CENELEC
Project
| Reference | EN 61967-2:2005 |
|---|---|
| Title | Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method |
| Project Number | 16243 |
| Abstract/Scope | This test procedure defines a method for measuring the electromagnetic radiation from an integrated circuit (IC). The IC being evaluated is mounted on an IC test printed circuit board (PCB) that is clamped to a mating port (referred to as a wall port) cut in the top or bottom of a transverse electromagnetic (TEM) or wideband gigahertz TEM (GTEM) cell. The test board is not inside the cell, as in the conventional usage, but becomes a part of the cell wall. This method is applicable to any TEM or GTEM cell modified to incorporate the wall port; however, the measured radio frequency (RF) voltage will be affected by many factors. The primary factor affecting the measured RF voltage is the septum to IC test board (cell wall) spacing. This procedure was developed using a 1 GHz TEM cell with a septum to floor spacing of 45 mm and a GTEM cell with average septum to floor spacing of 45 mm over the port area. Other cells may not produce identical spectral output but may be used for comparative measurements, subject to their frequency and sensitivity limitations. A conversion factor may allow comparisons between data measured on TEM or GTEM cells with different septum to floor spacing. The IC test board controls the geometry and orientation of the operating IC relative to the cell and eliminates any connecting leads within the cell (these are on the backside of the board, which is outside the cell). For the TEM cell, one of the 50 ports is terminated with a 50 load. The other 50 port for a TEM cell, or the single 50 port for a GTEM cell, is connected to the input of a spectrum analyser or receiver that measures the RF emissions emanating from the integrated circuit and impressed onto the septum of the cell. |
| Status |
Published
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Status
| Current Stage code | 6060 |
|---|---|
| Current Stage code date | 2005-10-25 |
| Current Stage code deadline | 2006-07-01 |
| Deadline date for vote |
Legal
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Details
| IEC Technical Body | IEC/SC 47A |
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| Reference Document | IEC 61967-2:2005 (EQV) |
| ICS | 31.080.99 - Other semiconductor devices |
| Keywords | Circuit; Integrated; Electromagnetic emission; Radiated emission; TEM-cell |
| Note | To be read in conjunction with EN 61967-1:2002 |
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Information
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History
Implementation Dates
| date of Ratification (DOR) (1) | 2005-09-01 |
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| date of Availability (DAV) (2) | 2005-10-25 |
| date of Announcement (DOA) (3) | 2006-01-01 |
| date of Publication (DOP) (4) | 2006-07-01 |
| date of Withdrawal (DOW) (5) | 2008-09-01 |
Relations
| Supersedes | |
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| Superseded by | |
| Normative reference (6) | IEC 60050-131:2002 IEC 60050-161:1990 EN 61967-1:2002 |
(1) Date of ratification (dor) date when the Technical Board notes the approval of an EN (and HD for CENELEC), from which time the standard may be said to be approved
(2) Date of availability (dav) date when the definitive text in the official language versions of an approved CEN/CENELEC publication is distributed by the Central Secretariat
(3) Date of announcement (doa) latest date by which the existence of an EN (and HD for CENELEC), a TS or a CWA has to be announced at national level
(4) Date of publication (dop) latest date by which an EN has to be implemented at national level by publication of an identical national standard or by endorsement
(5) Date of withdrawal (dow) latest date by which national standards conflicting with an EN (and HD for CENELEC) have to be withdrawn
(6) This list of normative references is purely indicative. The only official list of normative reference is the list of the published standard.
