CENELEC - Standards Development - List of Technical Bodies - CLC/SR 91

CLC/SR 91

Electronics assembly technology

 
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CLC/SR 91 Work programme

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FprEN 60068-2-58:2013 (pr=25040)
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
5060  2013-08-262014-02-102014-03-03 
FprEN 61189-5-2:2013 (pr=24976)
Test methods for electrical materials, interconnection structures and assemblies - Part 5-2: Test methods for printed board assemblies: Soldering flux
5060  2013-07-292014-01-132014-02-03 
FprEN 61189-5-3:2013 (pr=24977)
Test methods for electrical materials, interconnection structures and assemblies - Part 5-3: Test methods for printed board assemblies: Soldering paste
5060  2013-07-292014-01-132014-02-03 
FprEN 61189-5-4:2013 (pr=24978)
Test methods for electrical materials, interconnection structures and assemblies - Part 5-4: Test methods for printed board assemblies: Solder alloys and fluxed and non-fluxed solid wire
5060  2013-07-292014-01-132014-02-03 
EN 61190-1-2:201X (pr=24251)
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
5099  2012-05-312014-03-262014-04-23 
FprEN 61760-4:2013 (pr=24637)
Surface mounting technology - Part 4: Standard method for classification, packaging, labelling and handling of moisture sensitive devices
5060  2013-01-032014-01-202014-02-10 
FprEN 62137-4:2013 (pr=24795)
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
5060  2013-03-282013-09-092013-09-30 
FprEN 62588:2013 (pr=24571)
Marking and labeling of components, PCBs and PCBAs to identify lead (Pb), lead-free (Pb-free) and other attributes
5060  2012-11-192013-04-222013-05-13 
FprEN 62878-1-1:2013 (pr=24979)
Device embedded substrate - Generic specification - Test method
5060  2013-07-292014-01-132014-02-03 

