International Standards and Conformity Assessment for all electrical, electronic and related technologies

 

Project

Reference EN 60317-0-1:2008
Title Specifications for particular types of winding wires - Part 0-1: General requirements - Enamelled round copper wire
Project Number 21335
Abstract/Scope This part of IEC 60317 specifies general requirements of enamelled round copper winding wires with or without bonding layer. The main changes with respect to the previous edition are:
- addition of Grade 3 minimum insulation increases and maximum overall diameters for wires up to 0,071 mm nominal conductor diameter in Tables 1 and A.1;
- revisions to minimum increase in bonding layer for wires up to 0,100 mm nominal conductor diameter in Tables 2 and A.2;
- addition of Grade 3 dielectric breakdown requirements for wires up to 0,071 mm nominal conductor diameter; and
- new pin hole test requirement for Grade 3 polyurethane wires.
This standard is to be read in conjunction with the IEC 60851 series. The clause numbers used in this part of IEC 60317 are identical with the respective test numbers of IEC 60851.
Status
Published

Status

Current Stage code 6060
Current Stage code date 2008-06-06
Current Stage code deadline 2009-02-01
Deadline date for vote  

Legal

Directive(s)  
Mandate(s)  
Order Voucher  

Details

IEC Technical Body IEC/TC 55
Reference Document IEC 60317-0-1:2008 (EQV)
ICS 29.060.10 - Wires
Keywords Winding wire; Wire; Enamelled; Round; Copper
Note Superseded by EN 60317-0-1:2014
A-Deviation(s)  
Special National Condition(s)  

Environment

Clause
Categories - Aspects
Product Life Cycle
Information

History

Stage
Date
Deadline Date
Documents
6060 2008-06-06 2009-02-01 export to doc file  EN  FR  DE
5099 2008-05-01 2008-07-01  
5061 2008-03-26 2008-05-01  
5060 2008-01-25 2008-02-18 export to doc file  EN
5020 2007-06-15 2007-11-16  
1090 2007-06-12 2007-06-15  

Implementation Dates

date of Ratification (DOR) (1) 2008-05-01
date of Availability (DAV) (2) 2008-06-06
date of Announcement (DOA) (3) 2008-08-01
date of Publication (DOP) (4) 2009-02-01
date of Withdrawal (DOW) (5) 2011-05-01

Relations

Supersedes EN 60317-0-1:1998
EN 60317-0-1:1998/A1:2000
EN 60317-0-1:1998/A2:2005
Superseded by EN 60317-0-1:2014
Normative reference (6) ISO 3:1973
EN 60172:1994
EN 60264-5-2:2001
EN 60317-0-2:1998
EN 60851-1:1996

(1) Date of ratification (dor) date when the Technical Board notes the approval of an EN (and HD for CENELEC), from which time the standard may be said to be approved


(2) Date of availability (dav) date when the definitive text in the official language versions of an approved CEN/CENELEC publication is distributed by the Central Secretariat


(3) Date of announcement (doa) latest date by which the existence of an EN (and HD for CENELEC), a TS or a CWA has to be announced at national level


(4) Date of publication (dop) latest date by which an EN has to be implemented at national level by publication of an identical national standard or by endorsement


(5) Date of withdrawal (dow) latest date by which national standards conflicting with an EN (and HD for CENELEC) have to be withdrawn


(6) This list of normative references is purely indicative. The only official list of normative reference is the list of the published standard.