International Standards and Conformity Assessment for all electrical, electronic and related technologies

 

Project

Reference EN 62137-1-4:2009
Title Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
Project Number 21587
Abstract/Scope The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate. This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate.
Status
Published

Status

Current Stage code 6060
Current Stage code date 2009-02-20
Current Stage code deadline 2009-11-01
Deadline date for vote  

Legal

Directive(s)  
Mandate(s)  
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Details

IEC Technical Body IEC/TC 91
Reference Document IEC 62137-1-4:2009 (EQV)
ICS 31.190 - Electronic component assemblies
Keywords Surface mounting; Environment; Endurance; Solder joint; Cyclic bending test
Note  
A-Deviation(s)  
Special National Condition(s)  

Environment

Clause
Categories - Aspects
Product Life Cycle
Information

History

Stage
Date
Deadline Date
Documents
6060 2009-02-20 2009-11-01 export to doc file  EN  FR  DE
5099 2009-02-01 2009-04-01  
5060 2008-11-26 2008-12-10 export to doc file  EN
5020 2008-09-19 2008-11-21  
3090 2008-07-04 2008-09-30  
5060 2008-04-28 2008-05-12 export to doc file  EN
5020 2007-11-23 2008-04-25  
1090 2007-11-20 2007-11-23  

Implementation Dates

date of Ratification (DOR) (1) 2009-02-01
date of Availability (DAV) (2) 2009-02-20
date of Announcement (DOA) (3) 2009-05-01
date of Publication (DOP) (4) 2009-11-01
date of Withdrawal (DOW) (5) 2012-02-01

Relations

Supersedes  
Superseded by  
Normative reference (6) EN 60068-1:1994
EN 60194:2006
EN 61188-5-1:2002
EN 61190-1-2:2007
EN 61190-1-3:2007
EN 61249-2-7:2002
corr. September 2005
EN 61760-1:2006

(1) Date of ratification (dor) date when the Technical Board notes the approval of an EN (and HD for CENELEC), from which time the standard may be said to be approved


(2) Date of availability (dav) date when the definitive text in the official language versions of an approved CEN/CENELEC publication is distributed by the Central Secretariat


(3) Date of announcement (doa) latest date by which the existence of an EN (and HD for CENELEC), a TS or a CWA has to be announced at national level


(4) Date of publication (dop) latest date by which an EN has to be implemented at national level by publication of an identical national standard or by endorsement


(5) Date of withdrawal (dow) latest date by which national standards conflicting with an EN (and HD for CENELEC) have to be withdrawn


(6) This list of normative references is purely indicative. The only official list of normative reference is the list of the published standard.