International Standards and Conformity Assessment for all electrical, electronic and related technologies

 

Project

Reference EN 61760-3:2010
Title Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
Project Number 22315
Abstract/Scope IEC 61760-3:2010 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology. The object of this standard is to ensure that components with leads intended for through hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this standard defines test and requirements that need to be part of any component generic, sectional or detail specification, when through hole reflow soldering is intended. Further this standard provides component users and manufacturers with a reference set of typical process conditions used in through hole reflow soldering technology.
Status
Published

Status

Current Stage code 6060
Current Stage code date 2010-04-23
Current Stage code deadline 2011-01-01
Deadline date for vote  

Legal

Directive(s)  
Mandate(s)  
Order Voucher  

Details

IEC Technical Body IEC/TC 91
Reference Document IEC 61760-3:2010 (EQV)
ICS 31.190 - Electronic component assemblies
Keywords Surface mounting;Through Hole Reflow; THR; Soldering
Note  
A-Deviation(s)  
Special National Condition(s)  

Environment

Clause
Categories - Aspects
Product Life Cycle
Information

History

Stage
Date
Deadline Date
Documents
6060 2010-04-23 2011-01-01 export to doc file  EN  FR  DE
5099 2010-04-01 2010-06-01  
5060 2009-10-23 2009-11-13 export to doc file  EN
5020 2009-03-06 2009-08-07  
1090 2009-03-03 2009-03-06  

Implementation Dates

date of Ratification (DOR) (1) 2010-04-01
date of Availability (DAV) (2) 2010-04-23
date of Announcement (DOA) (3) 2010-07-01
date of Publication (DOP) (4) 2011-01-01
date of Withdrawal (DOW) (5) 2013-04-01

Relations

Supersedes  
Superseded by  
Normative reference (6) ISO 8601:2000
EN 60062:2005
corr. January 2007
EN 60068 series
EN 60068-2-20:2008
EN 60068-2-21:2006
EN 60068-2-45
EN 60068-2-58:2004
corr. December 2004
EN 60068-2-77:1999
EN 60068-2-82:2007
EN 60194:2006
EN 60286 series
EN 60286-3:2007
EN 60286-4:1998
EN 60286-5:2004
EN 60749-20:2009
EN 61760-2:2007
EN 62090:2003

(1) Date of ratification (dor) date when the Technical Board notes the approval of an EN (and HD for CENELEC), from which time the standard may be said to be approved


(2) Date of availability (dav) date when the definitive text in the official language versions of an approved CEN/CENELEC publication is distributed by the Central Secretariat


(3) Date of announcement (doa) latest date by which the existence of an EN (and HD for CENELEC), a TS or a CWA has to be announced at national level


(4) Date of publication (dop) latest date by which an EN has to be implemented at national level by publication of an identical national standard or by endorsement


(5) Date of withdrawal (dow) latest date by which national standards conflicting with an EN (and HD for CENELEC) have to be withdrawn


(6) This list of normative references is purely indicative. The only official list of normative reference is the list of the published standard.