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CLC/SR 91 Publications

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CECC 200 025:1998 (pr=12088)
Process Assessment Schedule: Printed board assembly facilities
1998-05-04  
CECC 210 003:1996 (pr=7484)
Technology Approval Schedule: Printed boards
1996-10-15  
CECC 23 100-801:1998 (pr=8539)
Capability Detail Specification: Single and double-sided printed boards with plain holes
1998-02-27  
CECC 23 200-801:1998 (pr=8540)
Capability Detail Specification: Single and double-sided printed boards with plated-through holes
1998-02-27  
CECC 23 300-801:1998 (pr=8541)
Capability Detail Specification: Multi-layer printed boards
1998-02-27  
CECC 23 600-801:1998 (pr=8544)
Capability Detail Specification: Flex-rigid multilayer printed boards with through connections
1998-02-27  
CECC 23 700-801:1998 (pr=8545)
Capability Detail Specification: Flex-rigid double-sided printed boards with through connections
1998-02-27  
CECC 23 800-801:1998 (pr=8546)
Capability Detail Specification: Flexible multilayer printed boards with through connections
1998-02-27  
EN 123100:1992 (pr=5930)
Sectional Specification: Single and double-sided printed boards with plain holes
1992-05-01 export to doc file  EN  FR
EN 123100:1992/A1:1995 (pr=5931)
Sectional Specification: Single and double-sided printed boards with plain holes
1995-08-09 export to doc file  EN  FR
EN 123200:1992 (pr=5934)
Sectional Specification: Single and double sided printed boards with plated-through holes
1992-05-01 export to doc file  EN
EN 123200:1992/A1:1995 (pr=5935)
Sectional Specification: Single and double sided printed boards with plated-through holes
1995-08-09 export to doc file  EN
EN 123300:1992 (pr=5936)
Sectional Specification: Multilayer printed boards
1992-05-01 export to doc file  EN  FR
EN 123300:1992/A1:1995 (pr=5937)
Sectional Specification: Multilayer printed boards
1995-08-09 export to doc file  EN  FR
EN 123400-800:1992 (pr=6079)
Capability Detail Specification: Flexible printed boards without through connections
1992-05-15 export to doc file  EN
EN 123400:1992 (pr=5938)
Sectional Specification: Flexible printed boards without through connections
1992-05-01 export to doc file  EN  FR
EN 123400:1992/A2:1995 (pr=5939)
Sectional Specification: Flexible printed boards without through connections
1995-08-09 export to doc file  EN  FR
EN 123500-800:1992 (pr=6080)
Capability Detail Specification: Flexible printed boards with through connections
1992-05-15 export to doc file  EN
EN 123500:1992 (pr=5946)
Sectional Specification: Flexible printed boards with through connections
1992-05-01 export to doc file  EN  FR
EN 123500:1992/A2:1995 (pr=5947)
Sectional Specification: Flexible printed boards with through connections
1995-08-09 export to doc file  EN  FR
EN 123600:1996 (pr=1743)
Sectional Specification: Flex-rigid multilayer printed boards with through connections
1996-12-18 export to doc file  EN
EN 123700:1996 (pr=1744)
Sectional Specification: Flex-rigid double sided printed board with through connections
1996-12-18 export to doc file  EN
EN 123800:1996 (pr=1745)
Sectional Specification: Flexible multilayer printed boards with through connections
1996-12-18 export to doc file  EN  FR
EN 60068-2-20:2008 (pr=20975)
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
2008-09-25 export to doc file  EN  FR  DE
EN 60068-2-21:2006 (pr=16619)
Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
2006-07-20 export to doc file  EN  FR  DE
EN 60068-2-44:1995 (pr=5762)
Environmental testing - Part 2: Tests - Guidance on Test T: Soldering
1995-03-17 export to doc file  EN
EN 60068-2-54:2006 (pr=16241)
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
2006-08-07 export to doc file  EN  DE
EN 60068-2-58:2004 (pr=15395)
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
2004-10-01 export to doc file  EN
EN 60068-2-69:2007 (pr=17045)
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
2007-06-22 export to doc file  EN  FR  DE
EN 60068-2-77:1999 (pr=12368)
Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock
1999-04-01 export to doc file  EN
EN 60068-2-82:2007 (pr=17145)
Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components
2007-06-22 export to doc file  EN  FR  DE
EN 60068-2-83:2011 (pr=22730)
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
2011-10-14 export to doc file  EN  FR  DE
EN 60097:1993 (pr=1749)
Grid systems for printed circuits
1993-01-12 export to doc file  EN
EN 60194:2006 (pr=17109)
Printed board design, manufacture and assembly - Terms and definitions
2006-07-14 export to doc file  EN
EN 61182-2-2:2012 (pr=22770)
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
2012-06-22 export to doc file  EN  FR  DE
EN 61188-1-1:1997 (pr=8634)
Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies
1997-10-17 export to doc file  EN
EN 61188-1-2:1998 (pr=11925)
Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance
1998-08-10 export to doc file  EN
EN 61188-5-1:2002 (pr=13224)
Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
2002-10-22 export to doc file  EN
EN 61188-5-2:2003 (pr=14317)
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
2003-09-23 export to doc file  EN
EN 61188-5-3:2007 (pr=16405)
Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
2007-11-23 export to doc file  EN  DE
EN 61188-5-4:2007 (pr=16406)
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
2007-11-23 export to doc file  EN  DE
EN 61188-5-5:2007 (pr=16407)
Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
2007-11-23 export to doc file  EN  DE
EN 61188-5-6:2003 (pr=13629)
Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
2003-04-04 export to doc file  EN
EN 61188-5-8:2008 (pr=16408)
Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
2008-03-21 export to doc file  EN  DE
EN 61188-7:2009 (pr=21379)
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
2009-07-09 export to doc file  EN  DE
EN 61189-11:2013 (pr=23740)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
