International Standards and Conformity Assessment for all electrical, electronic and related technologies



Reference EN 62047-14:2012
Title Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
Project Number 23220
Abstract/Scope IEC 62047-14:2012 describes definitions and procedures for measuring the forming limit of metallic film materials with a thickness range from 0,5 μm to 300 μm. The metallic film materials described herein are typically used in electric components, MEMS and micro-devices. When metallic film materials used in MEMS (see 2.1.2 of IEC 62047-1:2005) are fabricated by a forming process such as imprinting, it is necessary to predict the material failure in order to increase the reliability of the components. Through this prediction, the effectiveness of manufacturing MEMS components by a forming process can also be improved, because the period of developing a product can be reduced and manufacturing costs can thus be decreased. This standard presents one of the prediction methods for material failure in imprinting process.


Current Stage code 6060
Current Stage code date 2012-04-06
Current Stage code deadline 2013-01-03
Deadline date for vote  


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IEC Technical Body IEC/SC 47F
Reference Document IEC 62047-14:2012 (EQV)
ICS 31.080.99 - Other semiconductor devices
Keywords Semiconductor; Microelectromechanical; Forming limit; Metallic fillm
Note 2012-03-09: Publication editing allocated to
Special National Condition(s)  


Categories - Aspects
Product Life Cycle


Deadline Date
6060 2012-04-06 2013-01-03 export to doc file  EN  FR  DE
5099 2012-04-03 2012-05-01  
5060 2012-01-31 2012-02-21 export to doc file  EN
5020 2011-11-25 2012-01-27  
3090 2011-08-26 2011-10-30  
5060 2011-04-26 2011-05-17 export to doc file  EN
5020 2010-11-19 2011-04-22  
1090 2010-11-17 2010-11-19  

Implementation Dates

date of Ratification (DOR) (1) 2012-04-03
date of Availability (DAV) (2) 2012-04-06
date of Announcement (DOA) (3) 2012-07-03
date of Publication (DOP) (4) 2013-01-03
date of Withdrawal (DOW) (5) 2015-04-03


Superseded by  
Normative reference (6) EN 62047-1:2006

(1) Date of ratification (dor) date when the Technical Board notes the approval of an EN (and HD for CENELEC), from which time the standard may be said to be approved

(2) Date of availability (dav) date when the definitive text in the official language versions of an approved CEN/CENELEC publication is distributed by the Central Secretariat

(3) Date of announcement (doa) latest date by which the existence of an EN (and HD for CENELEC), a TS or a CWA has to be announced at national level

(4) Date of publication (dop) latest date by which an EN has to be implemented at national level by publication of an identical national standard or by endorsement

(5) Date of withdrawal (dow) latest date by which national standards conflicting with an EN (and HD for CENELEC) have to be withdrawn

(6) This list of normative references is purely indicative. The only official list of normative reference is the list of the published standard.