CENELEC
Project
| Reference | EN 60068-2-20:2008 |
|---|---|
| Title | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| Project Number | 20975 |
| Abstract/Scope | IEC 60068-2-20:2008(E) outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this standard include the solder bath method and soldering iron method. The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering. The major technical changes with regard to the fourth edition are the following: - the solder globule test is deleted; - test conditions and requirements for lead-free solders are added. |
| Status |
Published
|
Status
| Current Stage code | 6060 |
|---|---|
| Current Stage code date | 2008-09-25 |
| Current Stage code deadline | 2009-05-01 |
| Deadline date for vote |
Legal
| Directive(s) | |
|---|---|
| Mandate(s) | |
| Order Voucher |
Details
| IEC Technical Body | IEC/TC 91 |
|---|---|
| Reference Document | IEC 60068-2-20:2008 (EQV) |
| ICS | 19.040 - Environmental testing |
| Keywords | Environmental testing; Solderability; Resistance; Heat; Leaded device |
| Note | Supersedes HD 323.2.20 S3:1988 |
| A-Deviation(s) | |
| Special National Condition(s) |
Environment
|
Clause
|
Categories - Aspects
|
Product Life Cycle
|
Information
|
|---|
History
Implementation Dates
| date of Ratification (DOR) (1) | 2008-08-01 |
|---|---|
| date of Availability (DAV) (2) | 2008-09-25 |
| date of Announcement (DOA) (3) | 2008-11-01 |
| date of Publication (DOP) (4) | 2009-05-01 |
| date of Withdrawal (DOW) (5) | 2011-08-01 |
Relations
| Supersedes | HD 323.2.20 S3:1988 |
|---|---|
| Superseded by | |
| Normative reference (6) |
EN 60068-1:1994
EN 60068-2-2:2007 EN 60068-2-66:1994 EN 60068-2-78:2001 EN 60194:2006 EN 61191-3:1998 EN 61191-4:1998 |
(1) Date of ratification (dor) date when the Technical Board notes the approval of an EN (and HD for CENELEC), from which time the standard may be said to be approved
(2) Date of availability (dav) date when the definitive text in the official language versions of an approved CEN/CENELEC publication is distributed by the Central Secretariat
(3) Date of announcement (doa) latest date by which the existence of an EN (and HD for CENELEC), a TS or a CWA has to be announced at national level
(4) Date of publication (dop) latest date by which an EN has to be implemented at national level by publication of an identical national standard or by endorsement
(5) Date of withdrawal (dow) latest date by which national standards conflicting with an EN (and HD for CENELEC) have to be withdrawn
(6) This list of normative references is purely indicative. The only official list of normative reference is the list of the published standard.
