CENELEC - Standards Development - List of Technical Bodies - CLC/SR 47D

CLC/SR 47D

Mechanical standardization of semiconductor devices

 
export to xls file

CLC/SR 47D Work programme

sort up 
Project reference
sort upsort down
Current Code
sort upsort down
Document
Init. Date
sort upsort down
Current stage
sort upsort down
Next Stage
sort upsort down
Fcst. voting date
FprEN 60191-6-5:2012 (pr=23098)
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
5060  2010-08-242012-12-102012-12-31 
FprEN 60191-6-13:2014 (pr=25310)
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
5020  2014-01-222014-03-282014-07-04 

export to xls file

CLC/SR 47D Publications

Reference, Title
sort up  
Publication date
Downloads
EN 60191-1:2007 (pr=17088)
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
2007-06-20 export to doc file  EN  FR  DE
EN 60191-3:1999 (pr=13207)
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
1999-11-16 export to doc file  EN
EN 60191-4:1999 (pr=13205)
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
1999-10-21 export to doc file  EN
EN 60191-4:1999/A1:2002 (pr=14202)
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
2002-02-05 export to doc file  EN
EN 60191-4:1999/A2:2002 (pr=14663)
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
2002-10-09 export to doc file  EN
EN 60191-4:2014 (pr=23598)
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
2014-03-21 export to doc file  EN  FR  DE
EN 60191-6-10:2003 (pr=14341)
Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
2003-12-05 export to doc file  EN  FR
EN 60191-6-12:2002 (pr=14084)
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type
2002-07-19 export to doc file  EN
EN 60191-6-12:2011 (pr=23148)
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
2011-08-05 export to doc file  EN  FR  DE
EN 60191-6-13:2007 (pr=16802)
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
2007-11-30 export to doc file  EN  FR  DE
EN 60191-6-16:2007 (pr=16803)
Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
2007-06-20 export to doc file  EN  FR  DE
EN 60191-6-17:2011 (pr=22635)
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
2011-04-15 export to doc file  EN  FR  DE
EN 60191-6-18:2010 (pr=22026)
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
2010-02-26 export to doc file  EN  FR  DE
EN 60191-6-19:2010 (pr=22027)
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
2010-05-21 export to doc file  EN  FR  DE
EN 60191-6-1:2001 (pr=14675)
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
2001-12-11 export to doc file  EN
EN 60191-6-20:2010 (pr=22430)
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
2010-10-15 export to doc file  EN  FR  DE
EN 60191-6-21:2010 (pr=22431)
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
2010-10-15 export to doc file  EN  FR  DE
EN 60191-6-22:2013 (pr=23888)
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
2013-03-15 export to doc file  EN  FR  DE
EN 60191-6-2:2002 (pr=14688)
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
2002-02-15 export to doc file  EN  FR
EN 60191-6-3:2000 (pr=13808)
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
2000-12-04 export to doc file  EN
EN 60191-6-4:2003 (pr=14805)
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
2003-07-10 export to doc file  EN  FR
EN 60191-6-5:2001 (pr=14496)
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
2001-10-22 export to doc file  EN
EN 60191-6-6:2001 (pr=14294)
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
2001-07-04 export to doc file  EN
EN 60191-6-8:2001 (pr=14497)
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
2001-10-22 export to doc file  EN  FR
EN 60191-6:2009 (pr=22234)
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
2009-12-23 export to doc file  EN  FR  DE

export to xls fileexport to xls file

CLC/SR 47D Maintenance cycle

 sort down
Publication number
sort upsort down
Date of Publication
Review date
sort upsort down
Result date
sort upsort down
Technical Comittee
sort upsort down
Project in progress
EN 60191-1:2007 (pr=17088)
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
2007-06-20 2015-06-20CLC/SR 47D 
EN 60191-3:1999 (pr=13207)
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
1999-11-16 2007-11-16CLC/SR 47D 
EN 60191-4:1999 (pr=13205)
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
1999-10-21 2014-03-21CLC/SR 47DEN 60191-4:2014
EN 60191-4:1999/A1:2002 (pr=14202)
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
2002-02-05 2014-03-21CLC/SR 47DEN 60191-4:2014
EN 60191-4:1999/A2:2002 (pr=14663)
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
2002-10-09 2014-03-21CLC/SR 47DEN 60191-4:2014
EN 60191-4:2014 (pr=23598)
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
2014-03-21 2022-03-21CLC/SR 47D 
EN 60191-6-10:2003 (pr=14341)
Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
2003-12-05 2011-12-05CLC/SR 47D 
EN 60191-6-12:2002 (pr=14084)
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type
2002-07-19 2011-08-05CLC/SR 47DEN 60191-6-12:2011
EN 60191-6-12:2011 (pr=23148)
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
2011-08-05 2019-08-05CLC/SR 47D 
EN 60191-6-13:2007 (pr=16802)
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
2007-11-30 2017-03-25CLC/SR 47DFprEN 60191-6-13:2014
EN 60191-6-16:2007 (pr=16803)
Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
2007-06-20 2015-06-20CLC/SR 47D 
EN 60191-6-17:2011 (pr=22635)
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
2011-04-15 2019-04-15CLC/SR 47D 
EN 60191-6-18:2010 (pr=22026)
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
2010-02-26 2018-02-26CLC/SR 47D 
EN 60191-6-19:2010 (pr=22027)
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
2010-05-21 2018-05-21CLC/SR 47D 
EN 60191-6-1:2001 (pr=14675)
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
2001-12-11 2009-12-11CLC/SR 47D 
EN 60191-6-20:2010 (pr=22430)
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
2010-10-15 2018-10-15CLC/SR 47D 
EN 60191-6-21:2010 (pr=22431)
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
2010-10-15 2018-10-15CLC/SR 47D 
EN 60191-6-22:2013 (pr=23888)
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
2013-03-15 2021-03-15CLC/SR 47D 
EN 60191-6-2:2002 (pr=14688)
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
2002-02-15 2010-02-15CLC/SR 47D 
EN 60191-6-3:2000 (pr=13808)
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
2000-12-04 2008-12-04CLC/SR 47D 
EN 60191-6-4:2003 (pr=14805)
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
2003-07-10 2011-07-10CLC/SR 47D 
EN 60191-6-5:2001 (pr=14496)
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
2001-10-22 2013-08-24CLC/SR 47DFprEN 60191-6-5:2012
EN 60191-6-6:2001 (pr=14294)
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
2001-07-04 2009-07-04CLC/SR 47D 
EN 60191-6-8:2001 (pr=14497)
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
2001-10-22 2009-10-22CLC/SR 47D 
EN 60191-6:2009 (pr=22234)
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
2009-12-23 2017-12-23CLC/SR 47D 

export to xls file

TC 3 Project files


CLC/SR 47D TC/SC in figures

Current Stage
Year
Year -1
Year -2
Year -3
Year -4
Year >5
Approval stage101000
Published1102417
Withdrawn000001

CLC/SR 47D Figures overall

Total publications
32
Published in last 3 years
7
Total work in progress
15
Total proposals
0
export to xls file

CLC/SR 47D Environment

Reference
Clause
Categories - Aspects
Product Life Cycle
Information
Confirmed

export to xls file

CLC/SR 47D EU Directive(s)

Reference
Stage code
Directive
OJ Status
OJ Reference
Mandate