International Standards and Conformity Assessment for all electrical, electronic and related technologies



Reference EN 62137-1-5:2009
Title Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
Project Number 21581
Abstract/Scope IEC 62137-1-5:2009 applies to area array packages, such as BGA. This test method is designed to evaluate the fatigue life of the solder joints between component leads and lands on a substrate as shown in Figure 1. A temperature cyclic approach is generally used to evaluate the reliability of solder joints. Another method is to mechanically cycle the solder joints to shorten the testing time rather than to produce the strains by changing temperatures. The methodology is the imposition of shear deformation on the solder joints by mechanical displacement instead of relative displacement generated by CTE (coefficient of thermal expansion) mismatch, as shown in Figure 2. In place of the temperature cycle test, the mechanical shear fatigue predicts the reliability of the solder joints under repeated temperature change conditions by mechanically cycling the solder joints. In this test method, the evaluation requires first to mount the surface mount component on the substrate by reflow soldering, then cyclic mechanical shear deformation is applied to the solder joints until fracture of the solder joints occurs. The properties of the solder joints (for example solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.


Current Stage code 6060
Current Stage code date 2009-05-06
Current Stage code deadline 2010-01-01
Deadline date for vote  


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IEC Technical Body IEC/TC 91
Reference Document IEC 62137-1-5:2009 (EQV)
ICS 31.190 - Electronic component assemblies
Keywords Surface mounting; Environment; Endurance; Solder joint; Shear fatigue
Special National Condition(s)  


Categories - Aspects
Product Life Cycle


Deadline Date
6060 2009-05-06 2010-01-01 export to doc file  EN  FR  DE
5099 2009-04-01 2009-06-01  
5061 2009-02-24 2009-04-01  
5060 2009-01-19 2009-02-02 export to doc file  EN
5020 2008-11-14 2009-01-16  
3090 2008-07-11 2008-09-30  
5060 2008-04-28 2008-05-12 export to doc file  EN
5020 2007-11-23 2008-04-25  
1090 2007-11-20 2007-11-23  

Implementation Dates

date of Ratification (DOR) (1) 2009-04-01
date of Availability (DAV) (2) 2009-05-06
date of Announcement (DOA) (3) 2009-07-01
date of Publication (DOP) (4) 2010-01-01
date of Withdrawal (DOW) (5) 2012-04-01


Superseded by  
Normative reference (6) EN 60068-1:1994
EN 60194:2006
EN 61188-5-1:2002
EN 61190-1-2:2007
EN 61190-1-3:2007
EN 61249-2-7:2002
corr. September 2005
EN 61760-1:2006

(1) Date of ratification (dor) date when the Technical Board notes the approval of an EN (and HD for CENELEC), from which time the standard may be said to be approved

(2) Date of availability (dav) date when the definitive text in the official language versions of an approved CEN/CENELEC publication is distributed by the Central Secretariat

(3) Date of announcement (doa) latest date by which the existence of an EN (and HD for CENELEC), a TS or a CWA has to be announced at national level

(4) Date of publication (dop) latest date by which an EN has to be implemented at national level by publication of an identical national standard or by endorsement

(5) Date of withdrawal (dow) latest date by which national standards conflicting with an EN (and HD for CENELEC) have to be withdrawn

(6) This list of normative references is purely indicative. The only official list of normative reference is the list of the published standard.