Publication number | Date of Publication | Review date | Result date | Technical Comittee | Project in progress |
|---|
EN 60191-1:2007 (pr=17088)
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices | 2007-06-20 | | 2015-06-20 | CLC/SR 47D | |
EN 60191-3:1999 (pr=13207)
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits | 1999-11-16 | | 2007-11-16 | CLC/SR 47D | |
EN 60191-4:1999 (pr=13205)
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages | 1999-10-21 | | 2014-05-31 | CLC/SR 47D | FprEN 60191-4:201X |
EN 60191-4:1999/A1:2002 (pr=14202)
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages | 2002-02-05 | | 2014-05-31 | CLC/SR 47D | FprEN 60191-4:201X |
EN 60191-4:1999/A2:2002 (pr=14663)
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages | 2002-10-09 | | 2014-05-31 | CLC/SR 47D | FprEN 60191-4:201X |
EN 60191-6-10:2003 (pr=14341)
Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON | 2003-12-05 | | 2011-12-05 | CLC/SR 47D | |
EN 60191-6-12:2002 (pr=14084)
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type | 2002-07-19 | | 2011-08-05 | CLC/SR 47D | EN 60191-6-12:2011 |
EN 60191-6-12:2011 (pr=23148)
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) | 2011-08-05 | | 2019-08-05 | CLC/SR 47D | |
EN 60191-6-13:2007 (pr=16802)
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) | 2007-11-30 | | 2015-11-30 | CLC/SR 47D | |
EN 60191-6-16:2007 (pr=16803)
Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA | 2007-06-20 | | 2015-06-20 | CLC/SR 47D | |
EN 60191-6-17:2011 (pr=22635)
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) | 2011-04-15 | | 2019-04-15 | CLC/SR 47D | |
EN 60191-6-18:2010 (pr=22026)
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) | 2010-02-26 | | 2018-02-26 | CLC/SR 47D | |
EN 60191-6-19:2010 (pr=22027)
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage | 2010-05-21 | | 2018-05-21 | CLC/SR 47D | |
EN 60191-6-1:2001 (pr=14675)
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals | 2001-12-11 | | 2009-12-11 | CLC/SR 47D | |
EN 60191-6-20:2010 (pr=22430)
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) | 2010-10-15 | | 2018-10-15 | CLC/SR 47D | |
EN 60191-6-21:2010 (pr=22431)
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) | 2010-10-15 | | 2018-10-15 | CLC/SR 47D | |
EN 60191-6-22:2013 (pr=23888)
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) | 2013-03-15 | | 2021-03-15 | CLC/SR 47D | |
EN 60191-6-2:2002 (pr=14688)
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages | 2002-02-15 | | 2010-02-15 | CLC/SR 47D | |
EN 60191-6-3:2000 (pr=13808)
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) | 2000-12-04 | | 2008-12-04 | CLC/SR 47D | |
EN 60191-6-4:2003 (pr=14805)
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) | 2003-07-10 | | 2011-07-10 | CLC/SR 47D | |
EN 60191-6-5:2001 (pr=14496)
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) | 2001-10-22 | | 2013-08-24 | CLC/SR 47D | FprEN 60191-6-5:2012 |
EN 60191-6-6:2001 (pr=14294)
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA) | 2001-07-04 | | 2009-07-04 | CLC/SR 47D | |
EN 60191-6-8:2001 (pr=14497)
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP) | 2001-10-22 | | 2009-10-22 | CLC/SR 47D | |
EN 60191-6:2009 (pr=22234)
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages | 2009-12-23 | | 2017-12-23 | CLC/SR 47D | |