International Standards and Conformity Assessment for all electrical, electronic and related technologies

 

Project

Reference EN 60749-20:2009
Title Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Project Number 21363
Abstract/Scope IEC 60749-20:2008 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This second edition cancels and replaces the first edition published in 2002 and constitutes a technical revision. The main changes are as follows: - to reconcile certain classifications of IEC 60749-20 and those of IPC/JEDEC J-STD-020C; - reference IEC 60749-35 instead of Annex A of IEC 60749-20, Edition 1; - update for lead-free solder; - correct certain errors in the original Edition 1.
Status
Published

Status

Current Stage code 6060
Current Stage code date 2009-11-26
Current Stage code deadline 2010-06-01
Deadline date for vote  

Legal

Directive(s)  
Mandate(s)  
Order Voucher  

Details

IEC Technical Body IEC/TC 47
Reference Document IEC 60749-20:2008 (EQV)
ICS 31.080.01 - Semiconductor devices in general
Keywords Semiconductor; Climatic; Resistance; Moisture; Heat
Note Supersedes EN 60749-20:2003
A-Deviation(s)  
Special National Condition(s)  

Environment

Clause
Categories - Aspects
Product Life Cycle
Information

History

Stage
Date
Deadline Date
Documents
6060 2009-11-26 2010-06-01 export to doc file  EN  FR  DE
5099 2009-09-01 2009-11-01  
5061 2009-06-26 2009-09-01  
5060 2008-11-18 2008-12-02 export to doc file  EN
5020 2008-09-12 2008-11-14  
3090 2008-07-04 2008-09-30  
5060 2007-12-04 2007-12-17 export to doc file  EN
5020 2007-06-29 2007-11-30  
1090 2007-06-26 2007-06-29  

Implementation Dates

date of Ratification (DOR) (1) 2009-09-01
date of Availability (DAV) (2) 2009-11-26
date of Announcement (DOA) (3) 2009-12-01
date of Publication (DOP) (4) 2010-06-01
date of Withdrawal (DOW) (5) 2012-09-01

Relations

Supersedes EN 60749-20:2003
Superseded by  
Normative reference (6) EN 60068-2-20:2008
EN 60749-3:2002
EN 60749-35:2006

(1) Date of ratification (dor) date when the Technical Board notes the approval of an EN (and HD for CENELEC), from which time the standard may be said to be approved


(2) Date of availability (dav) date when the definitive text in the official language versions of an approved CEN/CENELEC publication is distributed by the Central Secretariat


(3) Date of announcement (doa) latest date by which the existence of an EN (and HD for CENELEC), a TS or a CWA has to be announced at national level


(4) Date of publication (dop) latest date by which an EN has to be implemented at national level by publication of an identical national standard or by endorsement


(5) Date of withdrawal (dow) latest date by which national standards conflicting with an EN (and HD for CENELEC) have to be withdrawn


(6) This list of normative references is purely indicative. The only official list of normative reference is the list of the published standard.