International Standards and Conformity Assessment for all electrical, electronic and related technologies



Reference EN 60068-2-69:2007
Title Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
Project Number 17045
Abstract/Scope IEC 60068-2-69:2007 outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively the solderability of terminations on surface mounting devices. IEC 60068-2-54 is also available for surface mounting devices and should be consulted if applicable. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method and are both applicable to components with metallic terminations and metallized solder pads. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This second edition cancels and replaces the first edition published in 1995 and constitutes a technical revision. The main changes from the previous edition are as follows: - Inclusion of lead-free alloy test conditions; - Inclusion of new fluxes for testing, reflecting development of fluxes that have happened in the industry in the past 20 years; - Inclusion of new component types, and updating test parameters for the whole component list.


Current Stage code 6060
Current Stage code date 2007-06-22
Current Stage code deadline 2008-03-01
Deadline date for vote  


Order Voucher  


IEC Technical Body IEC/TC 91
Reference Document IEC 60068-2-69:2007 (EQV)
ICS 19.040 - Environmental testing
31.190 - Electronic component assemblies
Keywords Environmental testing; Test Te; Solderability; Wetting balance method
Special National Condition(s)  


Categories - Aspects
Product Life Cycle


Deadline Date
6060 2007-06-22 2008-03-01 export to doc file  EN  FR  DE
5099 2007-06-01 2007-08-01  
5060 2007-04-10 2007-04-24 export to doc file  EN
5020 2007-02-02 2007-04-06  
4099 2006-08-25 2006-09-29  
4091 2006-05-12 2006-05-31  
4020 2005-09-23 2006-02-24  
3099 2005-09-20 2005-09-23  

Implementation Dates

date of Ratification (DOR) (1) 2007-06-01
date of Availability (DAV) (2) 2007-06-22
date of Announcement (DOA) (3) 2007-09-01
date of Publication (DOP) (4) 2008-03-01
date of Withdrawal (DOW) (5) 2010-06-01


Supersedes EN 60068-2-69:1996
Superseded by  
Normative reference (6) ISO 683-1:1987
ISO 6362-1:1986
EN 60068-1:1994
HD 323.2.20 S3:1988
EN 60068-2-54:2006
EN 61190-1-3:2002

(1) Date of ratification (dor) date when the Technical Board notes the approval of an EN (and HD for CENELEC), from which time the standard may be said to be approved

(2) Date of availability (dav) date when the definitive text in the official language versions of an approved CEN/CENELEC publication is distributed by the Central Secretariat

(3) Date of announcement (doa) latest date by which the existence of an EN (and HD for CENELEC), a TS or a CWA has to be announced at national level

(4) Date of publication (dop) latest date by which an EN has to be implemented at national level by publication of an identical national standard or by endorsement

(5) Date of withdrawal (dow) latest date by which national standards conflicting with an EN (and HD for CENELEC) have to be withdrawn

(6) This list of normative references is purely indicative. The only official list of normative reference is the list of the published standard.