CENELEC
Project
| Reference | FprEN 60286-3:2013 |
|---|---|
| Title | Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes |
| Project Number | 23373 |
| Abstract/Scope | IEC 60286-3:2013 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This fifth edition cancels and replaces the fourth edition, published in 2007, as well as IEC 60286-3-1, published in 2009 and IEC 60286-3-2, published in 2009. It constitutes a full layout revision. In addition, this edition includes the following significant technical changes with respect to the previous edition: a) integration of IEC 60286-3-1:2009 as type 1b (Packaging of surface mount components on continuous pressed carrier tapes); b) integration of IEC 60286-3-2:2009 as type 2b (Packaging of surface mount components on blister carrier tapes 4 mm in width). |
| Status |
Approval stage
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Status
| Current Stage code | 5060 |
|---|---|
| Current Stage code date | 2013-04-29 |
| Current Stage code deadline | 2013-05-20 |
| Deadline date for vote |
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Details
| IEC Technical Body | IEC/TC 40 |
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| Reference Document | IEC 60286-3:2013 (EQV) |
| ICS | 31.020 - Electronic components in general 31.240 - Mechanical structures for electronic equipment |
| Keywords | Packaging; Components; Automatic handling; Surface mount; Continuous tape |
| Note | Will supersede EN 60286-3:2007 * 40/2138/RVC established on 2011-10-21: FDIS decided |
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Product Life Cycle
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Information
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History
Implementation Dates
| date of Ratification (DOR) (1) | |
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| date of Availability (DAV) (2) | |
| date of Announcement (DOA) (3) | dor + 3 months |
| date of Publication (DOP) (4) | dor + 9 months |
| date of Withdrawal (DOW) (5) | dor + 36 months |
Relations
| Supersedes | EN 60286-3:2007 |
|---|---|
| Superseded by | |
| Normative reference (6) |
(1) Date of ratification (dor) date when the Technical Board notes the approval of an EN (and HD for CENELEC), from which time the standard may be said to be approved
(2) Date of availability (dav) date when the definitive text in the official language versions of an approved CEN/CENELEC publication is distributed by the Central Secretariat
(3) Date of announcement (doa) latest date by which the existence of an EN (and HD for CENELEC), a TS or a CWA has to be announced at national level
(4) Date of publication (dop) latest date by which an EN has to be implemented at national level by publication of an identical national standard or by endorsement
(5) Date of withdrawal (dow) latest date by which national standards conflicting with an EN (and HD for CENELEC) have to be withdrawn
(6) This list of normative references is purely indicative. The only official list of normative reference is the list of the published standard.
