International Standards and Conformity Assessment for all electrical, electronic and related technologies

 

Project

Reference EN 61191-6:2010
Title Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
Project Number 21860
Abstract/Scope IEC 61191-6:2010 specifies the evaluation criteria for voids on the scale of the thermal cycle life, and the measurement method of voids using X-ray observation. This part of IEC 61191 is applicable to the voids generated in the solder joints of BGA and LGA soldered on a board. This part of IEC 61191 is not applicable to the BGA package itself before it is assembled on a board. This standard is applicable also to devices having joints made by melt and re-solidification, such as flip chip devices and multi-chip modules, in addition to BGA and LGA. This standard is not applicable to joints with under-fill between a device and a board, or to solder joints within a device package. This standard is applicable to macrovoids of the sizes of from 10 µm to several hundred micrometres generated in a soldered joint, but is not applicable to smaller voids (typically, planar microvoids) with a size of smaller than 10 µm in diameter. This standard is intended for evaluation purposes and is applicable to research studies, off-line production process control and reliability assessment of assembly.
Status
Published

Status

Current Stage code 6060
Current Stage code date 2010-04-16
Current Stage code deadline 2011-01-01
Deadline date for vote  

Legal

Directive(s)  
Mandate(s)  
Order Voucher  

Details

IEC Technical Body IEC/TC 91
Reference Document IEC 61191-6:2010 (EQV)
ICS 31.180 - Printed circuits and boards
Keywords Printed board; Void; Joints; BGA; LGA
Note  
A-Deviation(s)  
Special National Condition(s)  

Environment

Clause
Categories - Aspects
Product Life Cycle
Information

History

Stage
Date
Deadline Date
Documents
6060 2010-04-16 2011-01-01 export to doc file  EN  FR  DE
5099 2010-04-01 2010-06-01  
5061 2010-02-22 2010-04-01  
5060 2009-12-22 2010-01-05 export to doc file  EN
5020 2009-10-16 2009-12-18  
3090 2009-08-14 2009-08-31  
5060 2008-10-06 2008-10-20 export to doc file  EN
5020 2008-05-02 2008-10-03  
1090 2008-04-29 2008-05-02  

Implementation Dates

date of Ratification (DOR) (1) 2010-04-01
date of Availability (DAV) (2) 2010-04-16
date of Announcement (DOA) (3) 2010-07-01
date of Publication (DOP) (4) 2011-01-01
date of Withdrawal (DOW) (5) 2013-04-01

Relations

Supersedes  
Superseded by  
Normative reference (6) EN 60068-1
EN 60194

(1) Date of ratification (dor) date when the Technical Board notes the approval of an EN (and HD for CENELEC), from which time the standard may be said to be approved


(2) Date of availability (dav) date when the definitive text in the official language versions of an approved CEN/CENELEC publication is distributed by the Central Secretariat


(3) Date of announcement (doa) latest date by which the existence of an EN (and HD for CENELEC), a TS or a CWA has to be announced at national level


(4) Date of publication (dop) latest date by which an EN has to be implemented at national level by publication of an identical national standard or by endorsement


(5) Date of withdrawal (dow) latest date by which national standards conflicting with an EN (and HD for CENELEC) have to be withdrawn


(6) This list of normative references is purely indicative. The only official list of normative reference is the list of the published standard.