2013-06-28 export to doc file  EN  FR  DE
EN 61189-1:1997 (pr=8139)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: General test methods and methodology
1997-04-25 export to doc file  EN
EN 61189-1:1997/A1:2001 (pr=12908)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: General test methods and methodology
2001-10-30 export to doc file  EN
EN 61189-2:2006 (pr=16197)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
2006-09-29 export to doc file  EN  DE
EN 61189-3:2008 (pr=17167)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
2008-01-08 export to doc file  EN  FR  DE
EN 61189-5:2006 (pr=16070)
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
2006-09-29 export to doc file  EN  DE
EN 61189-6:2006 (pr=16071)
Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
2006-08-18 export to doc file  EN  DE
EN 61190-1-1:2002 (pr=13822)
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
2002-06-14 export to doc file  EN
EN 61190-1-2:2007 (pr=17131)
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
2007-06-28 export to doc file  EN  DE
EN 61190-1-3:2007 (pr=17133)
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
2007-06-28 export to doc file  EN  DE
EN 61190-1-3:2007/A1:2010 (pr=22237)
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
2010-09-10 export to doc file  EN  FR  DE
EN 61191-1:1998 (pr=12049)
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
1998-10-28 export to doc file  EN
EN 61191-1:2013 (pr=23840)
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
2013-08-30 export to doc file  EN  FR  DE
EN 61191-2:1998 (pr=12145)
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
1998-10-28 export to doc file  EN
EN 61191-2:2013 (pr=23841)
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
2013-10-04 export to doc file  EN  FR  DE
EN 61191-3:1998 (pr=12108)
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
1998-10-28 export to doc file  EN
EN 61191-4:1998 (pr=12140)
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
1998-10-28 export to doc file  EN
EN 61191-6:2010 (pr=21860)
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
2010-04-16 export to doc file  EN  FR  DE
EN 61192-1:2003 (pr=14172)
Workmanship requirements for soldered electronic assemblies - Part 1: General
2003-03-25 export to doc file  EN
EN 61192-2:2003 (pr=14219)
Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
2003-04-11 export to doc file  EN
EN 61192-3:2003 (pr=14114)
Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
2003-02-20 export to doc file  EN
EN 61192-4:2003 (pr=14115)
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
2003-03-25 export to doc file  EN
EN 61192-5:2007 (pr=16805)
Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
2007-06-27 export to doc file  EN  DE
EN 61193-1:2002 (pr=13546)
Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
2002-02-15 export to doc file  EN
EN 61193-2:2007 (pr=20503)
Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
2007-11-22 export to doc file  EN  DE
EN 61193-3:2013 (pr=22318)
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
2013-04-26 export to doc file  EN  FR  DE
EN 61249-2-10:2003 (pr=14695)
Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials, clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
2003-05-09 export to doc file  EN
EN 61249-2-11:2003 (pr=14696)
Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
2003-12-23 export to doc file  EN
EN 61249-2-12:1999 (pr=12391)
Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad
1999-04-14 export to doc file  FR
export to doc file  EN  DE
EN 61249-2-13:1999 (pr=12417)
Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper clad
1999-04-14 export to doc file  FR
export to doc file  EN  DE
EN 61249-2-18:2002 (pr=13728)
Materials for printed boards and other interconnecting structures - Part 2-18: Reinforced base materials, clad and unclad - Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper-clad
2002-03-14 export to doc file  EN
EN 61249-2-19:2002 (pr=11884)
Materials for printed boards and other interconnecting structures - Part 2-19: Reinforced base materials, clad and unclad - Epoxide cross-plied linear fibreglass-reinforced laminated sheets of defined flammability (vertical burning test) copper clad
2002-02-20 export to doc file  EN
EN 61249-2-1:2005 (pr=15267)
Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
2005-03-09 export to doc file  EN  FR  DE
EN 61249-2-21:2003 (pr=14697)
Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
2003-12-23 export to doc file  EN
EN 61249-2-22:2005 (pr=15832)
Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
2005-03-09 export to doc file  EN  FR  DE
EN 61249-2-23:2005 (pr=15947)
Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
2005-03-09 export to doc file  EN  FR  DE
EN 61249-2-26:2005 (pr=15948)
Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials, clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
2005-03-09 export to doc file  EN  FR  DE
EN 61249-2-27:2013 (pr=23132)
Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
2013-03-22 export to doc file  EN  FR  DE
EN 61249-2-2:2005 (pr=15255)
Materials for printed boards and other interconnecting structures - Part 2-2: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad
2005-03-09 export to doc file  EN  FR  DE
EN 61249-2-30:2013 (pr=23133)
Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
2013-03-22 export to doc file  EN  FR  DE
EN 61249-2-35:2009 (pr=21188)
Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
2009-03-11 export to doc file  EN  FR  DE
EN 61249-2-36:2009 (pr=21189)
Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
2009-03-11 export to doc file  EN  FR  DE
EN 61249-2-37:2009 (pr=21190)
Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
2009-03-11 export to doc file  EN  FR  DE
EN 61249-2-38:2009 (pr=21191)
Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
2009-03-11 export to doc file  EN  FR  DE
EN 61249-2-39:2013 (pr=23134)
Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
2013-03-22 export to doc file  EN  FR  DE
EN 61249-2-40:2013 (pr=23135)
Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
2013-03-22 export to doc file  EN  FR  DE
EN 61249-2-41:2010 (pr=22316)
Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
2010-05-07 export to doc file  EN  FR  DE
EN 61249-2-42:2010 (pr=22317)
Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
2010-05-07 export to doc file  EN  FR  DE
EN 61249-2-4:2002 (pr=13732)
Materials for printed boards and other interconnecting structures - Part 2-4: Reinforced base materials, clad and unclad - Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad
2002-03-15 export to doc file  EN
EN 61249-2-5:2003 (pr=14693)
Materials for printed boards and other interconnecting structures - Part 2-5: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core / woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad
2003-12-23 export to doc file  EN
EN 61249-2-6:2003 (pr=14701)
Materials for printed boards and other interconnecting structures - Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
2003-12-23 export to doc file  EN
EN 61249-2-7:2002 (pr=14912)
Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
2002-06-12 export to doc file  EN
EN 61249-2-8:2003 (pr=14702)
Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials, clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
2003-05-09 export to doc file  EN
EN 61249-2-9:2003 (pr=14694)
Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine, modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
2003-05-09 export to doc file  EN
EN 61249-3-3:1999 (pr=12390)
Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film
1999-04-15 export to doc file  FR
EN 61249-3-4:1999 (pr=12389)
Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
1999-04-15 export to doc file  FR
EN 61249-3-5:1999 (pr=12392)
Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
1999-04-15 export to doc file  FR
EN 61249-4-11:2005 (pr=15949)
Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability
2005-10-27 export to doc file  EN  FR  DE
EN 61249-4-12:2005 (pr=15950)
Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability
2005-10-27 export to doc file  EN  FR  DE
EN 61249-4-14:2009 (pr=21192)
Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
2009-06-30 export to doc file  EN  FR  DE
EN 61249-4-15:2009 (pr=21193)
Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
2009-06-30 export to doc file  EN  FR  DE
EN 61249-4-16:2009 (pr=21194)
Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
2009-06-30 export to doc file  EN  FR  DE
EN 61249-4-17:2009 (pr=21195)
Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
2009-06-30 export to doc file  EN  FR  DE
EN 61249-4-18:2013 (pr=23465)
Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
2013-12-13 export to doc file  EN  FR  DE
EN 61249-4-19:2013 (pr=23466)
Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
2013-12-13 export to doc file  EN  FR  DE
EN 61249-4-1:2008 (pr=17165)
Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
2008-05-23 export to doc file  EN  FR  DE
EN 61249-4-2:2005 (pr=15803)
Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability
2005-10-27 export to doc file  EN  DE
EN 61249-4-5:2005 (pr=15804)
Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability
2005-10-27 export to doc file  EN  DE
EN 61249-5-1:1996 (pr=6859)
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
1996-01-11 export to doc file  EN
EN 61249-5-4:1996 (pr=7420)
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks
1996-08-09 export to doc file  EN
EN 61249-7-1:1995 (pr=6117)
Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/Invar/copper
1995-07-18 export to doc file  EN
EN 61249-8-7:1996 (pr=7311)
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks
1996-08-09 export to doc file  EN
EN 61249-8-8:1997 (pr=8446)
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
1997-08-08 export to doc file  EN
EN 61760-1:2006 (pr=16365)
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
2006-07-14 export to doc file  EN  DE
EN 61760-2:2007 (pr=17134)
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
2007-06-28 export to doc file  EN  FR  DE
EN 61760-3:2010 (pr=22315)
Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
2010-04-23 export to doc file  EN  FR  DE
EN 62090:2003 (pr=14383)
Product package labels for electronic components using bar code and two- dimensional symbologies
2003-02-18 export to doc file  EN
EN 62137-1-1:2007 (pr=20501)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
2007-08-31 export to doc file  EN  FR  DE
EN 62137-1-2:2007 (pr=20502)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
2007-08-31 export to doc file  EN  FR  DE
EN 62137-1-3:2009 (pr=21446)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
2009-02-20 export to doc file  EN  FR  DE
EN 62137-1-4:2009 (pr=21587)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
2009-02-20 export to doc file  EN  FR  DE
EN 62137-1-5:2009 (pr=21581)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
2009-05-06 export to doc file  EN  FR  DE
EN 62137-3:2012 (pr=22949)
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
2012-01-20 export to doc file  EN  FR  DE
EN 62137:2004 (pr=15256)
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
2004-08-05 export to doc file  EN  FR  DE
EN 62326-1:2002 (pr=12893)
Printed boards - Part 1: Generic specification
2002-06-12 export to doc file  EN
EN 62326-4-1:1997 (pr=7799)
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability Detail Specification - Performance levels A, B and C
1997-01-15 export to doc file  EN
EN 62326-4:1997 (pr=7852)
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
1997-01-15 export to doc file  EN
EN 62421:2007 (pr=20623)
Electronics assembly technology - Electronic modules
2007-10-31 export to doc file  EN  DE
EN 62739-1:2013 (pr=24102)
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
2013-08-30 export to doc file  EN  FR  DE

