CENELEC
Project
| Reference | EN 60749-20-1:2009 |
|---|---|
| Title | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat |
| Project Number | 21364 |
| Abstract/Scope | IEC 60749-20-1:2009 applies to all non-hermetic SMD packages which are subjected to reflow solder processes and which are exposed to the ambient air. The purpose of this document is to provide SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMDs which have been classified to the levels defined in IEC 60749-20. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved, with the dry packing process, providing a minimum shelf life capability in sealed dry-bags from the seal date. |
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Published
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Status
| Current Stage code | 6060 |
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| Current Stage code date | 2009-06-05 |
| Current Stage code deadline | 2010-02-01 |
| Deadline date for vote |
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Details
| IEC Technical Body | IEC/TC 47 |
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| Reference Document | IEC 60749-20-1:2009 (EQV) |
| ICS | 31.080.01 - Semiconductor devices in general |
| Keywords | Semiconductor; Handling, Surface mount device; Moisture; Soldering heat |
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History
Implementation Dates
| date of Ratification (DOR) (1) | 2009-05-01 |
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| date of Availability (DAV) (2) | 2009-06-05 |
| date of Announcement (DOA) (3) | 2009-08-01 |
| date of Publication (DOP) (4) | 2010-02-01 |
| date of Withdrawal (DOW) (5) | 2012-05-01 |
Relations
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| Superseded by | |
| Normative reference (6) |
EN 60749-20:2009
EN 60749-30:2005 |
(1) Date of ratification (dor) date when the Technical Board notes the approval of an EN (and HD for CENELEC), from which time the standard may be said to be approved
(2) Date of availability (dav) date when the definitive text in the official language versions of an approved CEN/CENELEC publication is distributed by the Central Secretariat
(3) Date of announcement (doa) latest date by which the existence of an EN (and HD for CENELEC), a TS or a CWA has to be announced at national level
(4) Date of publication (dop) latest date by which an EN has to be implemented at national level by publication of an identical national standard or by endorsement
(5) Date of withdrawal (dow) latest date by which national standards conflicting with an EN (and HD for CENELEC) have to be withdrawn
(6) This list of normative references is purely indicative. The only official list of normative reference is the list of the published standard.
