN 62374-1:2010/AC:2011 (pr=23435)
Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers		2011-04-01 export to doc file  EN
EN 62374:2007 (pr=16921)
Semiconductor devices - Time Dependent Dielectric Breakdown (TDDB) test for gate dielectric films		2007-10-19 export to doc file  EN  FR  DE
EN 62415:2010 (pr=22032)
Semiconductor devices - Constant current electromigration test		2010-06-04 export to doc file  EN  FR  DE
EN 62416:2010 (pr=22033)
Semiconductor devices - Hot carrier test on MOS transistors		2010-06-04 export to doc file  EN  FR  DE
EN 62417:2010 (pr=22034)
Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)		2010-05-07 export to doc file  EN  FR  DE
EN 62418:2010 (pr=22241)
Semiconductor devices - Metallization stress void test		2010-07-09 export to doc file  EN  FR  DE

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CLC/SR 47 Maintenance cycle

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CECC 265 001:1998 (pr=8457)
Technology Approval Schedule: Film and hybrid integrated circuits		1998-09-032003-09-032006-09-03CLC/SR 47 
CLC/TR 62258-4:2007 (pr=20584)
Semiconductor die products - Part 4: Questionnaire for die users and suppliers		2007-10-05 2013-01-11CLC/SR 47CLC/TR 62258-4:2013
CLC/TR 62258-4:2013 (pr=23112)
Semiconductor die products - Part 4: Questionnaire for die users and suppliers		2013-01-11 2021-01-11CLC/SR 47 
CLC/TR 62258-7:2007 (pr=17149)
Semiconductor die products - Part 7: XML schema for data exchange		2007-10-05 2015-10-05CLC/SR 47 
CLC/TR 62258-8:2008 (pr=21490)
Semiconductor die products - Part 8: EXPRESS model schema for data exchange		2008-08-22 2016-08-22CLC/SR 47 
EN 165000-5:1997 (pr=8456)
Film and hybrid integrated circuits - Part 5: Procedure for qualification approval		1997-12-152002-12-152005-12-15CLC/SR 47 
EN 60749-10:2002 (pr=13952)
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock		2002-08-14 2010-08-14CLC/SR 47 
EN 60749-11:2002 (pr=13954)
Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method		2002-08-16 2010-08-16CLC/SR 47 
EN 60749-12:2002 (pr=13955)
Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency		2002-08-16 2010-08-16CLC/SR 47 
EN 60749-13:2002 (pr=13956)
Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere		2002-08-16 2010-08-16CLC/SR 47 
EN 60749-14:2003 (pr=15155)
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)		2003-10-17 2011-10-17CLC/SR 47 
EN 60749-15:2003 (pr=14849)
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices		2003-04-17 2010-12-10CLC/SR 47EN 60749-15:2010
EN 60749-15:2010 (pr=22407)
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices		2010-12-10 2018-12-10CLC/SR 47 
EN 60749-15:2010/AC:2011 (pr=23344)
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices		2011-02-042016-02-042019-02-04CLC/SR 47 
EN 60749-16:2003 (pr=14850)
Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)		2003-04-03 2011-04-03CLC/SR 47 
EN 60749-17:2003 (pr=14863)
Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation		2003-04-17 2011-04-17CLC/SR 47 
EN 60749-18:2003 (pr=14857)
Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)		2003-02-07 2011-02-07CLC/SR 47 
EN 60749-19:2003 (pr=14858)
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength		2003-04-17 2011-04-17CLC/SR 47 
EN 60749-19:2003/A1:2010 (pr=22602)
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength		2010-09-03 2018-09-03CLC/SR 47 
EN 60749-1:2003 (pr=14480)
Semiconductor devices - Mechanical and climatic test methods - Part 1: General		2003-06-20 2011-06-20CLC/SR 47 
EN 60749-20-1:2009 (pr=21364)
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat		2009-06-05 2017-06-05CLC/SR 47 
EN 60749-20:2009 (pr=21363)
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat		2009-11-26 2017-11-26CLC/SR 47 
EN 60749-21:2005 (pr=15553)
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability		2005-02-15 2011-08-19CLC/SR 47EN 60749-21:2011
EN 60749-21:2011 (pr=22642)
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability		2011-08-19 2019-08-19CLC/SR 47 
EN 60749-22:2003 (pr=15494)
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength		2003-06-20 2011-06-20CLC/SR 47 
EN 60749-23:2004 (pr=15605)
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life		2004-04-16 2012-04-16CLC/SR 47 
EN 60749-23:2004/A1:2011 (pr=22603)
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life		2011-03-04 2019-03-04CLC/SR 47 
EN 60749-24:2004 (pr=15606)
Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST		2004-04-16 2012-04-16CLC/SR 47 
EN 60749-25:2003 (pr=15156)
Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling		2003-09-18 2011-09-18CLC/SR 47 
EN 60749-26:2006 (pr=16717)
Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)		2006-08-25 2014-08-25CLC/SR 47 
EN 60749-27:2006 (pr=16710)
Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)		2006-08-25 2014-08-25CLC/SR 47 
EN 60749-27:2006/A1:2012 (pr=23706)
Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)		2012-11-09 2020-11-09CLC/SR 47 
EN 60749-29:2003 (pr=15175)
Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test		2003-12-15 2011-08-19CLC/SR 47EN 60749-29:2011
EN 60749-29:2011 (pr=22643)
Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test		2011-08-19 2019-08-19CLC/SR 47 
EN 60749-2:2002 (pr=13960)
Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure		2002-08-13 2010-08-13CLC/SR 47 
EN 60749-30:2005 (pr=16055)
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing		2005-03-01 2013-03-01CLC/SR 47 
EN 60749-30:2005/A1:2011 (pr=22605)
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing		2011-07-08 2019-07-08CLC/SR 47 
EN 60749-31:2003 (pr=15495)
Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)		2003-06-20 2011-06-20CLC/SR 47 
EN 60749-32:2003 (pr=15496)
Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)		2003-06-20 2011-06-20CLC/SR 47 
EN 60749-32:2003/A1:2010 (pr=22604)
Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)		2010-09-03 2018-09-03CLC/SR 47 
EN 60749-33:2004 (pr=15607)
Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave		2004-04-16 2012-04-16CLC/SR 47 
EN 60749-34:2004 (pr=15618)
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling		2004-04-16 2010-12-10CLC/SR 47EN 60749-34:2010
EN 60749-34:2010 (pr=22649)
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling		2010-12-10 2018-12-10CLC/SR 47 
EN 60749-35:2006 (pr=16936)
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components		2006-09-20 2014-09-20CLC/SR 47 
EN 60749-36:2003 (pr=14856)
Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state		2003-04-17 2011-04-17CLC/SR 47 
EN 60749-37:2008 (pr=17164)
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer		2008-04-11 2016-04-11CLC/SR 47 
EN 60749-38:2008 (pr=20852)
Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory		2008-05-15 2016-05-15CLC/SR 47 
EN 60749-39:2006 (pr=17008)
Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components		2006-08-25 2014-08-25CLC/SR 47 
EN 60749-3:2002 (pr=13962)
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination		2002-08-13 2010-08-13CLC/SR 47 
EN 60749-40:2011 (pr=22946)
Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge		2011-09-02 2019-09-02CLC/SR 47 
EN 60749-4:2002 (pr=13963)
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)		2002-08-13 2010-08-13CLC/SR 47 
EN 60749-5:2003 (pr=15008)
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test		2003-03-13 2011-03-13CLC/SR 47 
EN 60749-6:2002 (pr=14163)
Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature		2002-08-13 2010-08-13CLC/SR 47 
EN 60749-7:2002 (pr=13961)
Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases		2002-08-14 2011-09-09CLC/SR 47EN 60749-7:2011
EN 60749-7:2011 (pr=22606)
Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases		2011-09-09 2019-09-09CLC/SR 47 
EN 60749-8:2003 (pr=15492)
Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing		2003-06-20 2011-06-20CLC/SR 47 
EN 60749-9:2002 (pr=13951)
Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking		2002-08-14 2010-08-14CLC/SR 47 
EN 62047-1:2006 (pr=16905)
Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions		2006-06-16 2014-06-16CLC/SR 47 
EN 62047-2:2006 (pr=16781)
Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials		2006-09-20 2014-09-20CLC/SR 47 
EN 62047-3:2006 (pr=16782)
Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing		2006-09-20 2014-09-20CLC/SR 47 
EN 62047-4:2010 (pr=21277)
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS		2010-10-15 2018-10-15CLC/SR 47 
EN 62258-1:2010 (pr=21875)
Semiconductor die products - Part 1: Procurement and use		2010-10-15 2018-10-15CLC/SR 47 
EN 62258-2:2011 (pr=22625)
Semiconductor die products - Part 2: Exchange data formats		2011-07-08 2019-07-08CLC/SR 47 
EN 62373:2006 (pr=16785)
Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET)		2006-08-10 2014-08-10CLC/SR 47 
EN 62374-1:2010 (pr=22076)
Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers		2010-11-19 2018-11-19CLC/SR 47 
EN 62374-1:2010/AC:2011 (pr=23435)
Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers		2011-04-012016-04-012019-04-01CLC/SR 47 
EN 62374:2007 (pr=16921)
Semiconductor devices - Time Dependent Dielectric Breakdown (TDDB) test for gate dielectric films		2007-10-19 2015-10-19CLC/SR 47 
EN 62415:2010 (pr=22032)
Semiconductor devices - Constant current electromigration test		2010-06-04 2018-06-04CLC/SR 47 
EN 62416:2010 (pr=22033)
Semiconductor devices - Hot carrier test on MOS transistors		2010-06-04 2018-06-04CLC/SR 47 
EN 62417:2010 (pr=22034)
Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)		2010-05-07 2018-05-07CLC/SR 47 
EN 62418:2010 (pr=22241)
Semiconductor devices - Metallization stress void test		2010-07-09 2018-07-09CLC/SR 47 

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TC 3 Project files


CLC/SR 47 TC/SC in figures

Current Stage
Year
Year -1
Year -2
Year -3
Year -4
Year >5
Approval stage200000
Published11911247
Withdrawn0000010

CLC/SR 47 Figures overall

Total publications
 32
Published in last 3 years
 7
Total work in progress
 15
Total proposals
 0
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CLC/SR 47 Environment

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CLC/SR 47 EU Directive(s)

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