International Standards and Conformity Assessment for all electrical, electronic and related technologies

 

Project

Reference EN 61190-1-2:201X
Title Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Project Number 24251
Abstract/Scope IEC 61190-1-2:2014-02(en-fr) specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition: a) modification of the solder powder size in Table 2; b) addition of the information of 'Reflow condition and profile' in Annex B; c) addition of a new Annex C.
Status
Approved

Status

Current Stage code 5099
Current Stage code date 2014-03-26
Current Stage code deadline 2014-04-23
Deadline date for vote  

Legal

Directive(s)  
Mandate(s)  
Order Voucher  

Details

IEC Technical Body IEC/TC 91
Reference Document IEC 61190-1-2:2014 (EQV)
ICS 31.190 - Electronic component assemblies
Keywords  
Note Will supersede EN 61190-1-2:2007.*2014-04-03: Publication allocated to tnaqvi@cencenelec.eu
A-Deviation(s)  
Special National Condition(s)  

Environment

Clause
Categories - Aspects
Product Life Cycle
Information

History

Stage
Date
Deadline Date
Documents
5099 2014-03-26 2014-04-23  
5060 2014-02-03 2014-02-24 export to doc file  EN
5020 2013-11-29 2014-01-31  
3090 2013-11-26 2013-11-29  
5060 2012-11-05 2012-11-26 export to doc file  EN
5020 2012-06-01 2012-11-02  
1090 2012-05-29 2012-06-01  

Implementation Dates

date of Ratification (DOR) (1) 2014-03-26
date of Availability (DAV) (2)  
date of Announcement (DOA) (3) 2014-06-26
date of Publication (DOP) (4) 2014-12-26
date of Withdrawal (DOW) (5) 2017-03-26

Relations

Supersedes EN 61190-1-2:2007
Superseded by  
Normative reference (6) ISO 9454-2
EN 60194
IEC 61189-5-3
IEC 61190-1-1
EN 61190-1-3

(1) Date of ratification (dor) date when the Technical Board notes the approval of an EN (and HD for CENELEC), from which time the standard may be said to be approved


(2) Date of availability (dav) date when the definitive text in the official language versions of an approved CEN/CENELEC publication is distributed by the Central Secretariat


(3) Date of announcement (doa) latest date by which the existence of an EN (and HD for CENELEC), a TS or a CWA has to be announced at national level


(4) Date of publication (dop) latest date by which an EN has to be implemented at national level by publication of an identical national standard or by endorsement


(5) Date of withdrawal (dow) latest date by which national standards conflicting with an EN (and HD for CENELEC) have to be withdrawn


(6) This list of normative references is purely indicative. The only official list of normative reference is the list of the published standard.