International Standards and Conformity Assessment for all electrical, electronic and related technologies

 

Project

Reference EN 60068-2-58:2004
Title Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Project Number 15395
Abstract/Scope Outlines test Td, applicable to surface mounting devices, which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead and for lead-free solder alloys. Provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys and for determining the solderability, dissolution of metallization (see B.3.3) and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders. Include the solder bath method and reflow method.
Status
Published

Status

Current Stage code 6060
Current Stage code date 2004-10-01
Current Stage code deadline 2005-06-01
Deadline date for vote  

Legal

Directive(s)  
Mandate(s)  
Order Voucher  

Details

IEC Technical Body IEC/TC 91
Reference Document IEC 60068-2-58:2004 (EQV)
ICS 19.040 - Environmental testing
31.190 - Electronic component assemblies
Keywords Environmental testing; Test Td; Soldering heat; Surface mounting device
Note Corrigendum to EN issued December 2004
A-Deviation(s)  
Special National Condition(s)  

Environment

Clause
Categories - Aspects
Product Life Cycle
Information

History

Stage
Date
Deadline Date
Documents
6060 2004-10-01 2005-06-01 export to doc file  EN
5099 2004-09-01 2004-12-01  
5061 2004-06-28 2004-09-01  
5020 2004-03-19 2004-05-21  
4099 2003-06-13 2003-06-20  
4020 2002-08-02 2003-01-10  
3099 2002-07-30 2002-08-02  

Implementation Dates

date of Ratification (DOR) (1) 2004-09-01
date of Availability (DAV) (2) 2004-10-01
date of Announcement (DOA) (3) 2004-12-01
date of Publication (DOP) (4) 2005-06-01
date of Withdrawal (DOW) (5) 2007-09-01

Relations

Supersedes EN 60068-2-58:1999
Superseded by FprEN 60068-2-58:2013
Normative reference (6) EN 60068-1:1994
HD 323.2.20 S3:1988
IEC 60194:1999
EN 60749-20:2003
EN 61190-1-1:2002
EN 61190-1-2:2002
EN 61190-1-3:2002
EN 61191-2:1998
EN 61249-2-7:2002
corr. September 2005
EN 61760-1:1998

(1) Date of ratification (dor) date when the Technical Board notes the approval of an EN (and HD for CENELEC), from which time the standard may be said to be approved


(2) Date of availability (dav) date when the definitive text in the official language versions of an approved CEN/CENELEC publication is distributed by the Central Secretariat


(3) Date of announcement (doa) latest date by which the existence of an EN (and HD for CENELEC), a TS or a CWA has to be announced at national level


(4) Date of publication (dop) latest date by which an EN has to be implemented at national level by publication of an identical national standard or by endorsement


(5) Date of withdrawal (dow) latest date by which national standards conflicting with an EN (and HD for CENELEC) have to be withdrawn


(6) This list of normative references is purely indicative. The only official list of normative reference is the list of the published standard.