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CLC/SR 91 Maintenance cycle

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CECC 200 025:1998 (pr=12088)
Process Assessment Schedule: Printed board assembly facilities
1998-05-042003-05-042006-05-04CLC/SR 91 
CECC 210 003:1996 (pr=7484)
Technology Approval Schedule: Printed boards
1996-10-152001-10-152004-10-15CLC/SR 91 
CECC 23 100-801:1998 (pr=8539)
Capability Detail Specification: Single and double-sided printed boards with plain holes
1998-02-272003-02-272006-02-27CLC/SR 91 
CECC 23 200-801:1998 (pr=8540)
Capability Detail Specification: Single and double-sided printed boards with plated-through holes
1998-02-272003-02-272006-02-27CLC/SR 91 
CECC 23 300-801:1998 (pr=8541)
Capability Detail Specification: Multi-layer printed boards
1998-02-272003-02-272006-02-27CLC/SR 91 
CECC 23 600-801:1998 (pr=8544)
Capability Detail Specification: Flex-rigid multilayer printed boards with through connections
1998-02-272003-02-272006-02-27CLC/SR 91 
CECC 23 700-801:1998 (pr=8545)
Capability Detail Specification: Flex-rigid double-sided printed boards with through connections
1998-02-272003-02-272006-02-27CLC/SR 91 
CECC 23 800-801:1998 (pr=8546)
Capability Detail Specification: Flexible multilayer printed boards with through connections
1998-02-272003-02-272006-02-27CLC/SR 91 
EN 123100:1992 (pr=5930)
Sectional Specification: Single and double-sided printed boards with plain holes
1992-05-011997-05-012000-05-01CLC/SR 91 
EN 123100:1992/A1:1995 (pr=5931)
Sectional Specification: Single and double-sided printed boards with plain holes
1995-08-092000-08-092003-08-09CLC/SR 91 
EN 123200:1992 (pr=5934)
Sectional Specification: Single and double sided printed boards with plated-through holes
1992-05-011997-05-012000-05-01CLC/SR 91 
EN 123200:1992/A1:1995 (pr=5935)
Sectional Specification: Single and double sided printed boards with plated-through holes
1995-08-092000-08-092003-08-09CLC/SR 91 
EN 123300:1992 (pr=5936)
Sectional Specification: Multilayer printed boards
1992-05-011997-05-012000-05-01CLC/SR 91 
EN 123300:1992/A1:1995 (pr=5937)
Sectional Specification: Multilayer printed boards
1995-08-092000-08-092003-08-09CLC/SR 91 
EN 123400-800:1992 (pr=6079)
Capability Detail Specification: Flexible printed boards without through connections
1992-05-151997-05-152000-05-15CLC/SR 91 
EN 123400:1992 (pr=5938)
Sectional Specification: Flexible printed boards without through connections
1992-05-011997-05-012000-05-01CLC/SR 91 
EN 123400:1992/A2:1995 (pr=5939)
Sectional Specification: Flexible printed boards without through connections
1995-08-092000-08-092003-08-09CLC/SR 91 
EN 123500-800:1992 (pr=6080)
Capability Detail Specification: Flexible printed boards with through connections
1992-05-151997-05-152000-05-15CLC/SR 91 
EN 123500:1992 (pr=5946)
Sectional Specification: Flexible printed boards with through connections
1992-05-011997-05-012000-05-01CLC/SR 91 
EN 123500:1992/A2:1995 (pr=5947)
Sectional Specification: Flexible printed boards with through connections
1995-08-092000-08-092003-08-09CLC/SR 91 
EN 123600:1996 (pr=1743)
Sectional Specification: Flex-rigid multilayer printed boards with through connections
1996-12-182001-12-182004-12-18CLC/SR 91 
EN 123700:1996 (pr=1744)
Sectional Specification: Flex-rigid double sided printed board with through connections
1996-12-182001-12-182004-12-18CLC/SR 91 
EN 123800:1996 (pr=1745)
Sectional Specification: Flexible multilayer printed boards with through connections
1996-12-182001-12-182004-12-18CLC/SR 91 
EN 60068-2-20:2008 (pr=20975)
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
2008-09-25 2016-09-25CLC/SR 91 
EN 60068-2-21:2006 (pr=16619)
Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
2006-07-20 2014-07-20CLC/SR 91 
EN 60068-2-44:1995 (pr=5762)
Environmental testing - Part 2: Tests - Guidance on Test T: Soldering
1995-03-17 2003-03-17CLC/SR 91 
EN 60068-2-54:2006 (pr=16241)
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
2006-08-07 2014-08-07CLC/SR 91 
EN 60068-2-58:2004 (pr=15395)
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
2004-10-01 2016-10-29CLC/SR 91FprEN 60068-2-58:2013
EN 60068-2-69:2007 (pr=17045)
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
2007-06-22 2015-06-22CLC/SR 91 
EN 60068-2-77:1999 (pr=12368)
Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock
1999-04-01 2007-04-01CLC/SR 91 
EN 60068-2-82:2007 (pr=17145)
Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components
2007-06-22 2015-06-22CLC/SR 91 
EN 60068-2-83:2011 (pr=22730)
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
2011-10-14 2019-10-14CLC/SR 91 
EN 60097:1993 (pr=1749)
Grid systems for printed circuits
1993-01-12 2001-01-12CLC/SR 91 
EN 60194:2006 (pr=17109)
Printed board design, manufacture and assembly - Terms and definitions
2006-07-14 2014-07-14CLC/SR 91 
EN 61182-2-2:2012 (pr=22770)
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
2012-06-22 2020-06-22CLC/SR 91 
EN 61188-1-1:1997 (pr=8634)
Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies
1997-10-17 2005-10-17CLC/SR 91 
EN 61188-1-2:1998 (pr=11925)
Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance
1998-08-10 2006-08-10CLC/SR 91 
EN 61188-5-1:2002 (pr=13224)
Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
2002-10-22 2010-10-22CLC/SR 91 
EN 61188-5-2:2003 (pr=14317)
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
2003-09-23 2011-09-23CLC/SR 91 
EN 61188-5-3:2007 (pr=16405)
Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
2007-11-23 2015-11-23CLC/SR 91 
EN 61188-5-4:2007 (pr=16406)
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
2007-11-23 2015-11-23CLC/SR 91 
EN 61188-5-5:2007 (pr=16407)
Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
2007-11-23 2015-11-23CLC/SR 91 
EN 61188-5-6:2003 (pr=13629)
Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
