International Standards and Conformity Assessment for all electrical, electronic and related technologies



Reference EN 60749-21:2005
Title Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
Project Number 15553
Abstract/Scope Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.


Current Stage code 6060
Current Stage code date 2005-02-15
Current Stage code deadline 2005-09-01
Deadline date for vote  


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IEC Technical Body IEC/TC 47
Reference Document IEC 60749-21:2004 (EQV)
ICS 31.080 - Semiconductor devices
Keywords Semiconductor; Mechanical; Climatic; Test method; Solderability
Note Supersedes Subclause 2.1 of Chapter 2 of EN 60749:1999 * Superseded by EN 60749-21:2011
Special National Condition(s)  


Categories - Aspects
Product Life Cycle


Deadline Date
6060 2005-02-15 2005-09-01 export to doc file  EN  FR  DE
5099 2004-12-07 2005-04-07  
5091 2004-12-07    
5092 2004-07-06 2005-01-05  
5061 2004-03-26 2004-05-01  
5020 2003-12-05 2004-02-06  
4099 2003-10-24 2003-11-07  
4020 2002-11-08 2003-04-11  
3099 2002-11-05 2002-11-08  

Implementation Dates

date of Ratification (DOR) (1) 2004-12-07
date of Availability (DAV) (2) 2005-02-15
date of Announcement (DOA) (3) 2005-03-01
date of Publication (DOP) (4) 2005-09-01
date of Withdrawal (DOW) (5) 2008-01-01


Superseded by EN 60749-21:2011
Normative reference (6)  

(1) Date of ratification (dor) date when the Technical Board notes the approval of an EN (and HD for CENELEC), from which time the standard may be said to be approved

(2) Date of availability (dav) date when the definitive text in the official language versions of an approved CEN/CENELEC publication is distributed by the Central Secretariat

(3) Date of announcement (doa) latest date by which the existence of an EN (and HD for CENELEC), a TS or a CWA has to be announced at national level

(4) Date of publication (dop) latest date by which an EN has to be implemented at national level by publication of an identical national standard or by endorsement

(5) Date of withdrawal (dow) latest date by which national standards conflicting with an EN (and HD for CENELEC) have to be withdrawn

(6) This list of normative references is purely indicative. The only official list of normative reference is the list of the published standard.