International Standards and Conformity Assessment for all electrical, electronic and related technologies

 

Project

Reference EN 60749-21:2011
Title Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
Project Number 22642
Abstract/Scope IEC 60749-21:2011 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment. This test method provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices (SMDs) as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application. The test method also provides optional conditions for ageing. This test is considered destructive unless otherwise detailed in the relevant specification.
NOTE 1 This test method is in general accord with IEC 60068, but due to specific requirements of semiconductors, the following text is applied.
NOTE 2 This test method does not assess the effect of thermal stresses which may occur during the soldering process. Reference should be made IEC 60749-15 or IEC 60749-20.
This standard cancels and replaces the first edition published in 2004 and constitutes a technical revision. The significant change is the inclusion of Pb (lead)-free backward compatibility.
Status
Published

Status

Current Stage code 6060
Current Stage code date 2011-08-19
Current Stage code deadline 2012-02-12
Deadline date for vote  

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Details

IEC Technical Body IEC/TC 47
Reference Document IEC 60749-21:2011 (EQV)
ICS 31.080.01 - Semiconductor devices in general
Keywords Semiconductor; Mechanical; Climatic; Solderability; Test method
Note Supersedes EN 60749-21:2005
A-Deviation(s)  
Special National Condition(s)  

Environment

Clause
Categories - Aspects
Product Life Cycle
Information

History

Stage
Date
Deadline Date
Documents
6060 2011-08-19 2012-02-12 export to doc file  EN  FR  DE
5099 2011-05-12 2011-06-09  
5060 2011-03-21 2011-04-11 export to doc file  EN
5020 2011-01-14 2011-03-18  
3090 2010-08-13 2010-12-31  
5060 2010-02-08 2010-02-22 export to doc file  EN
5020 2009-09-04 2010-02-05  
1090 2009-09-01 2009-09-04  

Implementation Dates

date of Ratification (DOR) (1) 2011-05-12
date of Availability (DAV) (2) 2011-08-19
date of Announcement (DOA) (3) 2011-08-12
date of Publication (DOP) (4) 2012-02-12
date of Withdrawal (DOW) (5) 2014-05-12

Relations

Supersedes EN 60749-21:2005
Superseded by  
Normative reference (6) EN 61190-1-2:2007
EN 61190-1-3:2007

(1) Date of ratification (dor) date when the Technical Board notes the approval of an EN (and HD for CENELEC), from which time the standard may be said to be approved


(2) Date of availability (dav) date when the definitive text in the official language versions of an approved CEN/CENELEC publication is distributed by the Central Secretariat


(3) Date of announcement (doa) latest date by which the existence of an EN (and HD for CENELEC), a TS or a CWA has to be announced at national level


(4) Date of publication (dop) latest date by which an EN has to be implemented at national level by publication of an identical national standard or by endorsement


(5) Date of withdrawal (dow) latest date by which national standards conflicting with an EN (and HD for CENELEC) have to be withdrawn


(6) This list of normative references is purely indicative. The only official list of normative reference is the list of the published standard.