CENELEC
Project
| Reference | EN 60749-34:2010 |
|---|---|
| Title | Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling |
| Project Number | 22649 |
| Abstract/Scope | IEC 60749-34:2010 describes a test method used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors. This happens when low-voltage operating biases for forward conduction (load currents) are periodically applied and removed, causing rapid changes of temperature. The power cycling test is intended to simulate typical applications in power electronics and is complementary to high temperature operating life (see IEC 60749-23). Exposure to this test may not induce the same failure mechanisms as exposure to air-to-air temperature cycling, or to rapid change of temperature using the two-fluid-baths method. This test causes wear-out and is considered destructive. This second edition cancels and replaces the first edition published in 2004 and constitutes a technical revision. The significant changes with respect from the previous edition include: - the specification of tighter conditions for more accelerated power cycling in the wire bond fatigue mode; - information that under harsh power cycling conditions high current densities in a thin die metalization might initiate electromigration effects close to wire bonds. |
| Status |
Published
|
Status
| Current Stage code | 6060 |
|---|---|
| Current Stage code date | 2010-12-10 |
| Current Stage code deadline | 2011-09-01 |
| Deadline date for vote |
Legal
| Directive(s) | |
|---|---|
| Mandate(s) | |
| Order Voucher |
Details
| IEC Technical Body | IEC/TC 47 |
|---|---|
| Reference Document | IEC 60749-34:2010 (EQV) |
| ICS | 31.080.01 - Semiconductor devices in general |
| Keywords | Semiconductor; Mechanical; Climatic; Test method; Power cycling |
| Note | Supersedes EN 60749-34:2004 |
| A-Deviation(s) | |
| Special National Condition(s) |
Environment
|
Clause
|
Categories - Aspects
|
Product Life Cycle
|
Information
|
|---|
History
Implementation Dates
| date of Ratification (DOR) (1) | 2010-12-01 |
|---|---|
| date of Availability (DAV) (2) | 2010-12-10 |
| date of Announcement (DOA) (3) | 2011-03-01 |
| date of Publication (DOP) (4) | 2011-09-01 |
| date of Withdrawal (DOW) (5) | 2013-12-01 |
Relations
| Supersedes | EN 60749-34:2004 |
|---|---|
| Superseded by | |
| Normative reference (6) | IEC 60747-1 IEC 60747-2 IEC 60747-6 EN 60749-3:2002 EN 60749-23:2004 |
(1) Date of ratification (dor) date when the Technical Board notes the approval of an EN (and HD for CENELEC), from which time the standard may be said to be approved
(2) Date of availability (dav) date when the definitive text in the official language versions of an approved CEN/CENELEC publication is distributed by the Central Secretariat
(3) Date of announcement (doa) latest date by which the existence of an EN (and HD for CENELEC), a TS or a CWA has to be announced at national level
(4) Date of publication (dop) latest date by which an EN has to be implemented at national level by publication of an identical national standard or by endorsement
(5) Date of withdrawal (dow) latest date by which national standards conflicting with an EN (and HD for CENELEC) have to be withdrawn
(6) This list of normative references is purely indicative. The only official list of normative reference is the list of the published standard.
