CENELEC
Project
| Reference | EN 60317-2:2012 |
|---|---|
| Title | Specifications for particular types of winding wires - Part 2: Solderable polyurethane enamelled round copper wire, class 130, with a bonding layer |
| Project Number | 23525 |
| Abstract/Scope | IEC 60317-2:2012 specifies the requirements of solderable enamelled round copper winding wire of class 130 with a dual coating. The underlying coating is based on polyurethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a thermoplastic resin. A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. This edition includes the following significant technical changes with respect to the previous edition: - addition of requirements for appearance, new subclause 3.3 and - addition of pin hole test requirements, Clause 23: Pin hole test. Keywords: copper winding wire |
| Status |
Published
|
Status
| Current Stage code | 6060 |
|---|---|
| Current Stage code date | 2012-10-12 |
| Current Stage code deadline | 2013-05-16 |
| Deadline date for vote |
Legal
| Directive(s) | |
|---|---|
| Mandate(s) | |
| Order Voucher |
Details
| IEC Technical Body | IEC/TC 55 |
|---|---|
| Reference Document | IEC 60317-2:2012 (EQV) |
| ICS | 29.060.10 - Wires |
| Keywords | Wire; Winding wire; Round; Copper wire; Bonding layer |
| Note | Supersedes EN 60317-2:1994 + A1:1998 + A2:2000 |
| A-Deviation(s) | |
| Special National Condition(s) |
Environment
|
Clause
|
Categories - Aspects
|
Product Life Cycle
|
Information
|
|---|
History
Implementation Dates
| date of Ratification (DOR) (1) | 2012-08-16 |
|---|---|
| date of Availability (DAV) (2) | 2012-10-12 |
| date of Announcement (DOA) (3) | 2012-11-16 |
| date of Publication (DOP) (4) | 2013-05-16 |
| date of Withdrawal (DOW) (5) | 2015-08-16 |
Relations
| Supersedes |
EN 60317-2:1994
EN 60317-2:1994/A1:1998 EN 60317-2:1994/A2:2000 |
|---|---|
| Superseded by | |
| Normative reference (6) |
EN 60317-0-1:2008
|
(1) Date of ratification (dor) date when the Technical Board notes the approval of an EN (and HD for CENELEC), from which time the standard may be said to be approved
(2) Date of availability (dav) date when the definitive text in the official language versions of an approved CEN/CENELEC publication is distributed by the Central Secretariat
(3) Date of announcement (doa) latest date by which the existence of an EN (and HD for CENELEC), a TS or a CWA has to be announced at national level
(4) Date of publication (dop) latest date by which an EN has to be implemented at national level by publication of an identical national standard or by endorsement
(5) Date of withdrawal (dow) latest date by which national standards conflicting with an EN (and HD for CENELEC) have to be withdrawn
(6) This list of normative references is purely indicative. The only official list of normative reference is the list of the published standard.
