EN 60747-16-10:2004
(pr=15449)
Dispositifs à semiconducteurs - Partie 16-10: Format-cadre pour agrément de technologie (TAS) pour circuits intégrés monolithiques hyperfréquences |
none |
Emissions to air |
Raw Material not covered, Manufacturing not covered |
B2B not covered |
Y |
| none |
Emissions to air |
Raw Material not covered, Manufacturing not covered |
B2B not covered |
| none |
Emissions to air |
Raw Material not covered, Manufacturing not covered |
B2B not covered |
| none |
Emissions to soil |
Raw Material not covered, Manufacturing not covered |
B2B not covered |
| none |
Emissions to soil |
Raw Material not covered, Manufacturing not covered |
B2B not covered |
| none |
Emissions to water |
Raw Material not covered, Manufacturing not covered |
B2B not covered |
| none |
Emissions to water |
Raw Material not covered, Manufacturing not covered |
B2B not covered |
| 3 |
Energy use |
Raw Material not covered, Manufacturing not covered |
B2B not covered |
| none |
Hazardous substances |
Raw Material not covered, Manufacturing not covered |
B2B not covered |
| none |
Hazardous substances |
Raw Material not covered, Manufacturing not covered |
B2B not covered |
| 7.4 |
Resource use |
Raw Material, Manufacturing |
B2B |
| 5.4 |
Resource use |
Raw Material, Manufacturing |
B2B |
| 8.3 |
Resource use |
Raw Material, Manufacturing |
B2B |
| none |
Risks to the environment from accidents or misuse |
Raw Material not covered, Manufacturing not covered |
B2B not covered |
| none |
Risks to the environment from accidents or misuse |
Raw Material not covered, Manufacturing not covered |
B2B not covered |
| none |
Risks to the environment from accidents or misuse |
Raw Material not covered, Manufacturing not covered |
B2B not covered |
| none |
Waste |
Raw Material not covered, Manufacturing not covered |
B2B not covered |
| 9.6 |
Waste |
Manufacturing |
B2B |