2003-04-04 2011-04-04CLC/SR 91 
EN 61188-5-8:2008 (pr=16408)
Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
2008-03-21 2016-03-21CLC/SR 91 
EN 61188-7:2009 (pr=21379)
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
2009-07-09 2017-07-09CLC/SR 91 
EN 61189-11:2013 (pr=23740)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
2013-06-28 2021-06-28CLC/SR 91 
EN 61189-1:1997 (pr=8139)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: General test methods and methodology
1997-04-25 2005-04-25CLC/SR 91 
EN 61189-1:1997/A1:2001 (pr=12908)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 1: General test methods and methodology
2001-10-30 2009-10-30CLC/SR 91 
EN 61189-2:2006 (pr=16197)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
2006-09-29 2014-09-29CLC/SR 91 
EN 61189-3:2008 (pr=17167)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
2008-01-08 2016-01-08CLC/SR 91 
EN 61189-5:2006 (pr=16070)
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
2006-09-29 2014-09-29CLC/SR 91 
EN 61189-6:2006 (pr=16071)
Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
2006-08-18 2014-08-18CLC/SR 91 
EN 61190-1-1:2002 (pr=13822)
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
2002-06-14 2010-06-14CLC/SR 91 
EN 61190-1-2:2007 (pr=17131)
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
2007-06-28 2015-05-29CLC/SR 91EN 61190-1-2:201X
EN 61190-1-3:2007 (pr=17133)
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
2007-06-28 2015-06-28CLC/SR 91 
EN 61190-1-3:2007/A1:2010 (pr=22237)
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
2010-09-10 2018-09-10CLC/SR 91 
EN 61191-1:1998 (pr=12049)
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
1998-10-28 2013-08-30CLC/SR 91EN 61191-1:2013
EN 61191-1:2013 (pr=23840)
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
2013-08-30 2021-08-30CLC/SR 91 
EN 61191-2:1998 (pr=12145)
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
1998-10-28 2013-10-04CLC/SR 91EN 61191-2:2013
EN 61191-2:2013 (pr=23841)
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
2013-10-04 2021-10-04CLC/SR 91 
EN 61191-3:1998 (pr=12108)
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
1998-10-28 2006-10-28CLC/SR 91 
EN 61191-4:1998 (pr=12140)
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
1998-10-28 2006-10-28CLC/SR 91 
EN 61191-6:2010 (pr=21860)
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
2010-04-16 2018-04-16CLC/SR 91 
EN 61192-1:2003 (pr=14172)
Workmanship requirements for soldered electronic assemblies - Part 1: General
2003-03-25 2011-03-25CLC/SR 91 
EN 61192-2:2003 (pr=14219)
Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
2003-04-11 2011-04-11CLC/SR 91 
EN 61192-3:2003 (pr=14114)
Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
2003-02-20 2011-02-20CLC/SR 91 
EN 61192-4:2003 (pr=14115)
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
2003-03-25 2011-03-25CLC/SR 91 
EN 61192-5:2007 (pr=16805)
Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
2007-06-27 2015-06-27CLC/SR 91 
EN 61193-1:2002 (pr=13546)
Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
2002-02-15 2010-02-15CLC/SR 91 
EN 61193-2:2007 (pr=20503)
Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
2007-11-22 2015-11-22CLC/SR 91 
EN 61193-3:2013 (pr=22318)
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
2013-04-26 2021-04-26CLC/SR 91 
EN 61249-2-10:2003 (pr=14695)
Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials, clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
2003-05-09 2011-05-09CLC/SR 91 
EN 61249-2-11:2003 (pr=14696)
Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
2003-12-23 2011-12-23CLC/SR 91 
EN 61249-2-12:1999 (pr=12391)
Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad
1999-04-14 2007-04-14CLC/SR 91 
EN 61249-2-13:1999 (pr=12417)
Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper clad
1999-04-14 2007-04-14CLC/SR 91 
EN 61249-2-18:2002 (pr=13728)
Materials for printed boards and other interconnecting structures - Part 2-18: Reinforced base materials, clad and unclad - Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper-clad
2002-03-14 2010-03-14CLC/SR 91 
EN 61249-2-19:2002 (pr=11884)
Materials for printed boards and other interconnecting structures - Part 2-19: Reinforced base materials, clad and unclad - Epoxide cross-plied linear fibreglass-reinforced laminated sheets of defined flammability (vertical burning test) copper clad
2002-02-20 2010-02-20CLC/SR 91 
EN 61249-2-1:2005 (pr=15267)
Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
2005-03-09 2013-03-09CLC/SR 91 
EN 61249-2-21:2003 (pr=14697)
Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
2003-12-23 2011-12-23CLC/SR 91 
EN 61249-2-22:2005 (pr=15832)
Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
2005-03-09 2013-03-09CLC/SR 91 
EN 61249-2-23:2005 (pr=15947)
Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
2005-03-092010-03-092013-03-09CLC/SR 91 
EN 61249-2-26:2005 (pr=15948)
Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials, clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
2005-03-09 2013-03-09CLC/SR 91 
EN 61249-2-27:2013 (pr=23132)
Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
2013-03-22 2021-03-22CLC/SR 91 
EN 61249-2-2:2005 (pr=15255)
Materials for printed boards and other interconnecting structures - Part 2-2: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad
2005-03-09 2013-03-09CLC/SR 91 
EN 61249-2-30:2013 (pr=23133)
Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
2013-03-22 2021-03-22CLC/SR 91 
EN 61249-2-35:2009 (pr=21188)
Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
2009-03-11 2017-03-11CLC/SR 91 
EN 61249-2-36:2009 (pr=21189)
Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
2009-03-11 2017-03-11CLC/SR 91 
EN 61249-2-37:2009 (pr=21190)
Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
2009-03-11 2017-03-11CLC/SR 91 
