CENELEC - Standards Development - List of Technical Bodies - CLC/SR 47F
Button back to homepage

CENELEC
International Standards and Conformity Assessment for all electrical, electronic and related technologies

CLC/SR 47F

Micro-electromechanical systems
 
 
export to xls file

CLC/SR 47F Work programme

sort up 
Project reference
sort upsort down
Current Code
sort upsort down
Document
Init. Date
sort upsort down
Current stage
sort upsort down
Next Stage
sort upsort down
Fcst. voting date
FprEN 62047-11:2013 (pr=23953)
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
5020  2011-12-212013-04-262013-06-28 
FprEN 62047-18:2013 (pr=24073)
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
5020  2012-02-292013-04-262013-06-28 
FprEN 62047-19:2013 (pr=24006)
Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
5020  2012-01-252013-04-262013-06-28 
FprEN 62047-20:2013 (pr=24671)
Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
5020  2013-01-152013-05-172013-09-06 
FprEN 62047-21:2013 (pr=24672)
Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
5020  2013-01-152013-04-052013-07-05 
FprEN 62047-22:2013 (pr=24695)
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
5020  2013-01-232013-03-292013-07-05 

export to xls file

CLC/SR 47F Publications

Reference, Title
sort up  
Publication date
sort up sort down
Downloads
EN 62047-10:2011 (pr=23075)
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials		2011-09-09 export to doc file  EN  FR  DE
EN 62047-12:2011 (pr=23076)
Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures		2011-10-21 export to doc file  EN  FR  DE
EN 62047-13:2012 (pr=23280)
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures		2012-04-06 export to doc file  EN  FR  DE
EN 62047-14:2012 (pr=23220)
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials		2012-04-06 export to doc file  EN  FR  DE
EN 62047-5:2011 (pr=22629)
Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches		2011-08-19 export to doc file  EN  FR  DE
EN 62047-6:2010 (pr=21554)
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials		2010-03-05 export to doc file  EN  FR  DE
EN 62047-7:2011 (pr=22658)
Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection		2011-08-05 export to doc file  EN  FR  DE
EN 62047-8:2011 (pr=22628)
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films		2011-05-06 export to doc file  EN  FR  DE
EN 62047-9:2011 (pr=22644)
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS		2011-08-19 export to doc file  EN  FR  DE

export to xls fileexport to xls file

CLC/SR 47F Maintenance cycle

 sort down
Publication number
sort upsort down
Date of Publication
Review date
sort upsort down
Result date
sort upsort down
Technical Comittee
sort upsort down
Project in progress
EN 62047-10:2011 (pr=23075)
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials		2011-09-09 2019-09-09CLC/SR 47F 
EN 62047-12:2011 (pr=23076)
Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures		2011-10-21 2019-10-21CLC/SR 47F 
EN 62047-13:2012 (pr=23280)
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures		2012-04-06 2020-04-06CLC/SR 47F 
EN 62047-14:2012 (pr=23220)
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials		2012-04-06 2020-04-06CLC/SR 47F 
EN 62047-5:2011 (pr=22629)
Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches		2011-08-19 2019-08-19CLC/SR 47F 
EN 62047-6:2010 (pr=21554)
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials		2010-03-05 2018-03-05CLC/SR 47F 
EN 62047-7:2011 (pr=22658)
Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection		2011-08-05 2019-08-05CLC/SR 47F 
EN 62047-8:2011 (pr=22628)
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films		2011-05-06 2019-05-06CLC/SR 47F 
EN 62047-9:2011 (pr=22644)
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS		2011-08-19 2019-08-19CLC/SR 47F 

export to xls file

TC 3 Project files


CLC/SR 47F TC/SC in figures

Current Stage
Year
Year -1
Year -2
Year -3
Year -4
Year >5
Approval stage600000
Published026100

CLC/SR 47F Figures overall

Total publications
 32
Published in last 3 years
 7
Total work in progress
 15
Total proposals
 0
export to xls file

CLC/SR 47F Environment

Reference
Clause
Categories - Aspects
Product Life Cycle
Information
Confirmed

export to xls file

CLC/SR 47F EU Directive(s)

Reference
Stage code
Directive
OJ Status
OJ Reference
Mandate

 
Share facebook linkedIn linkedIn
Privacy | Contact
Copyright © CENELEC . All rights reserved.