International Standards and Conformity Assessment for all electrical, electronic and related technologies

 

Project

Reference EN 62047-9:2011
Title Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
Project Number 22644
Abstract/Scope IEC 62047-9:2011 describes bonding strength measurement method of wafer to wafer bonding, type of bonding process such as silicon to silicon fusion bonding, silicon to glass anodic bonding, etc., and applicable structure size during MEMS processing/assembly. The applicable wafer thickness is in the range of 10 ohmm to several millimeters. The contents of the corrigendum of March 2012 have been included in this copy.
Status
Published

Status

Current Stage code 6060
Current Stage code date 2011-08-19
Current Stage code deadline 2012-05-17
Deadline date for vote  

Legal

Directive(s)  
Mandate(s)  
Order Voucher  

Details

IEC Technical Body IEC/SC 47F
Reference Document IEC 62047-9:2011 (EQV) + corrigendum Mar. 2012 (EQV)
ICS 31.080.99 - Other semiconductor devices
Keywords Semiconductor; Micro-electromechanical; Wafer to wafer; Bonding strength; MEMS
Note  
A-Deviation(s)  
Special National Condition(s)  

Environment

Clause
Categories - Aspects
Product Life Cycle
Information

History

Stage
Date
Deadline Date
Documents
6060 2011-08-19 2012-05-17 export to doc file  EN  FR  DE
5099 2011-08-17 2011-09-14  
5060 2011-06-27 2011-07-18 export to doc file  EN
5020 2011-04-22 2011-06-24  
3090 2010-08-27 2010-11-30  
5060 2010-02-08 2010-02-22 export to doc file  EN
5020 2009-09-04 2010-02-05  
1090 2009-09-01 2009-09-04  

Implementation Dates

date of Ratification (DOR) (1) 2011-08-17
date of Availability (DAV) (2) 2011-08-19
date of Announcement (DOA) (3) 2011-11-17
date of Publication (DOP) (4) 2012-05-17
date of Withdrawal (DOW) (5) 2014-08-17

Relations

Supersedes  
Superseded by  
Normative reference (6) ISO 6892-1:2009
EN 60749-19
ASTM E399-06e2:2008

(1) Date of ratification (dor) date when the Technical Board notes the approval of an EN (and HD for CENELEC), from which time the standard may be said to be approved


(2) Date of availability (dav) date when the definitive text in the official language versions of an approved CEN/CENELEC publication is distributed by the Central Secretariat


(3) Date of announcement (doa) latest date by which the existence of an EN (and HD for CENELEC), a TS or a CWA has to be announced at national level


(4) Date of publication (dop) latest date by which an EN has to be implemented at national level by publication of an identical national standard or by endorsement


(5) Date of withdrawal (dow) latest date by which national standards conflicting with an EN (and HD for CENELEC) have to be withdrawn


(6) This list of normative references is purely indicative. The only official list of normative reference is the list of the published standard.