EN 61249-2-38:2009 (pr=21191)
Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
2009-03-11 2017-03-11CLC/SR 91 
EN 61249-2-39:2013 (pr=23134)
Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
2013-03-22 2021-03-22CLC/SR 91 
EN 61249-2-40:2013 (pr=23135)
Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
2013-03-22 2021-03-22CLC/SR 91 
EN 61249-2-41:2010 (pr=22316)
Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
2010-05-07 2018-05-07CLC/SR 91 
EN 61249-2-42:2010 (pr=22317)
Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
2010-05-07 2018-05-07CLC/SR 91 
EN 61249-2-4:2002 (pr=13732)
Materials for printed boards and other interconnecting structures - Part 2-4: Reinforced base materials, clad and unclad - Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad
2002-03-15 2010-03-15CLC/SR 91 
EN 61249-2-5:2003 (pr=14693)
Materials for printed boards and other interconnecting structures - Part 2-5: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core / woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad
2003-12-23 2011-12-23CLC/SR 91 
EN 61249-2-6:2003 (pr=14701)
Materials for printed boards and other interconnecting structures - Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
2003-12-23 2011-12-23CLC/SR 91 
EN 61249-2-7:2002 (pr=14912)
Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
2002-06-12 2010-06-12CLC/SR 91 
EN 61249-2-8:2003 (pr=14702)
Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials, clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
2003-05-09 2011-05-09CLC/SR 91 
EN 61249-2-9:2003 (pr=14694)
Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine, modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
2003-05-09 2011-05-09CLC/SR 91 
EN 61249-3-3:1999 (pr=12390)
Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film
1999-04-15 2007-04-15CLC/SR 91 
EN 61249-3-4:1999 (pr=12389)
Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
1999-04-15 2007-04-15CLC/SR 91 
EN 61249-3-5:1999 (pr=12392)
Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
1999-04-15 2007-04-15CLC/SR 91 
EN 61249-4-11:2005 (pr=15949)
Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability
2005-10-27 2013-10-27CLC/SR 91 
EN 61249-4-12:2005 (pr=15950)
Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability
2005-10-27 2013-10-27CLC/SR 91 
EN 61249-4-14:2009 (pr=21192)
Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
2009-06-30 2017-06-30CLC/SR 91 
EN 61249-4-15:2009 (pr=21193)
Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
2009-06-30 2017-06-30CLC/SR 91 
EN 61249-4-16:2009 (pr=21194)
Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
2009-06-30 2017-06-30CLC/SR 91 
EN 61249-4-17:2009 (pr=21195)
Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
2009-06-30 2017-06-30CLC/SR 91 
EN 61249-4-18:2013 (pr=23465)
Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
2013-12-13 2021-12-13CLC/SR 91 
EN 61249-4-19:2013 (pr=23466)
Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
2013-12-13 2021-12-13CLC/SR 91 
EN 61249-4-1:2008 (pr=17165)
Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
2008-05-23 2016-05-23CLC/SR 91 
EN 61249-4-2:2005 (pr=15803)
Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability
2005-10-27 2013-10-27CLC/SR 91 
EN 61249-4-5:2005 (pr=15804)
Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability
2005-10-27 2013-10-27CLC/SR 91 
EN 61249-5-1:1996 (pr=6859)
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
1996-01-11 2004-01-11CLC/SR 91 
EN 61249-5-4:1996 (pr=7420)
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks
1996-08-09 2004-08-09CLC/SR 91 
EN 61249-7-1:1995 (pr=6117)
Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/Invar/copper
1995-07-18 2003-07-18CLC/SR 91 
EN 61249-8-7:1996 (pr=7311)
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks
1996-08-09 2004-08-09CLC/SR 91 
EN 61249-8-8:1997 (pr=8446)
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
1997-08-08 2005-08-08CLC/SR 91 
EN 61760-1:2006 (pr=16365)
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
2006-07-14 2014-07-14CLC/SR 91 
EN 61760-2:2007 (pr=17134)
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
2007-06-28 2015-06-28CLC/SR 91 
EN 61760-3:2010 (pr=22315)
Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
2010-04-23 2018-04-23CLC/SR 91 
EN 62090:2003 (pr=14383)
Product package labels for electronic components using bar code and two- dimensional symbologies
2003-02-18 2011-02-18CLC/SR 91 
EN 62137-1-1:2007 (pr=20501)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
2007-08-31 2015-08-31CLC/SR 91 
EN 62137-1-2:2007 (pr=20502)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
2007-08-31 2015-08-31CLC/SR 91 
EN 62137-1-3:2009 (pr=21446)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
2009-02-20 2017-02-20CLC/SR 91 
EN 62137-1-4:2009 (pr=21587)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
2009-02-20 2017-02-20CLC/SR 91 
EN 62137-1-5:2009 (pr=21581)
Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
2009-05-06 2017-05-06CLC/SR 91 
EN 62137-3:2012 (pr=22949)
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
2012-01-20 2020-01-20CLC/SR 91 
EN 62137:2004 (pr=15256)
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
2004-08-05 2012-08-05CLC/SR 91 
EN 62326-1:2002 (pr=12893)
Printed boards - Part 1: Generic specification
2002-06-12 2010-06-12CLC/SR 91 
EN 62326-4-1:1997 (pr=7799)
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability Detail Specification - Performance levels A, B and C
1997-01-15 2005-01-15CLC/SR 91 
EN 62326-4:1997 (pr=7852)
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
1997-01-15 2005-01-15CLC/SR 91 
EN 62421:2007 (pr=20623)
Electronics assembly technology - Electronic modules
2007-10-31 2015-10-31CLC/SR 91 
EN 62739-1:2013 (pr=24102)
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
2013-08-30 2021-08-30CLC/SR 91 

