International Standards and Conformity Assessment for all electrical, electronic and related technologies



Reference EN 62047-6:2010
Title Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
Project Number 21554
Abstract/Scope IEC 62047-6:2009 specifies the method for axial tensile-tensile force fatigue testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 µm and 10 µm under constant force range or constant displacement range. Thin films are used as main structural materials for MEMS and micromachines. The main structural materials for MEMS, micromachines, etc., have special features, such as typical dimensions of a few microns, material fabrication by deposition, andtest piece fabrication by means of non-mechanical machining, including photolithography. This International Standard specifies the axial force fatigue testing methods for micro-sized smooth specimens, which enables a guarantee of accuracy corresponding to the special features. The tests are carried out at room temperatures, in air, with loading applied to the test piece along the longitudinal axis.


Current Stage code 6060
Current Stage code date 2010-03-05
Current Stage code deadline 2010-12-01
Deadline date for vote  


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IEC Technical Body IEC/SC 47F
Reference Document IEC 62047-6:2009 (EQV)
ICS 31.080.99 - Other semiconductor devices
Keywords Semiconductor; Micro-electromechanical; Axial; Fatigue test; Thin film
Special National Condition(s)  


Categories - Aspects
Product Life Cycle


Deadline Date
6060 2010-03-05 2010-12-01 export to doc file  EN  FR  DE
5099 2010-03-01 2010-05-01  
5060 2009-03-24 2009-04-07 export to doc file  EN
5020 2009-01-16 2009-03-20  
3090 2008-04-25 2008-12-31  
5060 2008-04-07 2008-04-21 export to doc file  EN
5020 2007-11-02 2008-04-04  
1090 2007-10-30 2007-11-02  

Implementation Dates

date of Ratification (DOR) (1) 2010-03-01
date of Availability (DAV) (2) 2010-03-05
date of Announcement (DOA) (3) 2010-06-01
date of Publication (DOP) (4) 2010-12-01
date of Withdrawal (DOW) (5) 2013-03-01


Superseded by  
Normative reference (6) EN 62047-2

(1) Date of ratification (dor) date when the Technical Board notes the approval of an EN (and HD for CENELEC), from which time the standard may be said to be approved

(2) Date of availability (dav) date when the definitive text in the official language versions of an approved CEN/CENELEC publication is distributed by the Central Secretariat

(3) Date of announcement (doa) latest date by which the existence of an EN (and HD for CENELEC), a TS or a CWA has to be announced at national level

(4) Date of publication (dop) latest date by which an EN has to be implemented at national level by publication of an identical national standard or by endorsement

(5) Date of withdrawal (dow) latest date by which national standards conflicting with an EN (and HD for CENELEC) have to be withdrawn

(6) This list of normative references is purely indicative. The only official list of normative reference is the list of the published standard.