International Standards and Conformity Assessment for all electrical, electronic and related technologies



Reference EN 60068-2-20:2008
Title Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
Project Number 20975
Abstract/Scope IEC 60068-2-20:2008(E) outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this standard include the solder bath method and soldering iron method. The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering. The major technical changes with regard to the fourth edition are the following: - the solder globule test is deleted; - test conditions and requirements for lead-free solders are added.


Current Stage code 6060
Current Stage code date 2008-09-25
Current Stage code deadline 2009-05-01
Deadline date for vote  


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IEC Technical Body IEC/TC 91
Reference Document IEC 60068-2-20:2008 (EQV)
ICS 19.040 - Environmental testing
Keywords Environmental testing; Solderability; Resistance; Heat; Leaded device
Note Supersedes HD 323.2.20 S3:1988
Special National Condition(s)  


Categories - Aspects
Product Life Cycle


Deadline Date
6060 2008-09-25 2009-05-01 export to doc file  EN  FR  DE
5099 2008-08-01 2008-10-01  
5060 2008-07-02 2008-07-16 export to doc file  EN
5020 2008-04-25 2008-06-27  
3090 2007-06-15 2007-10-31  
5060 2007-04-02 2007-04-16 export to doc file  EN
5020 2006-10-27 2007-03-30  
1090 2006-10-24 2006-10-27  

Implementation Dates

date of Ratification (DOR) (1) 2008-08-01
date of Availability (DAV) (2) 2008-09-25
date of Announcement (DOA) (3) 2008-11-01
date of Publication (DOP) (4) 2009-05-01
date of Withdrawal (DOW) (5) 2011-08-01


Supersedes HD 323.2.20 S3:1988
Superseded by  
Normative reference (6) EN 60068-1:1994
EN 60068-2-2:2007
EN 60068-2-66:1994
EN 60068-2-78:2001
EN 60194:2006
EN 61191-3:1998
EN 61191-4:1998

(1) Date of ratification (dor) date when the Technical Board notes the approval of an EN (and HD for CENELEC), from which time the standard may be said to be approved

(2) Date of availability (dav) date when the definitive text in the official language versions of an approved CEN/CENELEC publication is distributed by the Central Secretariat

(3) Date of announcement (doa) latest date by which the existence of an EN (and HD for CENELEC), a TS or a CWA has to be announced at national level

(4) Date of publication (dop) latest date by which an EN has to be implemented at national level by publication of an identical national standard or by endorsement

(5) Date of withdrawal (dow) latest date by which national standards conflicting with an EN (and HD for CENELEC) have to be withdrawn

(6) This list of normative references is purely indicative. The only official list of normative reference is the list of the published standard.