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TC 3 Project files


CLC/SR 91 TC/SC in figures

Current Stage
Year
Year -1
Year -2
Year -3
Year -4
Year >5
Proposal stage100000
Approval stage620000
Published011215115
Approved100000
Withdrawn00000135

CLC/SR 91 Figures overall

Total publications
32
Published in last 3 years
7
Total work in progress
15
Total proposals
0
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CLC/SR 91 Environment

Reference
Clause
Categories - Aspects
Product Life Cycle
Information
Confirmed
EN 61189-2:1997 (pr=8140)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
9.6.6 Emissions to air Manufacturing, Use B2B, B2C Y
9.7.6 Emissions to air Manufacturing, Use B2B, B2C
8.12 Hazardous substances Manufacturing B2B
EN 61190-1-3:2007 (pr=17133)
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
5.1 Resource use Raw Material, Manufacturing, Recovery B2B, B2C Y
EN 61249-2-1:2005 (pr=15267)
Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
8 Others Raw Material, Manufacturing, Use, Recovery, Disposal B2B, B2C Y
EN 61249-2-5:2003 (pr=14693)
Materials for printed boards and other interconnecting structures - Part 2-5: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core / woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad
8 Others Raw Material, Manufacturing, Use, Recovery, Disposal B2B, B2C Y
EN 61249-2-6:2003 (pr=14701)
Materials for printed boards and other interconnecting structures - Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
8 Others Raw Material, Manufacturing, Use, Recovery, Disposal B2B, B2C Y
EN 61249-2-11:2003 (pr=14696)
Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
8 Others Raw Material, Manufacturing, Use, Recovery, Disposal B2B, B2C Y
EN 61249-2-21:2003 (pr=14697)
Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
All Hazardous substances Raw Material, Manufacturing, Use, Recovery, Disposal B2B, B2C Y
8 Others Raw Material, Manufacturing, Use, Recovery, Disposal B2B, B2C
EN 61249-2-22:2005 (pr=15832)
Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
All Hazardous substances Raw Material, Manufacturing, Use, Recovery, Disposal B2B, B2C Y
8 Others Raw Material, Manufacturing, Use, Recovery, Disposal B2B, B2C
EN 61249-2-23:2005 (pr=15947)
Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad
All Hazardous substances Raw Material, Manufacturing, Use, Recovery, Disposal B2B, B2C Y
8 Others Raw Material, Manufacturing, Use, Recovery, Disposal B2B, B2C
EN 61249-2-26:2005 (pr=15948)
Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials, clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
All Hazardous substances Raw Material, Manufacturing, Use, Recovery, Disposal B2B, B2C Y
All Hazardous substances Raw Material, Manufacturing, Use, Recovery, Disposal B2B, B2C
8 Others Raw Material, Manufacturing, Use, Recovery, Disposal B2B, B2C
8 Others Raw Material, Manufacturing, Use, Recovery, Disposal B2B, B2C
EN 61249-4-2:2005 (pr=15803)
Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability
8 Others Raw Material, Manufacturing, Use, Recovery, Disposal B2B, B2C Y
EN 61249-4-5:2005 (pr=15804)
Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability
8 Others Raw Material, Manufacturing, Use, Recovery, Disposal B2B, B2C Y
EN 61249-4-11:2005 (pr=15949)
Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability
All Hazardous substances Raw Material, Manufacturing, Use, Recovery, Disposal B2B, B2C Y
8 Others Raw Material, Manufacturing, Use, Recovery, Disposal B2B, B2C

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CLC/SR 91 EU Directive(s)

Reference
Stage code
Directive
OJ Status
OJ Reference
Mandate