CENELEC
Project
| Reference | EN 62047-9:2011 |
|---|---|
| Title | Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS |
| Project Number | 22644 |
| Abstract/Scope | IEC 62047-9:2011 describes bonding strength measurement method of wafer to wafer bonding, type of bonding process such as silicon to silicon fusion bonding, silicon to glass anodic bonding, etc., and applicable structure size during MEMS processing/assembly. The applicable wafer thickness is in the range of 10 ohmm to several millimeters. The contents of the corrigendum of March 2012 have been included in this copy. |
| Status |
Published
|
Status
| Current Stage code | 6060 |
|---|---|
| Current Stage code date | 2011-08-19 |
| Current Stage code deadline | 2012-05-17 |
| Deadline date for vote |
Legal
| Directive(s) | |
|---|---|
| Mandate(s) | |
| Order Voucher |
Details
| IEC Technical Body | IEC/SC 47F |
|---|---|
| Reference Document | IEC 62047-9:2011 (EQV) + corrigendum Mar. 2012 (EQV) |
| ICS | 31.080.99 - Other semiconductor devices |
| Keywords | Semiconductor; Micro-electromechanical; Wafer to wafer; Bonding strength; MEMS |
| Note | |
| A-Deviation(s) | |
| Special National Condition(s) |
Environment
|
Clause
|
Categories - Aspects
|
Product Life Cycle
|
Information
|
|---|
History
Implementation Dates
| date of Ratification (DOR) (1) | 2011-08-17 |
|---|---|
| date of Availability (DAV) (2) | 2011-08-19 |
| date of Announcement (DOA) (3) | 2011-11-17 |
| date of Publication (DOP) (4) | 2012-05-17 |
| date of Withdrawal (DOW) (5) | 2014-08-17 |
Relations
| Supersedes | |
|---|---|
| Superseded by | |
| Normative reference (6) | ISO 6892-1:2009 EN 60749-19 ASTM E399-06e2:2008 |
(1) Date of ratification (dor) date when the Technical Board notes the approval of an EN (and HD for CENELEC), from which time the standard may be said to be approved
(2) Date of availability (dav) date when the definitive text in the official language versions of an approved CEN/CENELEC publication is distributed by the Central Secretariat
(3) Date of announcement (doa) latest date by which the existence of an EN (and HD for CENELEC), a TS or a CWA has to be announced at national level
(4) Date of publication (dop) latest date by which an EN has to be implemented at national level by publication of an identical national standard or by endorsement
(5) Date of withdrawal (dow) latest date by which national standards conflicting with an EN (and HD for CENELEC) have to be withdrawn
(6) This list of normative references is purely indicative. The only official list of normative reference is the list of the published standard.
