CENELEC

Project
| Reference | EN 60749-21:2005 |
|---|---|
| Title | Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability |
| Project Number | 15553 |
| Abstract/Scope | Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application. |
| Status |
Published
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Status
| Current Stage code | 6060 |
|---|---|
| Current Stage code date | 2005-02-15 |
| Current Stage code deadline | 2005-09-01 |
| Deadline date for vote |
Legal
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Details
| IEC Technical Body | IEC/TC 47 |
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| Reference Document | IEC 60749-21:2004 (EQV) |
| ICS | 31.080 - Semiconductor devices |
| Keywords | Semiconductor; Mechanical; Climatic; Test method; Solderability |
| Note | Supersedes Subclause 2.1 of Chapter 2 of EN 60749:1999 * Superseded by EN 60749-21:2011 |
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| Special National Condition(s) |
Environment
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Clause
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Categories - Aspects
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Product Life Cycle
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Information
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History
Implementation Dates
| date of Ratification (DOR) (1) | 2004-12-07 |
|---|---|
| date of Availability (DAV) (2) | 2005-02-15 |
| date of Announcement (DOA) (3) | 2005-03-01 |
| date of Publication (DOP) (4) | 2005-09-01 |
| date of Withdrawal (DOW) (5) | 2008-01-01 |
Relations
| Supersedes | |
|---|---|
| Superseded by | EN 60749-21:2011 |
| Normative reference (6) |
(1) Date of ratification (dor) date when the Technical Board notes the approval of an EN (and HD for CENELEC), from which time the standard may be said to be approved
(2) Date of availability (dav) date when the definitive text in the official language versions of an approved CEN/CENELEC publication is distributed by the Central Secretariat
(3) Date of announcement (doa) latest date by which the existence of an EN (and HD for CENELEC), a TS or a CWA has to be announced at national level
(4) Date of publication (dop) latest date by which an EN has to be implemented at national level by publication of an identical national standard or by endorsement
(5) Date of withdrawal (dow) latest date by which national standards conflicting with an EN (and HD for CENELEC) have to be withdrawn
(6) This list of normative references is purely indicative. The only official list of normative reference is the list of the published standard.
