International Standards and Conformity Assessment for all electrical, electronic and related technologies

 

Project

Reference EN 62047-8:2011
Title Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
Project Number 22628
Abstract/Scope IEC 62047-8:2011 specifies the strip bending test method to measure tensile properties of thin films with high accuracy, repeatability, moderate effort of alignment and handling compared to the conventional tensile test. This testing method is valid for test pieces with a thickness between 50 nm and several mum, and with an aspect ratio (ratio of length to thickness) of more than 300. The hanging strip (or bridge) between two fixed supports are widely adopted in MEMS or micro-machines. It is much easier to fabricate these strips than the conventional tensile test pieces. The test procedures are so simple to be readily automated. This international standard can be utilized as a quality control test for MEMS production since its testing throughput is very high compared to the conventional tensile test.
Status
Published

Status

Current Stage code 6060
Current Stage code date 2011-05-06
Current Stage code deadline 2012-01-18
Deadline date for vote  

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Details

IEC Technical Body IEC/SC 47F
Reference Document IEC 62047-8:2011 (EQV)
ICS 31.080.99 - Other semiconductor devices
Keywords Semiconductor; Micro-electromechanical; Strip bending; Thin; Film
Note  
A-Deviation(s)  
Special National Condition(s)  

Environment

Clause
Categories - Aspects
Product Life Cycle
Information

History

Stage
Date
Deadline Date
Documents
6060 2011-05-06 2012-01-18 export to doc file  EN  FR  DE
5099 2011-04-18 2011-05-16  
5060 2011-02-21 2011-03-14 export to doc file  EN
5020 2010-12-17 2011-02-18  
3090 2010-07-23 2010-09-30  
5060 2010-01-25 2010-02-08 export to doc file  EN
5020 2009-08-21 2010-01-22  
1090 2009-08-19 2009-08-21  

Implementation Dates

date of Ratification (DOR) (1) 2011-04-18
date of Availability (DAV) (2) 2011-05-06
date of Announcement (DOA) (3) 2011-07-18
date of Publication (DOP) (4) 2012-01-18
date of Withdrawal (DOW) (5) 2014-04-18

Relations

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Normative reference (6)  

(1) Date of ratification (dor) date when the Technical Board notes the approval of an EN (and HD for CENELEC), from which time the standard may be said to be approved


(2) Date of availability (dav) date when the definitive text in the official language versions of an approved CEN/CENELEC publication is distributed by the Central Secretariat


(3) Date of announcement (doa) latest date by which the existence of an EN (and HD for CENELEC), a TS or a CWA has to be announced at national level


(4) Date of publication (dop) latest date by which an EN has to be implemented at national level by publication of an identical national standard or by endorsement


(5) Date of withdrawal (dow) latest date by which national standards conflicting with an EN (and HD for CENELEC) have to be withdrawn


(6) This list of normative references is purely indicative. The only official list of normative reference is the list of the published standard.